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31. 发明专利

JP2007044662A Ultrasonic cleaner 审中-公开
标题翻译：超声波清洗机
公开(公告)号：JP2007044662A
公开(公告)日：2007-02-22
申请号：JP2005233968
申请日：2005-08-12
申请人： Kaijo Corp , 株式会社カイジョー
发明人： SOEJIMA JUNICHIRO , SASAMOTO KAZUHIRO , IMAZEKI YASUHIRO , HASEGAWA HIROSHI , SHIMADA TADAYUKI , KAMAMURA TOMOHARU
IPC分类号： B08B3/12 , G02F1/1333 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic cleaner which is combined with an inner tank and an outer tank, and hardly causes uneven cleaning.
SOLUTION: The ultrasonic cleaner is equipped with: the outer tank 30, which keeps the bottom face 32 fitted with an ultrasonic transducer 40 and stores a mediated liquid 50 for transmitting ultrasonic vibrations; and the inner tank 20, which is disposed inside of the outer tank with predetermined intervals and cleans a cleaning object M immersed with a cleaning liquid 60 filling its inside by ultrasonic vibrations propagated with the mediated liquid. The bottom face of the inner tank has inclination angles θ° with respect to the bottom face of the outer tank fitted with the ultrasonic transducer, and the inclination angles θ° are 5°/(ultrasonic frequency MHz)≤θ°
摘要翻译：要解决的问题：提供一种与内罐和外罐组合的超声波清洗器，并且几乎不会引起不均匀的清洁。解决方案：超声波清洗机配备有：外箱30，其保持底面32配有超声换能器40并且存储用于传输超声波振动的介质液体50; 以及内箱20，其以预定的间隔设置在外箱的内部，并且通过用介质液体传播的超声波振动来清洗浸入其内填充有清洁液60的清洁对象M。内罐的底面相对于装配有超声波换能器的外罐的底面具有倾角θ°，倾角θ°为5°/（超声频率MHz）≤θ°<20°/ （超声波频率MHz）。版权所有（C）2007，JPO＆INPIT

32. 发明专利

JP2006294897A Bump bonding device 审中-公开
标题翻译： BUMP BONDING DEVICE
公开(公告)号：JP2006294897A
公开(公告)日：2006-10-26
申请号：JP2005114321
申请日：2005-04-12
申请人： Kaijo Corp , 株式会社カイジョー
发明人： KUSHIMA MASAMI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a bump bonding device which is improved in productivity through a process of reducing a chip transfer time as much as possible by taking the arrangement of each mechanical unit into consideration.
SOLUTION: The bump bonding device is equipped with a loading unit 12 for mounting trays with semiconductor chips to carry out bumping process on one side of a bonding head 17, an unloading unit 13 for mounting with trays with semiconductor chips completing the bumping process on the other side of the bonding head 17, a leveling mechanism 16 for levelling the height of the chips adjacent to the unloading unit 13, a buffer unit 14 for holding the trays transferred from the loading unit 12 by the side of the loading unit 12, and a tray positioning unit 15 which holds the trays transferred from the buffer unit 14 and feeds the semiconductor chips held in the trays successively to a bonding stage.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过考虑每个机械单元的布置尽可能地减少芯片传送时间的过程来提高生产率的凸块接合装置。
解决方案：凸块接合装置配备有用于安装具有半导体芯片的托盘的装载单元12，以在结合头17的一侧上执行凸起处理;卸载单元13，用于安装托盘，半导体芯片完成凸起在粘合头17的另一侧上进行处理;平整机构16，用于调平与卸载单元13相邻的切屑的高度;缓冲单元14，用于保持从装载单元12的一侧装载单元传送的托盘 12，以及托盘定位单元15，其保持从缓冲单元14传送的托盘，并将保持在托盘中的半导体芯片依次送入粘合台。版权所有（C）2007，JPO＆INPIT

33. 发明专利

JP3809296B2 Ultrasonic cleaning equipment 有权
公开(公告)号：JP3809296B2
公开(公告)日：2006-08-16
申请号：JP10628499
申请日：1999-04-14
申请人：株式会社カイジョー
发明人：勝一岡野
IPC分类号： B08B3/12 , B06B3/04 , H01L21/304

