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1. 外观设计

USD856554S1 Rear combination lamp for an automobile 有权
公开(公告)号：USD856554S1
公开(公告)日：2019-08-13
申请号：US29638809
申请日：2018-03-01
申请人： Chung Woo Lee , Ian Richard Cartabiano , Tatsuya Kobayashi
设计人： Chung Woo Lee , Ian Richard Cartabiano , Tatsuya Kobayashi

2. 外观设计

USD840875S1 Motor vehicle and/or toy replica thereof 有权
公开(公告)号：USD840875S1
公开(公告)日：2019-02-19
申请号：US29638825
申请日：2018-03-01
申请人： Chung Woo Lee , Ian Richard Cartabiano , Takeo Sowa , Kouji Katsuno
设计人： Chung Woo Lee , Ian Richard Cartabiano , Takeo Sowa , Kouji Katsuno

3. 发明授权

US09333867B2 Charging stand for electric vehicle 有权
标题翻译：电动车充电台
公开(公告)号：US09333867B2
公开(公告)日：2016-05-10
申请号：US13193535
申请日：2011-07-28
申请人： Chung Woo Lee
发明人： Chung Woo Lee
IPC分类号： H02J7/00 , G08B13/08 , B60L11/18 , B60L3/12
CPC分类号： B60L11/1816 , B60L3/12 , B60L11/1825 , B60L2230/16 , B60L2250/10 , B60L2270/32 , B60L2270/34 , Y02T10/7005 , Y02T10/7088 , Y02T90/121 , Y02T90/128 , Y02T90/14 , Y02T90/163
摘要： Disclosed is a charging stand for an electric vehicle, the charging stand including a main body, a door coupled to the main body in such a way as to be opened or closed, and an alarm device generating an alarm if the door is opened, wherein the alarm device has a door sensing unit causing a change in impedance if the door is opened, a controller receiving a signal transmitted from the door sensing unit, and a switching circuit activated by the controller to generate an alarm or store an alarm history, so that the charging stand is advantageous in that the opening of the door can be precisely detected, and the alarm history can be checked later.
摘要翻译：公开了一种电动车辆的充电座，充电架包括主体，以打开或关闭方式联接到主体的门以及如果门打开则产生报警的报警装置，其中，报警装置具有门检测单元，如果门打开则导致阻抗变化，控制器接收从门感测单元发送的信号，以及由控制器激活的切换电路以产生报警或存储报警历史，因此充电台的优点在于可以精确地检测门的打开，并且可以稍后检查报警历史。

4. 发明申请

US20120081208A1 APPARATUS FOR OPERATING DOOR OF CONNECTOR CONNECTION PART IN EV CHARGING STAND 审中-公开
标题翻译：电动充电座中连接器连接部门的操作装置
公开(公告)号：US20120081208A1
公开(公告)日：2012-04-05
申请号：US13239276
申请日：2011-09-21
申请人： Chung Woo LEE
发明人： Chung Woo LEE
IPC分类号： G08B29/00
CPC分类号： B60L3/00 , B60L53/14 , B60L53/65 , B60L2270/32 , B60L2270/36 , Y02T10/7005 , Y02T10/7072 , Y02T90/121 , Y02T90/128 , Y02T90/14 , Y02T90/163 , Y02T90/169 , Y04S30/14
摘要： Disclosed is an apparatus for operating a door of a connector connection part in an EV charging stand, which is configured to control an operation of opening or closing the door of the connector connection part of the EV charging stand to which a connector of an electric vehicle is connected for a charging operation, using ID information of an EV user, and which is advantageous in that the connector connection part of the EV charging stand is prevented from being randomly opened when the electric vehicle is not charged, thus preventing an electric shock accident or damage to the connection part, and an unauthorized user is prevented from using the EV charging stand, thus effectively preventing the electric vehicle from being stolen.
摘要翻译：公开了一种用于操作EV充电座中的连接器连接部分的门的装置，其被配置为控制打开或关闭电动充电台的连接器连接部分的门的操作，电动车辆的连接器连接用于充电操作，使用EV用户的ID信息，并且其优点在于，当电动车辆未被充电时，防止EV充电座的连接器连接部被随机地打开，从而防止电击事故或损坏连接部件，并且防止未经授权的用户使用EV充电台，从而有效地防止电动车辆被盗。

5. 发明申请

US20110267727A1 APPARATUS FOR MONITORING FAULT CURRENT IN POWER SYSTEM 审中-公开
标题翻译：监控电力系统故障电流的装置
公开(公告)号：US20110267727A1
公开(公告)日：2011-11-03
申请号：US13091030
申请日：2011-04-20
申请人： Chung Woo LEE
发明人： Chung Woo LEE
IPC分类号： H02H3/26
CPC分类号： G01R19/16547 , G01R19/10 , G01R19/16571
摘要： Disclosed is an apparatus for monitoring a fault current in a power system. The apparatus does not rectify an AC signal detected from a power system but full wave-rectifies the AC signal using a bridge diode and then monitors a fault current. Particularly, current and voltage in the power system are respectively detected through a current transformer and a Rogowski coil, and presence of occurrence of an accident is parallely monitored using the detected current and voltage. Thus, it is possible to prevent a response delay due to a rising time generated when the AC signal is smoothed to a DC signal through a capacitor and to prevent malfunction caused by chattering while performing a fast response at the time when a fault current is generated for the first time.
摘要翻译：公开了一种用于监视电力系统中的故障电流的装置。该装置不会纠正从电力系统检测到的交流信号，而是使用桥二极管对AC信号进行全波整流，然后监视故障电流。特别地，电力系统中的电流和电压分别通过电流互感器和罗戈夫斯基线圈检测，并且使用检测到的电流和电压平行地监视事故的发生。因此，可以防止当通过电容器将AC信号平滑到DC信号时产生的上升时间的响应延迟，并且在产生故障电流时执行快速响应时防止由抖动引起的故障首次。

