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41. 发明申请

US20120060200A1 METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR FACILITATING COMMUNICATION IN AN INTEROPERABILITY NETWORK 有权
公开(公告)号：US20120060200A1
公开(公告)日：2012-03-08
申请号：US13293070
申请日：2011-11-09
申请人： Alexander Lerner , Michael K. Dewey
发明人： Alexander Lerner , Michael K. Dewey
IPC分类号： G06F21/00
CPC分类号： H04L63/20 , G06F9/546 , G06F21/6236 , H04L63/102 , H04L67/327
摘要： Methods and apparatus are described for facilitating communication among a plurality of entities via an interoperability network. Each entity has policy data corresponding thereto governing interaction with the entity via the interoperability network. A message is transmitted from a first one of the entities to a second one of the entities. The first entity has first policy data corresponding thereto and the second entity has second policy data corresponding thereto. The transmitted message was handled in the network according to combined policy data representing a combination of the first and second policy data.

42. 发明授权

US07980255B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US07980255B2
公开(公告)日：2011-07-19
申请号：US11846400
申请日：2007-08-28
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B3/04
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没液体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

43. 发明授权

US07933009B2 Method and apparatus for verifying proper substrate positioning 有权
标题翻译：用于验证适当的基板定位的方法和装置
公开(公告)号：US07933009B2
公开(公告)日：2011-04-26
申请号：US11829748
申请日：2007-07-27
申请人： Oleg Serebryanov , Alexander Lerner , Aaron Hunter , Joseph M. Ranish
发明人： Oleg Serebryanov , Alexander Lerner , Aaron Hunter , Joseph M. Ranish
IPC分类号： G01J1/00 , G01B11/14
CPC分类号： H01L21/681 , H01L21/67259
摘要： Embodiments of methods and apparatus for detecting the proper position of a substrate in a chamber are provided herein. In some embodiments, a substrate position detection apparatus includes a substrate support having a plurality of lift pins for supporting a substrate in an elevated position thereover; a light source for directing a beam of light upon a reflective upper surface of the substrate; and a light sensor for detecting a reflected beam of light from the upper surface of the substrate upon the substrate being aligned in a predetermined elevated position.
摘要翻译：本文提供了用于检测腔室中基底的适当位置的方法和装置的实施例。在一些实施例中，基板位置检测装置包括具有多个提升销的基板支撑件，用于将基板支撑在其上的升高位置; 用于将光束引导到所述基板的反射上表面上的光源; 以及光传感器，用于在基板在预定的升高位置对准时检测来自基板的上表面的反射光束。

44. 发明申请

US20100006124A1 SINGLE WAFER DRYER AND DRYING METHODS 审中-公开
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20100006124A1
公开(公告)日：2010-01-14
申请号：US12345605
申请日：2008-12-29
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Hoaquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Hoaquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B5/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