34. 发明专利

JP2006165005A Ultrasonic vibration detector and ultrasonic-wave bonder using the same 审中-公开
标题翻译：使用超声波振动检测器和超声波焊接机
公开(公告)号：JP2006165005A
公开(公告)日：2006-06-22
申请号：JP2004349365
申请日：2004-12-02
申请人： Kaijo Corp , 株式会社カイジョー
发明人： SOEJIMA JUNICHIRO , YAMAMOTO AKIO , HIRAYAMA SEIGO , GOTO SEIJI
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85 , H01L2224/85205 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic vibration detector, having a simple structure for sure shielding of ultrasonic-wave vibration in an area other than the measuring object area and for accurately detecting only the ultrasonic-wave vibration from the measuring object area, and to provide an ultrasonic-wave bonder that uses the ultrasonic vibration detector. SOLUTION: The non-contact type ultrasonic vibration detector 17 for converting ultrasonic vibration into an electrical signal using a acoustoelectric converting element is provided with an ultrasonic-wave shielding member 19 including an ultrasonic-wave guide hole 20 at the front surface position of an ultrasonic-wave receiving surface 18a of a piezoelectric element 18 as the acoustoelectric converting element. Moreover, the external shape of ultrasonic-wave shielding member 20 is formed in the conic shape to be reduced in the diameter thereof, as it goes to the front end side. In addition, an ultrasonic-wave bonder provided with an ultrasonic-wave vibration measuring means for detecting the vibrating state of an ultrasonic-wave horn 1, and a capillary 4 is formed using the ultrasonic-wave vibration detector 17. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种超声波振动检测器，其具有简单的结构，用于在测量对象区域以外的区域中可靠地屏蔽超声波振动，并且仅精确地检测来自测量对象的超声波振动并提供使用超声波振动检测器的超声波焊接机。解决方案：使用声电转换元件将超声波振动转换为电信号的非接触型超声波振动检测器17设置有超声波波形屏蔽部件19，该超声波波形屏蔽部件19在前表面位置处包括超声波引导孔20 作为声电转换元件的压电元件18的超声波接收表面18a。此外，超声波波形屏蔽构件20的外形形成锥形，直径减小到前端侧。此外，使用超声波振动检测器17形成设置有用于检测超声波波峰1的振动状态的超声波振动测定单元和毛细管4的超声波波合成器。（C）2006，JPO＆NCIPI

36. 发明专利

JP3767750B2 Bonding apparatus 有权
标题翻译：空值
公开(公告)号：JP3767750B2
公开(公告)日：2006-04-19
申请号：JP2003319469
申请日：2003-09-11
申请人：株式会社カイジョー
发明人：秀紀吉野 , 聡蔵鳥越
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15747 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a bonding device which can manufacture an uniform semiconductor device, capable of efficiently preventing oxidation. SOLUTION: A continuous space is formed of a first space, which is formed of a gas supply nozzle 33 provided near the periphery of a semiconductor wafer 5 placed on a heater plate 4 mounted on a bonding stage 3 and a chamber top face cover 11, and a second space, which is formed of a gas supply nozzle 23 mounted on a head cover 21 of a bonding head and the chamber top face cover 11, via the bonding head moving notch 11a of the chamber top face cover 11. An uniform semiconductor device can be manufactured by supplying an inert gas for oxidation prevention of the semiconductor wafer 5 performed a bonding work to the space to a necessary minimum. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供能够有效地防止氧化的能够制造均匀的半导体器件的接合装置。解决方案：连续空间由第一空间形成，第一空间由设置在安装在接合台3上的加热板4上的半导体晶片5的周边附近设置的供气喷嘴33和室顶面盖11，以及第二空间，其通过安装在接合头的头盖21和室顶面盖11上的气体供给喷嘴23经由室顶面罩11的接合头移动槽11a形成。可以通过向半导体晶片5提供用于氧化防止的惰性气体来进行到空间的接合作业至必要的最小值来制造均匀的半导体器件。版权所有（C）2005，JPO＆NCIPI

37. 发明专利

JP2006019475A Wire bonding apparatus 有权
标题翻译：电线连接装置
公开(公告)号：JP2006019475A
公开(公告)日：2006-01-19
申请号：JP2004195305
申请日：2004-07-01
申请人： Kaijo Corp , 株式会社カイジョー
发明人： SATOU HIROTAKA
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/78 , H01L2224/85 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2224/48 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding apparatus which can automatically correct a CTD (camera tool distance) even during the continuous operation of the apparatus. SOLUTION: The wire bonding apparatus includes a tool 6 for bonding a ball 8 made of a wire 7 to a work, a camera off-set by the CTD to the tool 6 and arranged to detect a position for detecting the position of the work, a moving means (for example, an XY stage) for moving the tool 6 and the camera for detecting the position, and an optical unit for focusing the tool 6 or the ball 8 to the camera for detecting the position. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供即使在设备的连续操作期间也能够自动校正CTD（摄像机工具距离）的引线接合装置。导线接合装置包括用于将由导线7制成的球8接合到工件的工具6，通过CTD将其移动到工具6并被布置成检测用于检测位置的位置工件，用于移动工具6的移动装置（例如，XY台）和用于检测位置的相机，以及用于将工具6或球8聚焦到相机以检测位置的光学单元。版权所有（C）2006，JPO＆NCIPI