6. 发明授权

US07547977B2 Semiconductor chip having bond pads 有权
标题翻译：具有接合垫的半导体芯片
公开(公告)号：US07547977B2
公开(公告)日：2009-06-16
申请号：US11616850
申请日：2006-12-27
申请人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
发明人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
IPC分类号： H01L23/52 , H01L23/50 , H01L23/495 , H01L23/525 , H01L25/065
CPC分类号： H01L24/05 , H01L23/3128 , H01L23/4951 , H01L23/49575 , H01L23/525 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05116 , H01L2224/05118 , H01L2224/05155 , H01L2224/0516 , H01L2224/05554 , H01L2224/05556 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05669 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/4826 , H01L2224/48463 , H01L2224/48471 , H01L2224/49113 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/10161 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region adjacent to each other; a bond pad-wiring pattern formed on at least a part of the peripheral region of the semiconductor substrate; a passivation layer formed on the bond pad-wiring pattern and exposed portions of the semiconductor substrate; a pad-rearrangement pattern disposed over the passivation layer and electrically connected to the bond pad-wiring pattern; and an insulating layer formed over the pad-rearrangement pattern. The insulating layer has an opening therein that exposes a portion of the pad-rearrangement pattern to define a bond pad. The bond pad is disposed over at least a part of the cell region.
摘要翻译：在一个实施例中，半导体芯片具有一个或多个外围接合焊盘。半导体芯片包括具有彼此相邻的单元区域和外围电路区域的半导体衬底; 形成在半导体衬底的周边区域的至少一部分上的接合焊盘布线图案; 形成在所述接合焊盘布线图案上的钝化层和所述半导体基板的暴露部分; 衬垫重排图案，设置在钝化层上并电连接到接合焊盘布线图案; 以及形成在垫重排图案上的绝缘层。绝缘层在其中具有露出焊盘重排图案的一部分以限定接合焊盘的开口。接合焊盘设置在电池区域的至少一部分上。

7. 发明申请

US20070108633A1 SEMICONDUCTOR CHIP HAVING BOND PADS 有权
标题翻译：具有粘结垫的半导体芯片
公开(公告)号：US20070108633A1
公开(公告)日：2007-05-17
申请号：US11616857
申请日：2006-12-27
申请人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
发明人： Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/06 , H01L23/3128 , H01L23/4951 , H01L23/49575 , H01L23/525 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/02166 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05116 , H01L2224/05118 , H01L2224/05155 , H01L2224/0516 , H01L2224/05554 , H01L2224/05556 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05669 , H01L2224/32145 , H01L2224/32245 , H01L2224/48 , H01L2224/48091 , H01L2224/48095 , H01L2224/48235 , H01L2224/48247 , H01L2224/4826 , H01L2224/48463 , H01L2224/48471 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/45099
摘要： A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
摘要翻译：半导体芯片包括具有形成在单元区域和彼此相邻的外围电路区域的集成电路的半导体基板。在半导体衬底上形成接合焊盘布线图形。焊盘重排图案电连接到接合焊盘布线图案。垫重排图案包括设置在单元区域的至少一部分上的接合焊盘。因此，利用本发明的实施例，由此可以大大减小总体芯片尺寸，并且可以制造MCP而没有上述问题。

8. 发明申请

US20070057383A1 SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE 有权
标题翻译：具有粘结垫和多芯片封装的半导体芯片
公开(公告)号：US20070057383A1
公开(公告)日：2007-03-15
申请号：US11556153
申请日：2006-11-02
申请人： Young-Hee SONG , Il-Heung CHOI , Jeong-Jin KIM , Hae-Jeong SOHN , Chung-Woo LEE
发明人： Young-Hee SONG , Il-Heung CHOI , Jeong-Jin KIM , Hae-Jeong SOHN , Chung-Woo LEE
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L23/3128 , H01L23/4951 , H01L23/49575 , H01L23/525 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0231 , H01L2224/0401 , H01L2224/04042 , H01L2224/05082 , H01L2224/05116 , H01L2224/05118 , H01L2224/05155 , H01L2224/0516 , H01L2224/05554 , H01L2224/05556 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05669 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/4826 , H01L2224/48463 , H01L2224/48471 , H01L2224/49113 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06555 , H01L2225/06558 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/10161 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.
摘要翻译：半导体芯片包括具有形成在单元区域和彼此相邻的外围电路区域的集成电路的半导体基板。在半导体衬底上形成接合焊盘布线图形。焊盘重排图案电连接到接合焊盘布线图案。垫重排图案包括设置在单元区域的至少一部分上的接合焊盘。接合焊盘布线图形基本上形成在半导体衬底的中心区域中。因此，利用本发明的实施例，由此可以大大减小总体芯片尺寸，并且可以制造MCP而没有上述问题。

9. 外观设计

USD842176S1 Front bumper for an automobile 有权
公开(公告)号：USD842176S1
公开(公告)日：2019-03-05
申请号：US29638820
申请日：2018-03-01
申请人： Chung Woo Lee , Ian Richard Cartabiano , Naohiko Suzuki , Takeshi Ogawa
设计人： Chung Woo Lee , Ian Richard Cartabiano , Naohiko Suzuki , Takeshi Ogawa

10. 外观设计

USD840566S1 Front combination lamp for an automobile 有权
公开(公告)号：USD840566S1
公开(公告)日：2019-02-12
申请号：US29626111
申请日：2017-11-15
申请人： Chung Woo Lee
设计人： Chung Woo Lee

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