45. 发明申请

US20090306665A1 System and Method for Locating of Distal Holes of an Intramedullary Nail 失效
标题翻译：髓内钉远端定位系统及方法
公开(公告)号：US20090306665A1
公开(公告)日：2009-12-10
申请号：US12308877
申请日：2007-07-01
申请人： Alexander Lerner , Alexander Nassonov , Lev Diamant
发明人： Alexander Lerner , Alexander Nassonov , Lev Diamant
IPC分类号： A61B17/58
CPC分类号： A61B17/1703 , A61B17/1725 , A61B90/36 , A61B90/361 , A61B90/39 , A61B2090/373
摘要： Systems and methods for use with a hollow intramedullary nail having a proximal end, a distal end and at least one distal hole formed in the nail's wall adjacent said distal end and having a hole axis, for detecting a location of said distal hole when the nail is implanted into a intramedullary canal of a bone. The system includes a jig adapted for being mounted on said bone so as to constitute a bridge between the proximal end of said nail and a distal end of said bone, and having a positioning head with a guiding axis oriented generally perpendicular to the nail longitudinal axis, adapted for receiving therein at least a drill bit so that the drill bit's axis is aligned with said guiding axis, the positioning head being movable to bring said guiding axis into different spatial positions with respect to said hole axis. The system may further include at least one of the following: a disposable member insertable into said nail and having a nail light source for emitting light along said distal hole axis so as to create an illuminated spot on an outer surface of said bone, said nail light source is of a kind providing collimated light and, said member further includes means for positioning an axis of a collimated beam created by said light along said hole axis; viewing optics mountable in said positioning head along said guiding axis for viewing said illuminated spot; an alignment pin having a pin proximal end, a pin distal end, and a pin axis, and being adapted for mounting in said positioning head so that said pin axis is aligned with said guiding axis and so that the pin distal end faces towards the bone, where the pin further includes reference marks on its outer surface, visible in X-ray images.
摘要翻译：用于中空髓内钉的系统和方法，其具有邻近所述远端形成在钉壁上的近端，远端和至少一个远端孔，并且具有孔轴线，用于在钉子处检测所述远端孔的位置被植入骨髓内管。所述系统包括适于安装在所述骨上的夹具，以便构成所述钉的近端和所述骨的远端之间的桥，并且具有定位头，所述定位头具有大致垂直于所述指甲纵向轴线定向的引导轴线，其适于在其中容纳至少一个钻头，使得钻头的轴线与所述引导轴线对齐，所述定位头部可移动以使所述引导轴线相对于所述孔轴线进入不同的空间位置。该系统还可以包括以下中的至少一个：一次性构件，其可插入到所述钉中并具有用于沿着所述远端轴线发射光的指甲光源，以在所述骨的外表面上产生照明斑点，所述指甲光源是提供准直光的一种，并且所述部件还包括用于沿着所述孔轴定位由所述光产生的准直光束的轴线的装置; 观察光学装置，其可沿着所述引导轴安装在所述定位头中，用于观察所述照明光斑; 具有销近端，销远端和销轴线的对准销，并且适于安装在所述定位头中，使得所述销轴线与所述引导轴线对准，并且使得销的远端朝向骨头，其中销在其外表面上还包括参考标记，在X射线图像中可见。

46. 发明申请

US20090027657A1 METHOD AND APPARATUS FOR VERIFYING PROPER SUBSTRATE POSITIONING 有权
标题翻译：用于验证适当的基板定位的方法和装置
公开(公告)号：US20090027657A1
公开(公告)日：2009-01-29
申请号：US11829748
申请日：2007-07-27
申请人： OLEG SEREBRYANOV , Alexander Lerner , Aaron Hunter , Joseph M. Ranish
发明人： OLEG SEREBRYANOV , Alexander Lerner , Aaron Hunter , Joseph M. Ranish
IPC分类号： G01N21/00 , G01N21/55
CPC分类号： H01L21/681 , H01L21/67259
摘要： Embodiments of methods and apparatus for detecting the proper position of a substrate in a chamber are provided herein. In some embodiments, a substrate position detection apparatus includes a substrate support having a plurality of lift pins for supporting a substrate in an elevated position thereover; a light source for directing a beam of light upon a reflective upper surface of the substrate; and a light sensor for detecting a reflected beam of light from the upper surface of the substrate upon the substrate being aligned in a predetermined elevated position.
摘要翻译：本文提供了用于检测腔室中基底的适当位置的方法和装置的实施例。在一些实施例中，基板位置检测装置包括具有多个提升销的基板支撑件，用于将基板支撑在其上的升高位置; 用于将光束引导到所述基板的反射上表面上的光源; 以及光传感器，用于在基板在预定的升高位置对准时检测来自基板的上表面的反射光束。

47. 发明申请

US20050241684A1 Single wafer dryer and drying methods 审中-公开
公开(公告)号：US20050241684A1
公开(公告)日：2005-11-03
申请号：US11179926
申请日：2005-07-12
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： H01L21/304 , H01L21/00 , B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

