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41. 发明授权

US5248630A Thin film silicon semiconductor device and process for producing thereof 失效
标题翻译：薄膜硅半导体器件及其制造方法
公开(公告)号：US5248630A
公开(公告)日：1993-09-28
申请号：US857944
申请日：1992-03-26
申请人： Tadashi Serikawa , Seiichi Shirai , Akio Okamoto , Shirou Suyama
发明人： Tadashi Serikawa , Seiichi Shirai , Akio Okamoto , Shirou Suyama
IPC分类号： H01L21/205 , H01L21/321 , H01L29/04 , H01L29/786
CPC分类号： H01L29/04 , H01L21/02422 , H01L21/02488 , H01L21/02532 , H01L21/0262 , H01L21/02631 , H01L21/321 , H01L29/78675 , Y10S438/909
摘要： A thin film silicon semiconductor device provided on a substrate according to the present invention comprises a thin polycrystalline silicon film having a lattice constant smaller than that of a silicon single crystal and a small crystal grain size. This thin polycrystalline silicon film can be obtained by depositing a thin amorphous silicon film in an inert gas having a pressure of 3.5 Pa or lower by a sputtering deposition method and annealing the thin amorphous silicon film for a short time of 10 seconds or less to effect polycrystallization thereof. A thin film silicon semiconductor device comprising such a thin polycrystalline silicon film having a small lattice constant has excellent characteristics including a carrier mobility of 100 cm.sup.2 /V.multidot.s or higher.
摘要翻译：根据本发明的设置在基板上的薄膜硅半导体器件包括晶格常数小于单晶晶格和小晶粒尺寸的薄多晶硅薄膜。该薄多晶硅膜可以通过溅射沉积法将薄的非晶硅膜沉积在具有3.5Pa或更低的压力的惰性气体中并在10秒或更短的时间内退火薄的非晶硅膜来获得，多结晶。包括这种具有小晶格常数的薄多晶硅膜的薄膜硅半导体器件具有包括100cm 2 / Vxs或更高的载流子迁移率的优异特性。

42. 发明授权

US5132754A Thin film silicon semiconductor device and process for producing thereof 失效
标题翻译：薄膜硅半导体器件及其制造方法
公开(公告)号：US5132754A
公开(公告)日：1992-07-21
申请号：US222966
申请日：1988-07-21
申请人： Tadashi Serikawa , Seiichi Shirai , Akio Okamoto , Shirou Suyama
发明人： Tadashi Serikawa , Seiichi Shirai , Akio Okamoto , Shirou Suyama
IPC分类号： H01L21/20 , H01L21/203 , H01L21/205 , H01L21/321 , H01L21/324 , H01L21/84 , H01L27/12 , H01L29/04 , H01L29/78 , H01L29/786
CPC分类号： H01L29/04 , H01L21/02381 , H01L21/02422 , H01L21/02433 , H01L21/0245 , H01L21/02532 , H01L21/02609 , H01L21/0262 , H01L21/321 , H01L29/78675
摘要： A thin film silicon semiconductor device provided on a substrate according to the present invention comprises a thin polycrystalline silicon film having a lattice constant smaller than that of a silicon single crystal and a small crystal grain size. This thin polycrystalline silicon film can be obtained by depositing a thin amorphous silicon film in an inert gas having a pressure of 3.5 Pa or lower by a sputtering deposition method and annealing the thin amorphous silicon film for a short time of 10 seconds or less to effect polycrystallization thereof. A thin film silicon semiconductor device comprising such a thin polycrystalline silicon film having a small lattice constant has excellent characteristics including a carrier mobility of 100 cm.sup.2 /V.multidot.s or higher.

43. 发明授权

US5039476A Method for production of powder metallurgy alloy 失效
标题翻译：粉末冶金合金的生产方法
公开(公告)号：US5039476A
公开(公告)日：1991-08-13
申请号：US554531
申请日：1990-07-19
申请人： Mitsuru Adachi , Akio Okamoto , Hideki Iwai , Yoshiharu Waku
发明人： Mitsuru Adachi , Akio Okamoto , Hideki Iwai , Yoshiharu Waku
IPC分类号： B22F9/04 , C22C1/04 , C22C1/10
CPC分类号： B22F9/04 , C22C1/0416 , C22C1/1084
摘要： A method for the production of a metallic powder molding material is disclosed which comprises a step of imparting mechanical energy due to at least one of such physical actions as vibration, pulverization, attrition, rolling, shocks, agitation, and mixing a metallic particles in a vessel whose interior is held under vacuumized atmosphere or an atmosphere of inert gas thereby enabling the metallic particles to contact each other and acquire improvement in surface quality and a step of hot molding the metallic particles thereby producing a molding material.

