基本信息:
- 专利标题： CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）：芯片包装及其制造方法
- 申请号：US14869602 申请日：2015-09-29
- 公开(公告)号：US20160133544A1 公开(公告)日：2016-05-12
- 发明人： Chien-Hung LIU , Ying-Nan WEN , Shih-Yi LEE , Ho-Yin YIU
- 申请人： XINTEC INC.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/528 ; H01L21/683 ; H01L21/768 ; H01L23/31 ; H01L21/78 ; H01L21/304 ; H01L21/3105 ; H01L21/56 ; H01L23/00 ; H01L21/268
摘要：
A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the first surface. The second surface has a first though hole to expose the conductive pad. The laser stopper is located on the conductive pad. The isolation layer is located on the second surface and in the first though hole. The isolation layer has a third surface opposite to the second surface. The isolation layer and the conductive pad have a second though hole together, such that the laser stopper is exposed through the second though hole. The redistribution layer is located on the third surface, the sidewall of the second though hole, and the laser stopper.
摘要（中）：
芯片封装包括芯片，激光器停止器，隔离层，再分布层，绝缘层和导电结构。 芯片具有导电焊盘，第一表面和与第一表面相对的第二表面。 导电垫位于第一表面上。 第二表面具有第一通孔以暴露导电垫。 激光停止器位于导电垫上。 隔离层位于第二表面和第一通孔中。 隔离层具有与第二表面相对的第三表面。 隔离层和导电垫在一起具有第二通孔，使得激光阻挡件通过第二通孔露出。 再分配层位于第三表面，第二通孔的侧壁和激光停止器上。
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |