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31. 发明申请

US20040188833A1 Electronic component of a high frequency current suppression type and bonding wire for the same 失效
标题翻译：高频电流抑制型电子元件及其接合线
公开(公告)号：US20040188833A1
公开(公告)日：2004-09-30
申请号：US10355593
申请日：2003-01-31
发明人： Shigeyoshi Yoshida , Hiroshi Ono , Koji Kamei
IPC分类号： H01L023/34
CPC分类号： H05K1/0233 , H01L23/4952 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/745 , H01L2223/6611 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/131 , H01L2224/432 , H01L2224/43826 , H01L2224/43827 , H01L2224/451 , H01L2224/45117 , H01L2224/45118 , H01L2224/45123 , H01L2224/45124 , H01L2224/45138 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45163 , H01L2224/45166 , H01L2224/45179 , H01L2224/45181 , H01L2224/45188 , H01L2224/4554 , H01L2224/456 , H01L2224/45617 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45666 , H01L2224/45679 , H01L2224/45681 , H01L2224/45686 , H01L2224/45693 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/745 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01072 , H01L2924/01073 , H01L2924/01105 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H03H2001/0092 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/01008 , H01L2924/01009 , H01L2924/049 , H01L2924/053 , H01L2224/45015 , H01L2924/207
摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (nullm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
摘要翻译：为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流终端本身。该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性，小于几十MHz。

32. 发明授权

US09543233B2 Chip package having a dual through hole redistribution layer structure 有权
标题翻译：芯片封装具有双通孔再分布层结构
公开(公告)号：US09543233B2
公开(公告)日：2017-01-10
申请号：US14869602
申请日：2015-09-29
申请人： XINTEC INC.
发明人： Chien-Hung Liu , Ying-Nan Wen , Shih-Yi Lee , Ho-Yin Yiu
IPC分类号： H01L23/48 , H01L23/31 , H01L23/52 , H01L23/00 , H01L23/528 , H01L21/683 , H01L21/768 , H01L21/268 , H01L21/78 , H01L21/304 , H01L21/3105 , H01L21/56
CPC分类号： H01L21/76898 , H01L21/2633 , H01L21/268 , H01L21/304 , H01L21/3105 , H01L21/561 , H01L21/6835 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/481 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/43 , H01L24/45 , H01L2221/68327 , H01L2221/6834 , H01L2224/0231 , H01L2224/02311 , H01L2224/0233 , H01L2224/02371 , H01L2224/02372 , H01L2224/04042 , H01L2224/0557 , H01L2224/05572 , H01L2224/06135 , H01L2224/06182 , H01L2224/13024 , H01L2224/13025 , H01L2224/1411 , H01L2224/14181 , H01L2224/432 , H01L2224/4502 , H01L2224/45144 , H01L2924/01079 , H01L2924/00014
摘要： A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the first surface. The second surface has a first though hole to expose the conductive pad. The laser stopper is located on the conductive pad. The isolation layer is located on the second surface and in the first though hole. The isolation layer has a third surface opposite to the second surface. The isolation layer and the conductive pad have a second though hole together, such that the laser stopper is exposed through the second though hole. The redistribution layer is located on the third surface, the sidewall of the second though hole, and the laser stopper.
摘要翻译：芯片封装包括芯片，激光器停止器，隔离层，再分布层，绝缘层和导电结构。芯片具有导电焊盘，第一表面和与第一表面相对的第二表面。导电垫位于第一表面上。第二表面具有第一通孔以暴露导电垫。激光停止器位于导电垫上。隔离层位于第二表面和第一通孔中。隔离层具有与第二表面相对的第三表面。隔离层和导电垫在一起具有第二通孔，使得激光阻挡件通过第二通孔露出。再分配层位于第三表面，第二通孔的侧壁和激光停止器上。

