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31. 发明申请

US20080283860A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20080283860A1
公开(公告)日：2008-11-20
申请号：US12155326
申请日：2008-06-02
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H01L33/00
CPC分类号： G02B6/0048 , G02B6/0031 , G02B6/0071 , G02B6/0083 , G02B6/0085 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/16225
摘要： A light emitting device includes an emission portion, an optical control portion for reflecting or refracting light emitted from the emission portion in a predetermined direction, a light guiding member including a light input surface to which the reflected or refracted light is inputted, a refection region formed on a surface thereof for reflecting the inputted light, and a light output surface for externally outputting the reflected light from the refection region, a reflection portion, on which the emission portion is mounted and which covers externally the refection region, for dissipating heat generated from the emission portion and for reflecting light passing through the refection region in a direction of the light output surface, and a space formed between the light guiding member and the reflection portion.
摘要翻译：发光装置包括发射部分，用于反射或折射从发射部分沿预定方向发射的光的光学控制部分，包括输入反射或折射光的光输入表面的导光部件，反射区域形成在其表面上用于反射输入的光;以及光输出表面，用于从反射区域外部输出反射光，反射部分，发射部分安装在该反射部分上，并且覆盖在反射区域外部，用于散发产生的热量并且用于反射沿着光输出表面的方向穿过反射区域的光以及在导光构件和反射部分之间形成的空间。

32. 发明申请

US20080029780A1 Solid state device 有权
标题翻译：固态设备
公开(公告)号：US20080029780A1
公开(公告)日：2008-02-07
申请号：US11882601
申请日：2007-08-02
申请人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
发明人： Masaaki Ohtsuka , Naruhito Sawanobori , Kazuya Aida , Hiroki Watanabe , Yoshinobu Suehiro , Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , C03C3/066 , H01L24/17 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00014 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a B2O3—SiO2—Li2O—Na2O—ZnO—Nb2O5 based glass, which is composed of 21 wt % to 23 wt % of B2O3, 11 wt % to 13 wt % of SiO2, 1 wt % to 1.5 wt % of Li2O, and 2 wt % to 2.5 wt % of Na2O.
摘要翻译：固体装置具有固态成分，将固态成分安装在其上用于从固态成分接收/供给电力的电力接收供给部和密封固体成分的玻璃密封部。玻璃密封部分由B 2 O 3 -S 3 O 3 -SiO 2 -Li 2 O 2 Na 2 O 2形成，由2重量％〜23重量％的B 2 O 2 ZnO 2 Nb 2 O 5 O 5系基体玻璃组成， 3重量％，1重量％〜13重量％的SiO 2，1重量％〜1.5重量％的Li 2 O，和2重量％至2.5重量％的Na 2 O。

33. 发明申请

US20060043402A1 Light emitting device and light emitting element 有权
标题翻译：发光元件及发光元件
公开(公告)号：US20060043402A1
公开(公告)日：2006-03-02
申请号：US11214018
申请日：2005-08-30
申请人： Yoshinobu Suehiro , Koji Tasumi
发明人： Yoshinobu Suehiro , Koji Tasumi
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/32 , H01L33/486 , H01L33/56 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A light emitting device having: a predetermined optical form that is provided on a surface of an LED element mounted on a base, the predetermined optical form being made to allow an increase in efficiency of taken out light from an inside of the LED element; and a sealing material that seals the predetermined optical form. The sealing material has a refractive index of 1.6 or more, the predetermined optical form is formed in a surface of a substrate of the LED element, and the substrate has a refractive index nearly equal to that of a light emitting layer of the LED element.
摘要翻译：一种发光器件，具有：预定的光学形式，其设置在安装在基座上的LED元件的表面上，所述预定光学形状被制成允许提高从LED元件的内部取出光的效率; 以及密封预定光学形式的密封材料。密封材料的折射率为1.6以上，在LED元件的基板的表面形成预定的光学形状，并且基板的折射率与LED元件的发光层的折射率几乎相等。