48. 发明授权

US06955516B2 Single wafer dryer and drying methods 有权
标题翻译：单片干燥机和干燥方法
公开(公告)号：US06955516B2
公开(公告)日：2005-10-18
申请号：US10286404
申请日：2002-11-01
申请人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris T. Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavliev , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： H01L21/304 , H01L21/00 , B65G1/133
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

49. 发明授权

US06728989B2 Labyrinth seal for bearing in brush mounting assembly for semiconductor wafer scrubber 有权
标题翻译：用于半导体晶片洗涤器的刷子安装组件中的轴承用迷宫式密封件
公开(公告)号：US06728989B2
公开(公告)日：2004-05-04
申请号：US09771086
申请日：2001-01-27
申请人： Alexander Lerner , John M. White , Shou-Sang Chang , Michael Sugarman
发明人： Alexander Lerner , John M. White , Shou-Sang Chang , Michael Sugarman
IPC分类号： A46B1304
CPC分类号： H01L21/67046 , B08B1/04 , B08B3/04
摘要： A wafer scrubbing unit includes a mounting assembly for a scrubber brush. The mounting assembly has a rotary flow through tube through which cleaning liquid is delivered to the brush. A stationary tube may be mounted in the bore of the rotary tube. Spinning shields mounted on the rotary tube form labyrinth seals to protect a bearing housing from the cleaning liquid. Bearings for rotatably mounting the rotary tube are mounted within the housing.
摘要翻译：晶片洗涤单元包括用于洗涤刷的安装组件。安装组件具有旋转流通管，清洁液通过管被输送到刷子。固定管可以安装在旋转管的孔中。安装在旋转管上的旋转屏蔽形成迷宫式密封，以保护轴承壳体免受清洁液体的影响。用于可旋转地安装旋转管的轴承安装在壳体内。

50. 发明授权

US09165832B1 Method of die singulation using laser ablation and induction of internal defects with a laser 有权
标题翻译：使用激光烧蚀和激光诱导内部缺陷的芯片切割方法
公开(公告)号：US09165832B1
公开(公告)日：2015-10-20
申请号：US14320419
申请日：2014-06-30
申请人： James S. Papanu , Wei-Sheng Lei , Jungrae Park , Alexander Lerner , Brad Eaton , Ajay Kumar
发明人： James S. Papanu , Wei-Sheng Lei , Jungrae Park , Alexander Lerner , Brad Eaton , Ajay Kumar
IPC分类号： H01L21/00 , H01L21/78 , H01L21/304 , H01L21/268 , H01L21/683
CPC分类号： H01L21/78 , H01L21/268 , H01L21/31105 , H01L21/32131 , H01L21/67207 , H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2223/54426 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： A method and system of hybrid laser dicing are described. In one embodiment, a method includes focusing a laser beam inside a substrate in regions between integrated circuits, inducing defects inside the substrate in the regions. The method involves patterning a surface of the substrate with a laser scribing process in the regions after inducing the defects in the substrate. The method further involves singulating the integrated circuits at the regions with the induced defects. In another embodiment, a system includes a first laser module configured to focus a laser beam inside a substrate in regions between integrated circuits, inducing defects inside the substrate in the regions. A second laser module is configured to pattern a surface of the substrate with a laser scribing process in the regions after inducing the defects. A tape extender is configured to stretch tape over which the substrate is mounted, singulating the integrated circuits.
摘要翻译：描述了混合激光切割的方法和系统。在一个实施例中，一种方法包括在集成电路之间的区域内将激光束聚焦在衬底内，在区域内的衬底内引起缺陷。该方法包括在引发衬底中的缺陷之后在区域中用激光划线工艺对衬底的表面进行图案化。该方法还涉及在具有诱导缺陷的区域处分离集成电路。在另一个实施例中，系统包括第一激光模块，其被配置为将集束电路之间的区域内的激光束聚焦在衬底内，从而在该区域内的衬底内引起缺陷。第二激光模块被配置为在引发缺陷之后在区域中用激光划线工艺对基板的表面进行图案化。磁带扩展器被配置为拉伸安装基板的带，分离集成电路。

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