44. 发明授权

US08753752B2 Metal plate for heat exchange and method for manufacturing metal plate for heat exchange 有权
标题翻译：用于热交换的金属板和用于制造用于热交换的金属板的方法
公开(公告)号：US08753752B2
公开(公告)日：2014-06-17
申请号：US13377053
申请日：2010-06-01
申请人： Yasuyuki Fujii , Akio Okamoto
发明人： Yasuyuki Fujii , Akio Okamoto
IPC分类号： B21D53/02 , F28F3/04 , F28F13/02 , F28F21/08
CPC分类号： B21D53/02 , B21C37/02 , B21K23/00 , F28F3/048 , F28F13/02 , F28F13/187 , F28F21/08 , Y10T29/4935 , Y10T428/12389
摘要： The present invention provides a metal plate for heat exchange which facilitates nucleate boiling and is extremely excellent in heat conductivity. In the metal plate for heat exchange of the present invention, a recess part 2 having a depth of 5 μm or more and 10% or less of a plate thickness of the metal plate is formed. A crevasse part 7 is formed at least at a bottom corner 6 of the recess part 2. The crevasse part 7 is formed by cutting away the bottom corner 6 of the recess part 2 in the thickness direction. An angle θ formed by one cut-away surface and the other cut-away surface is 90 degrees or less. In addition, the crevasse part 7 is formed by cutting away a crystal grain 9. The recess part 2 is formed on the surface of the metal plate 1 by pressing a working part 14 formed on a surface of a working roll 12 against the surface of the metal plate 1 being carried.
摘要翻译：本发明提供一种用于热交换的金属板，其有利于成核沸腾并且导热性极好。在本发明的热交换用金属板中，形成有金属板的板厚的5μm以上且10％以下的凹部2。至少在凹部2的底角6处形成有裂缝部7。通过在厚度方向上切除凹部2的底角6而形成裂缝部7。角度和角度由一个切割面形成，另一个切割面为90度以下。此外，通过切割晶粒9形成裂缝部分7.通过将形成在工作辊12的表面上的工作部分14压在金属板1的表面上而形成凹部2 所携带的金属板1。

45. 发明授权

US08262378B2 Method for multilayer molding of thermoplastic resins and multilayer molding apparatus 有权
标题翻译：热塑性树脂多层成型方法及多层成型装置
公开(公告)号：US08262378B2
公开(公告)日：2012-09-11
申请号：US12458773
申请日：2009-07-22
申请人： Akio Okamoto , Kazuaki Miyamoto
发明人： Akio Okamoto , Kazuaki Miyamoto
IPC分类号： B29C31/10 , B29C33/40 , B29C44/34 , B29C67/20
CPC分类号： B29C44/0461 , B29C44/086
摘要： A multilayer-molding method includes the steps of mixing at least one thermoplastic resin selected from a plurality of types of thermoplastic resins with a bubble-nucleating agent and a foaming gas, injecting the plurality of types of thermoplastic resins into a mold cavity such that the thermoplastic resins are layered in the mold cavity, and then, after increasing the volume of the mold cavity, foaming the at least one thermoplastic resin mixed with the bubble-nucleating agent and the foaming gas. The multilayer-molding method is characterized in that the foaming gas is supplied at a pressure of 0.1 MPa or more but less than 1.0 MPa to at least one injection-molding machine selected from a plurality of injection-molding machines, and that the thermoplastic resin plasticized in the injection-molding machine is mixed with the foaming gas.
摘要翻译：多层成型方法包括将选自多种热塑性树脂的至少一种热塑性树脂与气泡成核剂和发泡气体混合的步骤，将多种类型的热塑性树脂注入模腔，使得将热塑性树脂层叠在模腔中，然后在增加模腔的体积之后，使与泡沫成核剂和发泡气体混合的至少一种热塑性树脂发泡。多层成型方法的特征在于，将发泡气体以0.1MPa以上且小于1.0MPa的压力供给到从多台注塑机中选择的至少一种注射成型机，热塑性树脂在注射成型机中增塑的发泡气体与发泡气体混合。