34. 发明授权

US07498734B2 Light emitting device with wavelength converted by phosphor 有权
标题翻译：具有波长由磷光体转换的发光器件
公开(公告)号：US07498734B2
公开(公告)日：2009-03-03
申请号：US10869036
申请日：2004-06-17
申请人： Yoshinobu Suehiro , Ryoichi Tohmon , Hideaki Kato , Satoshi Wada
发明人： Yoshinobu Suehiro , Ryoichi Tohmon , Hideaki Kato , Satoshi Wada
IPC分类号： H01J63/04 , H01J1/62
CPC分类号： H01L33/507 , H01L33/505 , H01L2224/16225 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/0401
摘要： A light emitting device has a light emitting element portion that radiates light with a predetermined wavelength, and a wavelength conversion portion that surrounds a phosphor to be excited by the light with the predetermined wavelength with a transparent and non-moisture permeability material in the form of laminae. Further, a light emitting device has a plurality of LED elements disposed on a same plane, and a wavelength conversion portion that comprises a flat transparent base member that is disposed opposite to the plurality of LED elements and a phosphor layer that is of a phosphor to be excited by light emitted from the LED element and is formed like a film on the base member. The phosphor layer includes part with no phosphor in plane.
摘要翻译：一种发光器件具有发射预定波长的光的发光元件部分和包围具有预定波长的光激发的荧光体的波长转换部分，其透明和非透湿性材料形式为薄片此外，发光器件具有设置在同一平面上的多个LED元件，以及波长转换部分，其包括与多个LED元件相对设置的平坦的透明基底部件和磷光体的磷光体层，被从LED元件发射的光激发，并且在基底构件上形成为薄膜。荧光体层包括在平面中没有磷光体的部分。

35. 发明申请

US20110101399A1 Solid element device and method for manufacturing the same 有权
标题翻译：固体元件及其制造方法
公开(公告)号：US20110101399A1
公开(公告)日：2011-05-05
申请号：US12923788
申请日：2010-10-07
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L33/52 , H01L31/0203
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.
摘要翻译：固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低熔化眼镜。

36. 发明授权

US07607801B2 Light emitting apparatus 失效
标题翻译：发光装置
公开(公告)号：US07607801B2
公开(公告)日：2009-10-27
申请号：US10521943
申请日：2004-10-28
申请人： Yoshinobu Suehiro , Satoshi Wada , Akihito Ota
发明人： Yoshinobu Suehiro , Satoshi Wada , Akihito Ota
IPC分类号： F21V29/00 , F21V7/20 , F21V7/00 , B60Q1/06 , B60Q1/00
CPC分类号： F21V29/74 , F21K9/00 , F21K9/68 , F21V7/0008 , F21V7/06 , F21V7/08 , F21V7/22 , F21V15/01 , F21V29/505 , F21V29/507 , F21V29/89 , F21Y2115/10 , H01L33/483 , H01L33/60 , H01L33/642 , H01L2224/13 , H01L2224/48091 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A reflection-type light emitting apparatus has an excellent heat radiation property and allows the use of a high-power light emitting element, the minimization of a reduction in radiation efficiency of reflected light, and the focused radiation of high-output light at high efficiency. The apparatus has: a case 10 of metallic material and with an excellent heat radiation property; a reflection mirror section 11 formed fitted to the lower portion of case 10; a transparent plate 12 to cover the upper surface of case 10; heat radiation plates 13, 14 of metallic material with excellent heat conductivity and inserted inside the case 10; an LED element 2 mounted on the heat radiation plate 13; lead sections 15A, 15B fixed through an insulating layer 15a to the heat radiation plate 13 to serve as a power supply member to supply power to the LED element 2; and a spacer 16 of an insulating material to insulate the lead sections 15A, 15B from the case 10.
摘要翻译：反射型发光装置具有优异的散热性能，并且允许使用高功率发光元件，降低反射光的辐射效率的最小化和高效率的高输出光的聚焦辐射。该装置具有：金属材料的壳体10和良好的散热性能; 形成为与壳体10的下部嵌合的反射镜部11; 透明板12，以覆盖壳体10的上表面; 具有优异导热性的金属材料的散热板13,14插入壳体10内; 安装在散热板13上的LED元件2; 引线部分15A，15B通过绝缘层15a固定到散热板13上，用作向LED元件2供电的供电部件; 以及绝缘材料的间隔件16，以使引线部分15A，15B与壳体10绝缘。