33. 发明申请

US20160133544A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20160133544A1
公开(公告)日：2016-05-12
申请号：US14869602
申请日：2015-09-29
申请人： XINTEC INC.
发明人： Chien-Hung LIU , Ying-Nan WEN , Shih-Yi LEE , Ho-Yin YIU
IPC分类号： H01L23/48 , H01L23/528 , H01L21/683 , H01L21/768 , H01L23/31 , H01L21/78 , H01L21/304 , H01L21/3105 , H01L21/56 , H01L23/00 , H01L21/268
CPC分类号： H01L21/76898 , H01L21/2633 , H01L21/268 , H01L21/304 , H01L21/3105 , H01L21/561 , H01L21/6835 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/481 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/43 , H01L24/45 , H01L2221/68327 , H01L2221/6834 , H01L2224/0231 , H01L2224/02311 , H01L2224/0233 , H01L2224/02371 , H01L2224/02372 , H01L2224/04042 , H01L2224/0557 , H01L2224/05572 , H01L2224/06135 , H01L2224/06182 , H01L2224/13024 , H01L2224/13025 , H01L2224/1411 , H01L2224/14181 , H01L2224/432 , H01L2224/4502 , H01L2224/45144 , H01L2924/01079 , H01L2924/00014
摘要： A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the first surface. The second surface has a first though hole to expose the conductive pad. The laser stopper is located on the conductive pad. The isolation layer is located on the second surface and in the first though hole. The isolation layer has a third surface opposite to the second surface. The isolation layer and the conductive pad have a second though hole together, such that the laser stopper is exposed through the second though hole. The redistribution layer is located on the third surface, the sidewall of the second though hole, and the laser stopper.
摘要翻译：芯片封装包括芯片，激光器停止器，隔离层，再分布层，绝缘层和导电结构。芯片具有导电焊盘，第一表面和与第一表面相对的第二表面。导电垫位于第一表面上。第二表面具有第一通孔以暴露导电垫。激光停止器位于导电垫上。隔离层位于第二表面和第一通孔中。隔离层具有与第二表面相对的第三表面。隔离层和导电垫在一起具有第二通孔，使得激光阻挡件通过第二通孔露出。再分配层位于第三表面，第二通孔的侧壁和激光停止器上。

34. 发明申请

US20150360316A1 COATED WIRE FOR BONDING APPLICATIONS 审中-公开
标题翻译：用于粘接应用的涂层线
公开(公告)号：US20150360316A1
公开(公告)日：2015-12-17
申请号：US14762556
申请日：2013-12-18
申请人： HERAEUS DEUTSCHLAND GMBH & CO. KG
发明人： Eugen MILKE , Jürgen SCHARF
IPC分类号： B23K20/00 , B23K35/30 , B23K35/40 , H05K3/34 , C25D5/34 , H01L23/00 , H05K1/09 , B23K35/02 , C25D7/06
CPC分类号： B23K20/007 , B23K20/10 , B23K35/0261 , B23K35/0272 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/322 , B23K35/40 , B23K35/404 , B23K2101/42 , C23C14/14 , C23C18/08 , C23C28/00 , C23C30/00 , C25D5/34 , C25D7/0607 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/43125 , H01L2224/432 , H01L2224/4321 , H01L2224/435 , H01L2224/43823 , H01L2224/43825 , H01L2224/43826 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45663 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48455 , H01L2224/48465 , H01L2224/48472 , H01L2224/48824 , H01L2224/85181 , H01L2224/85205 , H01L2224/85801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01076 , H01L2924/12044 , H01L2924/181 , H05K1/09 , H05K3/34 , H05K2201/10287 , H05K2203/049 , Y10T428/12875 , Y10T428/12889 , H01L2924/00 , H01L2924/20109 , H01L2924/2011 , H01L2924/01046 , H01L2924/01006 , H01L2924/01001 , H01L2924/01008 , H01L2924/01007 , H01L2924/01204 , H01L2924/013 , H01L2924/20751 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20752 , H01L2924/01014 , H01L2924/01029 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005 , H01L2924/01004 , H01L2924/01033 , H01L2924/206
摘要： The invention is related to a bonding wire which contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver. The coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium in an amount of at least 10% and further contains the core main component in an amount of at least 10%.
摘要翻译：本发明涉及一种接合线，其包含具有表面的芯和至少部分地叠置在芯的表面上的涂层。核心包含选自铜和银的核心主要成分。涂层含有至少10％量的选自钯，铂，金，铑，钌，锇和铱的涂层组分，并且还含有至少10％的核心主要组分。