46. 发明申请

US20100308500A1 Resin multiplayer injection molding method 有权
标题翻译：树脂多人注射成型法
公开(公告)号：US20100308500A1
公开(公告)日：2010-12-09
申请号：US12311826
申请日：2007-10-12
申请人： Akio Okamoto , Kazuaki Miyamoto
发明人： Akio Okamoto , Kazuaki Miyamoto
IPC分类号： B29C45/16
CPC分类号： B29C45/1635 , B29C45/1679 , B29C45/561 , B29C2045/563
摘要： While a second layer resin is being charged, a movable platen is moved backward to reach a given movable platen position (S1) to enlarge the capacity of a second cavity. After the completion of charging of the resin, a toggle mechanism is promptly driven to reduce the second cavity capacity to reach a given movable platen position (S2), and after the lapse of a given time, the toggle mechanism is driven again to enlarge the second cavity capacity to reach a given movable platen position (S3). Thus, a high quality multilayer injection molded article which has small variations in the wall thickness, dimension, and mass and which is free from deformation or warpage can be stable obtained.
摘要翻译：当第二层树脂被充电时，可移动的压板向后移动以达到给定的可动压板位置（S1），以扩大第二腔的容量。在树脂充电完成之后，迅速地驱动肘节机构以减小第二腔容量以达到给定的可动压板位置（S2），并且在经过给定时间之后，再次驱动肘节机构以使第二腔容量达到给定的可动压板位置（S3）。因此，可以稳定地获得壁厚，尺寸和质量变化小且不变形或翘曲的高质量多层注塑制品。

47. 发明授权

US07018190B2 Resin multilayer molding method and multilayer molding device 失效
标题翻译：树脂多层成型法及多层成型装置
公开(公告)号：US07018190B2
公开(公告)日：2006-03-28
申请号：US10326166
申请日：2002-12-23
申请人： Akio Okamoto , Etsuo Okahara
发明人： Akio Okamoto , Etsuo Okahara
IPC分类号： B29C45/16
CPC分类号： B29C45/56 , B29C45/14 , B29C45/76 , B29C2945/76006 , B29C2945/7604 , B29C2945/76083 , B29C2945/76227 , B29C2945/76257 , B29C2945/76264 , B29C2945/76551 , B29C2945/76702 , B29C2945/76785 , B29C2945/76859 , B29K2995/002
摘要： A resin multilayer molding method in which a skin material having a resin decorating layer on a surface and a core-material resin are integrally molded in a mold, comprising the steps of: presetting a relationship of a glass transition point (Tgs) of the resin decorating layer of the skin material and a supply temperature (Tc) of a molten resin forming a core material to satisfy Tgs Tgs. When a temperature of the resin decorating layer of the skin material reaches a previously estimated and set value (Tsd) so that a temperature Tsc, which temperature of the resin decorating layer reaches by rising again after an air insulating layer is formed, satisfies Tsc≧Tgs on the basis of a correlation between a temperature of the core-material resin during clamping and forming and retaining the air insulating layer and a temperature of the skin material decorating layer, the gap is made between the resin decorating layer of the skin material and the mold cavity surface opposed to the resin decorating layer to form and retain the air insulating layer. By this, remarkably high-quality resin multilayer molded products can be stably supplied at low cost without impairing surface decorating performance.
摘要翻译：一种树脂多层成型方法，其中在表面上具有树脂装饰层的表皮材料和芯材树脂一体地模制在模具中，包括以下步骤：预先设定树脂的玻璃化转变温度（Tgs）表皮材料的装饰层和形成芯材的熔融树脂的供给温度（Tc）以满足Tgs Tgs。当表皮材料的树脂装饰层的温度达到预先估计和设定值（Tsd）时，使得在形成空气绝缘层之后树脂装饰层的温度再次升高的温度Tsc满足Tsc> 基于夹紧和成型期间的芯材树脂的温度与保持空气绝缘层的温度与表皮材料装饰层的温度之间的相关性，Tg是在表皮材料的树脂装饰层之间形成的间隙以及与树脂装饰层相对的模腔表面，以形成并保持空气绝缘层。由此，能够以低成本稳定地供给高品质的树脂多层成型品，而不会损害表面装饰性能。