37. 发明授权

US07422349B2 Led lighting apparatus 失效
标题翻译： LED照明设备
公开(公告)号：US07422349B2
公开(公告)日：2008-09-09
申请号：US11411144
申请日：2006-04-26
申请人： Satoshi Wada , Yoshinobu Suehiro
发明人： Satoshi Wada , Yoshinobu Suehiro
IPC分类号： F21V29/00
CPC分类号： F21V29/767 , F21S41/143 , F21S41/147 , F21S41/155 , F21S45/10 , F21S45/47 , F21V29/89 , F21Y2115/10
摘要： An LED lighting apparatus has a plurality of reflection-type LED lamps. The lamps each have an LED, a reflector portion to reflect a light emitted from the LED, and a case portion having a radiation fin that is formed along a vertical section of the case portion to pass through a center of the case portion. The LED is mounted on an end of the radiation fin.
摘要翻译： LED照明装置具有多个反射式LED灯。这些灯各自具有LED，用于反射从LED发射的光的反射器部分，以及具有沿壳体部分的垂直部分形成以穿过壳体部分的中心的辐射翅片的壳体部分。 LED安装在散热片的一端。

38. 发明申请

US20060001035A1 Light emitting element and method of making same 审中-公开
标题翻译：发光元件及其制造方法
公开(公告)号：US20060001035A1
公开(公告)日：2006-01-05
申请号：US11157174
申请日：2005-06-21
申请人： Yoshinobu Suehiro , Satoshi Wada
发明人： Yoshinobu Suehiro , Satoshi Wada
IPC分类号： H01L29/205 , H01L21/00
CPC分类号： H01L33/38 , H01L33/20 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： A light emitting element has: a semiconductor layer having a light-emitting layer; a first electrode; a second electrode; an insulation layer that is formed on a mounting face side of the semiconductor layer; and a first terminal and a second terminal that are formed on a surface of the insulation layer corresponding to the first electrode and the second electrode, respectively. The first electrode and the second electrode are formed on the mounting face side of the semiconductor layer. The insulation layer has a first opening and a second opening, and the first electrode and the second electrode are electrically connected through the first hole and the second hole, respectively, to the first terminal and the second terminal.
摘要翻译：发光元件具有：具有发光层的半导体层; 第一电极; 第二电极; 绝缘层，其形成在所述半导体层的安装面侧上; 以及分别形成在与第一电极和第二电极对应的绝缘层的表面上的第一端子和第二端子。第一电极和第二电极形成在半导体层的安装面侧。绝缘层具有第一开口和第二开口，第一电极和第二电极分别通过第一孔和第二孔电连接到第一端子和第二端子。

39. 发明授权

US07824937B2 Solid element device and method for manufacturing the same 有权
标题翻译：固体元件装置及其制造方法
公开(公告)号：US07824937B2
公开(公告)日：2010-11-02
申请号：US10548560
申请日：2004-03-10
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L21/56
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
摘要翻译：一种固体元件器件的制造方法，其特征在于，提供具有GaN基LED元件（2）的含有玻璃的Al 2 O 3衬底（3），设置与所述衬底平行的P2O5-ZnO系低熔点玻璃，以及在氮气气氛下，在60kgf的压力下进行在415℃以上的温度下的加压。在这些条件下，低熔点玻璃的粘度为109泊，并且通过形成在含玻璃Al 2 O 3衬底（3）的表面上的氧化物粘合。通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造，并且还具有高度可靠的密封结构。

40. 发明申请

US20060261364A1 Solid element device and method for manufacturing thereof 有权
标题翻译：固体元件装置及其制造方法
公开(公告)号：US20060261364A1
公开(公告)日：2006-11-23
申请号：US10548560
申请日：2004-03-10
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
摘要翻译：一种固体元件器件的制造方法，其特征在于，提供具有GaN基LED元件（2）的含有玻璃的Al 2 O 3 N 3衬底（3）设置与基板平行的P 2 5 5 5 5 5 在氮气气氛中压力为60kgf。在这些条件下，低熔点玻璃的粘度为10泊，并通过形成在含玻璃Al 2 O 2的表面上的氧化物粘合，（3）。通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造，并且还具有高度可靠的密封结构。

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