38. 发明专利

JP2005340777A Loop shape of bonding wire, semiconductor device equipped with loop shape and wire bonding method 有权
标题翻译：连接线的环形形状，带有环形形状和线接合方法的半导体器件
公开(公告)号：JP2005340777A
公开(公告)日：2005-12-08
申请号：JP2005081035
申请日：2005-03-22
申请人： Kaijo Corp , 株式会社カイジョー
发明人： FUJISAWA HIROO , TAKEMOTO TAKESHI
IPC分类号： H01L21/60
CPC分类号： H01L24/06 , H01L24/05 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/48 , H01L2224/4809 , H01L2224/48095 , H01L2224/48145 , H01L2224/48147 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49 , H01L2224/4911 , H01L2224/49171 , H01L2224/73215 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85181 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/05556 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a loop shape of a bonding wire and a semiconductor device equipped with the loop shape, by which a neck part height can be made as low as possible, the semiconductor device can be miniaturized and thinned, a bonding speed can be accelerated by shortening a bonding cycle, and a stable bonding property can be realized, and a wire bonding method of forming the loop shape. SOLUTION: In the semiconductor device wherein a portion between a pad 2 and a reed 4 of a semiconductor chip 1 loaded on a lead frame 3 is connected by means of a bonding wire 5, the wire 5 is returned multiple times on the pad 2 that is a primary bonding point, the returned wire 5 is connected with the pad 2 that is the primary bonding point in the vertically piled state, and the vertically piled wire 5 is pulled out as it is horizontally or almost horizontally and is wired toward the reed 4 that is a secondary bonding point. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供接合线的环形和配备有环形的半导体器件，通过该环形可以使颈部高度尽可能低，半导体器件可以被小型化和变薄，可以通过缩短接合循环来加速接合速度，并且可以实现稳定的接合性能，以及形成环形的引线接合方法。解决方案：在半导体器件中，其中焊盘2和装载在引线框架3上的半导体芯片1的簧片4之间的部分通过接合线5连接，导线5在作为主要接合点的焊盘2，返回的焊丝5与作为垂直堆叠状态的主要接合点的焊盘2连接，并且垂直堆叠的焊丝5被水平或几乎水平地拉出并且被布线朝向作为次要粘合点的簧片4。版权所有（C）2006，JPO＆NCIPI

39. 发明专利

JP2005236148A Bonding method and bonding apparatus 有权
标题翻译：接合方法和接合装置
公开(公告)号：JP2005236148A
公开(公告)日：2005-09-02
申请号：JP2004045417
申请日：2004-02-20
申请人： Kaijo Corp , 株式会社カイジョー
发明人： KUSHIMA MASAMI
IPC分类号： H01L21/60
CPC分类号： H01L2224/48245 , H01L2224/48247 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a bonding method and a bonding apparatus whereby, even when chips arranged in the form of a matrix have no predetermined pitch or they are different from each other, they can be bonded by using a single camera, and the productive number of bonded components is improved. SOLUTION: The bonding apparatus has a sequence control table wherein a bonding sequence is so memorized as to sense the discrepancy quantities of bonded components according to its moving order to the bonded components. Based on the data read out from the sequence control table, an X-Y table is so controlled as to move it on the bonded components in an one-pen-stroke writing way, and as to perform the sensing of the discrepancy quantities of the bonded components and the bonding of them at the same time concurrently. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种接合方法和接合装置，由此即使以矩阵形式布置的芯片没有预定间距或彼此不同，它们也可以通过使用单个相机，粘结组分的生产数量有所改善。解决方案：接合装置具有顺序控制表，其中粘合顺序如此记忆，以根据其对粘合部件的移动顺序感测粘合部件的差异量。基于从序列控制表读出的数据，XY表受到如此控制以便以一笔冲程写入方式在粘合部件上移动，并且对粘合部件的差异量进行感测并同时粘合它们。版权所有（C）2005，JPO＆NCIPI

40. 发明专利

JP3681517B2 Wafer pedestal 失效
公开(公告)号：JP3681517B2
公开(公告)日：2005-08-10
申请号：JP25146397
申请日：1997-09-02
申请人：株式会社カイジョー
发明人：亮大関
IPC分类号： H01L21/683 , H01L21/304 , H01L21/68

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