35. 发明申请

US20010026016A1 Electronic component of a high frequency current suppression type and bonding wire for the same 失效
标题翻译：高频电流抑制型电子元件及其接合线
公开(公告)号：US20010026016A1
公开(公告)日：2001-10-04
申请号：US09826436
申请日：2001-04-04
发明人： Shigeyoshi Yoshida , Hiroshi Ono , Koji Kamei
IPC分类号： H01L023/48 , H01L023/52 , H01L029/40
CPC分类号： H05K1/0233 , H01L23/4952 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/745 , H01L2223/6611 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/131 , H01L2224/432 , H01L2224/43826 , H01L2224/43827 , H01L2224/451 , H01L2224/45117 , H01L2224/45118 , H01L2224/45123 , H01L2224/45124 , H01L2224/45138 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45163 , H01L2224/45166 , H01L2224/45179 , H01L2224/45181 , H01L2224/45188 , H01L2224/4554 , H01L2224/456 , H01L2224/45617 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45666 , H01L2224/45679 , H01L2224/45681 , H01L2224/45686 , H01L2224/45693 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/745 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01072 , H01L2924/01073 , H01L2924/01105 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H03H2001/0092 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/01008 , H01L2924/01009 , H01L2924/049 , H01L2924/053 , H01L2224/45015 , H01L2924/207
摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (nullm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
摘要翻译：为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流终端本身。该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性，小于几十MHz。

36. 发明授权

US5932345A Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same 失效
标题翻译：热熔粘合剂共聚物，由其制成的制品及其制造方法
公开(公告)号：US5932345A
公开(公告)日：1999-08-03
申请号：US714072
申请日：1996-09-10
申请人： Hiroyuki Furutani , Naoki Hase , Junya Ida , Yoshifumi Okamoto , Hitoshi Nojiri , Shinji Inoue , Hirosaku Nagano
发明人： Hiroyuki Furutani , Naoki Hase , Junya Ida , Yoshifumi Okamoto , Hitoshi Nojiri , Shinji Inoue , Hirosaku Nagano
IPC分类号： C08G73/10 , C08G73/16 , C08J5/18 , C09J179/08 , H01G4/18 , H01L23/29 , H01L23/49 , H05K1/03 , D02G3/00
CPC分类号： H01L23/293 , C08G73/1042 , C08G73/105 , C08G73/1089 , C08G73/16 , C08J5/18 , C09J179/08 , H01G4/18 , C08J2379/08 , H01L2224/16 , H01L2224/32245 , H01L2224/432 , H01L2224/451 , H01L2224/45572 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01013 , H01L2924/01039 , H01L2924/01046 , H01L2924/01058 , H01L2924/07802 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H05K1/0346
摘要： A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.2 represents a divalent organic radial, R represents a divalent organic radical, X represents trivalent bonding radicals, m and n are each integers of 0 or more, the sum of m and n being an integer of 1 or more, and 1 is an integer of 1 or more.
摘要翻译： PCT No.PCT / JP96 / 00049 Sec。 371日期：1996年9月10日 102（e）1996年9月10日PCT PCT 1996年1月11日PCT公布。 WO96 / 21693 PCT出版物日期1996年7月18日新型热熔共聚物具有机械强度，放射线电阻率，耐化学性，低温稳定性，耐热性，可加工性，粘合性，热熔粘合剂稳定性等优异性能的组合，同时满足要求涉及低吸湿特性和稳定的介电常数。另外，由主要由共聚物构成的热塑性聚酰亚胺树脂制成的适合用作电子电路部件的电子部件和材料的粉末，薄膜，层压薄膜，层叠绝缘材料，以及电子模块和电容器等制品。共聚物的玻璃化转变温度为100〜250℃，吸湿度为1以下，介电速度为3以下，具有下式：其中Ar 1表示四价有机基团，Ar 2 表示二价有机径向，R表示二价有机基团，X表示三价键键合基团，m和n各自为0以上的整数，m和n的和为1以上的整数，1为 1个或更多。