48. 发明申请

US20050217888A1 Wire harness protector 有权
标题翻译：线束保护器
公开(公告)号：US20050217888A1
公开(公告)日：2005-10-06
申请号：US11095474
申请日：2005-04-01
申请人： Hiroaki Arai , Akio Okamoto
发明人： Hiroaki Arai , Akio Okamoto
IPC分类号： B60R16/02 , H02G1/00 , H02G3/04
CPC分类号： H02G3/0418 , H02G3/0487
摘要： In a wire harness protector comprised of a gutter-like protector main body with a bottom wall and both side walls, for accommodating corrugated tubes 9, into which a wire harness is inserted, in multi tiers in the vertical direction and a cover for covering an opening between upper ends of the both side walls of the protector main body, a wire holding spacer for positioning and holding the corrugate tube located in a lower tier within the protector main body, the wire holding spacer is formed integrally with one side wall of the both side walls of the protector main body through a hinge portion, and at position opposed to the other side wall of the both side walls of the wire holding spacer, a locking portion for engaging/releasing with/from an engaging portion of the other side wall is formed.
摘要翻译：在由具有底壁和两个侧壁的沟槽状保护器主体构成的线束保护器中，用于容纳插入线束的波纹管9在垂直方向上多层，并且覆盖盖在保护器主体的两个侧壁的上端之间开口，用于定位和保持位于保护器主体内的下层中的波纹管的线保持间隔件，线保持间隔件与保护器本体的两个侧壁通过铰链部分和与电线保持间隔件的两个侧壁的另一侧壁相对的位置处，用于与另一侧的接合部分接合/释放的锁定部分墙形成。

49. 发明申请

US20050073075A1 Electro-blowing technology for fabrication of fibrous articles and its applications of hyaluronan 有权
标题翻译：用于制造纤维制品的电喷技术及其在透明质酸中的应用
公开(公告)号：US20050073075A1
公开(公告)日：2005-04-07
申请号：US10674464
申请日：2003-10-01
申请人： Benjamin Chu , Benjamin Hsiao , Dufei Fang , Akio Okamoto
发明人： Benjamin Chu , Benjamin Hsiao , Dufei Fang , Akio Okamoto
IPC分类号： B29C47/00 , D01D20060101 , D01D5/00 , D01D5/08 , D01D5/098 , D01D5/26 , H05B7/00
CPC分类号： D01D5/0069 , D01F9/00
摘要： A method for electroblowing fibers is provided which involves the steps of: forcing a polymer fluid through a spinneret in a first direction towards a collector located a first distance from the spinneret, while simultaneously blowing a gas through an orifice that is substantially concentrically arranged around the spinneret, wherein the gas is blown substantially in the first direction; wherein an electrostatic differential is generated between the spinneret and the collector; and collecting the fibers, and its use in preparing submicron scale fibers of various types, particularly hyaluronan fibers, and the hyaluronan nanofibers thus formed.
摘要翻译：提供了一种用于电纺纤维的方法，其包括以下步骤：将聚合物流体沿着第一方向通过喷丝板朝向位于离喷丝头第一距离的收集器，同时通过基本上同心地布置在喷丝板周围的孔口喷丝头，其中所述气体基本上在所述第一方向上吹送; 其中在所述喷丝头和所述收集器之间产生静电差异; 并收集纤维，以及其在制备各种类型的亚微米级纤维，特别是透明质酸纤维和由此形成的透明质酸纳米纤维中的用途。

50. 发明授权

US06472490B1 Ethylene-aromatic vinyl compound copolymer and method for its production 有权
标题翻译：乙烯 - 芳族乙烯基化合物共聚物及其制备方法
公开(公告)号：US06472490B1
公开(公告)日：2002-10-29
申请号：US09514548
申请日：2000-02-28
申请人： Toru Arai , Akihiko Nakamura , Shigeru Suzuki , Toshiaki Otsu , Akio Okamoto
发明人： Toru Arai , Akihiko Nakamura , Shigeru Suzuki , Toshiaki Otsu , Akio Okamoto
IPC分类号： C08F21204
CPC分类号： C08F210/02 , C08F4/65912 , C08F4/65927 , Y10S526/943 , C08F212/08 , C08F2500/15 , C08F2500/03
摘要： The present invention provides an ethylene-aromatic vinyl compound copolymer having an aromatic vinyl compound content of from 1 to less than 55% by molar fraction, and otherwise defined in the claims, and compositions and molded products containing same.
摘要翻译：本发明提供一种乙烯 - 芳族乙烯基化合物共聚物，其芳族乙烯基化合物含量为1至小于55摩尔％，权利要求书中另有定义，组合物和含有其的成型产品。

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