37. 发明公开

EP3379571A1 WIRE AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：EP3379571A1
公开(公告)日：2018-09-26
申请号：EP17762479.8
申请日：2017-02-27
申请人： Kunshan New Flat Panel Display Technology Center Co., Ltd.
发明人： HU, Kun , LIN, Li , SHAN, Qi , CAI, Shixing , YANG, Xiaolong , LIU, Shengfang
IPC分类号： H01L23/49 , H01L21/48
CPC分类号： H01L21/4896 , H01L21/48 , H01L23/49 , H01L24/43 , H01L24/45 , H01L51/52 , H01L2224/432 , H01L2224/45005 , H01L2224/45012
摘要： A wire and a method of manufacturing the same are provided. The wire for use in an organic light emitting diode device comprises three parts, a first part (11) and a third part (13) are located at both ends of the wire respectively and each of the first part (11) and the third part (13) is a single wire, a second part (12) is located between the first part (11) and the third part (13), and the second part (12) is a composite wire , wherein the composite wire comprises at least two wires. By dividing a middle part of one wire into multiple wires, the purpose of changing a wire width of a single wire is achieved, ductility of the wire can be enhanced, thereby avoiding the occurrence of the problem that the device cannot normally work caused by wire fracture during folding, and improving the using efficiency of the device.

38. 发明授权

EP1146637B1 Electronic component of a high frequency current suppression type and bonding wire for the same 有权
标题翻译：的电子部件可以在高频电流被抑制，接合线用于
公开(公告)号：EP1146637B1
公开(公告)日：2004-07-28
申请号：EP01108482.9
申请日：2001-04-04
申请人： NEC TOKIN Corporation
发明人： Yoshida, Shigeyoshi, Tokin Corporation , Ono, Hiroshi, Tokin Corporation , Kamei, Koji, Tokin Corporation
IPC分类号： H03H1/00
CPC分类号： H05K1/0233 , H01L23/4952 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/745 , H01L2223/6611 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/131 , H01L2224/432 , H01L2224/43826 , H01L2224/43827 , H01L2224/451 , H01L2224/45117 , H01L2224/45118 , H01L2224/45123 , H01L2224/45124 , H01L2224/45138 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45163 , H01L2224/45166 , H01L2224/45179 , H01L2224/45181 , H01L2224/45188 , H01L2224/4554 , H01L2224/456 , H01L2224/45617 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45666 , H01L2224/45679 , H01L2224/45681 , H01L2224/45686 , H01L2224/45693 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/745 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01072 , H01L2924/01073 , H01L2924/01105 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H03H2001/0092 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/01008 , H01L2924/01009 , H01L2924/049 , H01L2924/053 , H01L2224/45015 , H01L2924/207
摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 ( mu m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
摘要翻译：为了提供一种高频电流抑制型，其可以完全呼叫抑制高频电流，以防止电磁干扰的发生，即使当以高频率使用的电子部件，并且对于相同的，半导体的接合线集成电路装置（IC）（17）进行操作以高速在使用在高频带，并设置有一个高频电流抑制器（21），用于衰减流过的高频电流端子的预定数目（19）自身终端。该高频电流抑制器（21）是具有从0.3到在厚度为20（微米）的范围内的薄膜磁性物质，并且设置在每个终端（19）的整个表面上，覆盖安装部被安装在的印刷布线电路板（23），用于安装IC（17）和上边缘包括一连接部分，以设置在印刷布线电路板（23）的导体图案（25）。当顶端与导体图案（25）通过在IC的印刷布线电路基板（23）（17）的安装的焊料（27）连接，所述安装部的附近具有在使用频率带导电，所有小于几十MHz。

39. 发明公开

EP1146637A1 Electronic component of a high frequency current suppression type and bonding wire for the same 有权
标题翻译：的电子部件可以在高频电流被抑制，接合线用于
公开(公告)号：EP1146637A1
公开(公告)日：2001-10-17
申请号：EP01108482.9
申请日：2001-04-04
申请人： TOKIN CORPORATION
发明人： Yoshida, Shigeyoshi, Tokin Corporation , Ono, Hiroshi, Tokin Corporation , Kamei, Koji, Tokin Corporation
IPC分类号： H03H1/00
CPC分类号： H05K1/0233 , H01L23/4952 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/745 , H01L2223/6611 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05599 , H01L2224/131 , H01L2224/432 , H01L2224/43826 , H01L2224/43827 , H01L2224/451 , H01L2224/45117 , H01L2224/45118 , H01L2224/45123 , H01L2224/45124 , H01L2224/45138 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45163 , H01L2224/45166 , H01L2224/45179 , H01L2224/45181 , H01L2224/45188 , H01L2224/4554 , H01L2224/456 , H01L2224/45617 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45666 , H01L2224/45679 , H01L2224/45681 , H01L2224/45686 , H01L2224/45693 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/745 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01072 , H01L2924/01073 , H01L2924/01105 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H03H2001/0092 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/01008 , H01L2924/01009 , H01L2924/049 , H01L2924/053 , H01L2224/45015 , H01L2924/207
摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (µm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

40. 发明专利

JP2015106678A ボンディング用Alリボン及びその製造方法审中-公开
标题翻译：用于其连接和制造方法的铝型材
公开(公告)号：JP2015106678A
公开(公告)日：2015-06-08
申请号：JP2013249086
申请日：2013-12-02
申请人：住友金属鉱山株式会社
发明人：村瀬栄治 , 仲田徹志 , 井関隆士 , 高木久仁江
IPC分类号： H01L21/60
CPC分类号： H01L24/745 , H01L2224/43 , H01L2224/432 , H01L2224/45 , H01L2224/45014 , H01L2224/45124 , H01L2224/85455 , H01L2924/15747
摘要：【課題】半導体を用いた各種装置等に内蔵される電子部品と基板との接合等に使用されるボンディング用Alリボンであって、安価であると共に寸法精度が高く、酸化膜や残留不純物などが低減されていて、安定した接合を実現できるボンディング用Alリボン、及びその製造方法を提供する。【解決手段】厚み方向圧延ロールと幅方向圧延ロールが直列に組み込まれた圧延用ロールセットを用いて、Alを主成分とするAl合金材を厚み方向と幅方向に圧延加工し、その直後に異形状ダイスで伸線する。得られるAlリボンは、Ni、Si及びPの少なくとも1種を合計で800ppm以下含有し、平均結晶粒径が2〜250μm、表面粗さRaが2.0μm以下、酸化膜の厚さが4.0nm以下である。【選択図】図1
摘要翻译：要解决的问题：为了提供一种用于接合用于使用半导体和基板的各种装置中的电子部件的接合用铝带，该半导体和基板廉价且尺寸精度高，其中氧化物膜或残留杂质减少，并且与可以实现稳定化的接合，并提供其制造方法。解决方案：通过使用组合厚度方向还原辊和宽度方向的还原辊，在厚度方向和宽度方向上轧制主要由Al组成的Al合金材料还原辊，然后立即通过变型骰子进行拉丝。由此获得的Al带包含800ppm以下的至少一种Ni，Si和P，总共具有2-250μm的平均结晶粒径，2.0μm以下的表面粗糙度Ra，以及氧化膜为4.0nm以下。

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