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31. 发明申请

US20100091427A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20100091427A1
公开(公告)日：2010-04-15
申请号：US12407298
申请日：2009-03-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/385 , H01L2224/16227 , H01L2924/15311
摘要： A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.
摘要翻译：一种多层片状电容器包括：电容器主体，其具有层叠在其中的多个电介质层，并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极，其中所述第一电容器单元包括彼此面对的第一和第二内部电极，所述电介质层插入在所述第一和第二内部电极之间，连接到所述第一和第二外部电极，并且具有不同的极性每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器，第二电容器单元包括彼此面对的第三和第四内部电极，介电层插入其间，连接到第三个和第四外部电极，并且具有与第一和第二内部电极相同的极性，每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器，并且至少三个电容器包括在第一和第二电容器单元ha中不同的电容或谐振频率。

32. 发明申请

US20090244803A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20090244803A1
公开(公告)日：2009-10-01
申请号：US12245856
申请日：2008-10-06
申请人： Byoung Hwa LEE , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa LEE , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1≧20 mΩ and 0.7(ESR1)≦ESR2≦1.3(ESR1).
摘要翻译：多层片状电容器包括电容器本体，其包括第一电容器部分和第二电容器部分，分别形成在电容器主体的第一和第二长侧面上的第一和第二外部电极，以及分别形成在第一和第二电极部分上的第三和第四外部电极电容器主体的较短侧面。第一电容器部分包括具有相反极性的第一和第二内部电极，并且第二电容器部分包括具有相反极性的第三和第四内部电极。第一至第四内部电极各有一个引线。第一至第四外部电极分别连接到第一至第四内部电极的引线。第一电容器部分的串联谐振频率与第二电容器部分的串联谐振频率不同。第一电容器部分的等效串联电阻（ESR1）和第二电容器部分的等效串联电阻（ESR2）满足ERS1> = 20mOmega和0.7（ESR1）<= ESR2 <= 1.3（ESR1）。

33. 发明申请

US20090034154A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20090034154A1
公开(公告)日：2009-02-05
申请号：US12010018
申请日：2008-01-18
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically connected to the internal electrodes through the leads. The average number of leads in each internal electrode is smaller than half (½) of the total number of external electrodes. The leads of the internal electrodes having opposite polarities and adjacent in the lamination direction are disposed to be adjacent to each other as seen from the lamination direction. All the internal electrodes having the same polarity are electrically connected to each other in the capacitor.
摘要翻译：多层片状电容器包括：电容器本体; 设置在电容器本体中的内部电极，每个内部电极具有一个或多个引线; 以及设置在电容器主体的第一和第二侧面上的外部电极，以通过引线与内部电极电连接。每个内部电极的引线平均数小于外部电极总数的一半（1/2）。具有相反极性并且在层叠方向上相邻的内部电极的引线设置成从层叠方向看彼此相邻。具有相同极性的所有内部电极在电容器中彼此电连接。

34. 发明授权

US09036330B2 Multilayer chip capacitor and method of fabricating the same 有权
标题翻译：多层片式电容器及其制造方法
公开(公告)号：US09036330B2
公开(公告)日：2015-05-19
申请号：US12650134
申请日：2009-12-30
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06 , H01G4/232 , H01G2/06 , H01G4/30 , H05K1/02 , H05K1/18
CPC分类号： H01G4/232 , H01G2/065 , H01G4/30 , H05K1/0231 , H05K1/0295 , H05K1/181 , H05K2201/0979 , H05K2201/09954 , Y10T29/435
摘要： A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m≧3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.
摘要翻译：一种多层片状电容器包括：电容器主体; 多个第一和第二内部电极; 和m（m≥3）个数的第一和第二外部电极。多个第一和第二内部电极与位于两个相对表面上并且具有与第一和第二内部电极相同的极性的两个外部电极连接，并且根据连接的外部电极的位置被分成多个组到第一和第二内部电极。与每组的内部电极连接的两个外部电极中的至少一个不同于与具有相同极性的不同组的内部电极连接的外部电极，并且一组的内部电极连接到与至少另一个连接的外部电极使得属于相同极性的所有内部电极可以电连接。

35. 发明申请

US20130020842A1 PIEZOELECTRIC MODULE AND SEAT FOR VEHICLE INCLUDING THE SAME 审中-公开
标题翻译：用于车辆的压电模块和座椅包括它们
公开(公告)号：US20130020842A1
公开(公告)日：2013-01-24
申请号：US13489787
申请日：2012-06-06
申请人： Ju Hwan Yang , Dong Hyeok Choi , Boum Seock Kim , Sung Kwon Wi , Sung Ho Lee
发明人： Ju Hwan Yang , Dong Hyeok Choi , Boum Seock Kim , Sung Kwon Wi , Sung Ho Lee
IPC分类号： B60H1/22 , B60N2/56
CPC分类号： B60N2/5692
摘要： Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body.
摘要翻译：这里公开了一种压电模块和一种包括该模块的车辆用片材。该片材包括：支撑乘客下身的座椅板部分; 形成为沿垂直于所述座椅板部的一侧的方向延伸并支撑乘客的上身的背板部; 以及形成在座椅基板部分中的压电模块，并且使用由车辆振动产生的电流流产生暖空气或冷空气，从而将产生的暖空气或冷空气转移到乘客身体。

36. 发明申请

US20130014516A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20130014516A1
公开(公告)日：2013-01-17
申请号：US13480022
申请日：2012-05-24
申请人： Ju Hwan Yang , Dong Hyeok Choi , Sung Ho Lee , Sung Kwon Wi
发明人： Ju Hwan Yang , Dong Hyeok Choi , Sung Ho Lee , Sung Kwon Wi
IPC分类号： F25B21/02 , H01L35/30
CPC分类号： H01L35/30
摘要： Disclosed herein is a thermoelectric module. The thermoelectric module includes a first substrate, a second substrate, a diffusion prevention layer, and a thermoelectric device, wherein each of the first and second substrates is stacked with: a heat radiation layer performing heat generation reaction or heat adsorption reaction when power is applied to the thermoelectric module; an insulating layer formed on one surface of the heat radiation layer and formed in a first square wave pattern having a first protrusion part and a first groove part; and an electrode layer buried into the first groove part formed on a surface of the insulating layer.
摘要翻译：这里公开了一种热电模块。热电模块包括第一衬底，第二衬底，扩散防止层和热电器件，其中第一和第二衬底中的每一个层叠有：当施加电力时进行发热反应或热吸附反应的散热层到热电模块; 绝缘层，其形成在所述散热层的一个表面上并形成为具有第一突起部和第一槽部的第一方波图案; 以及埋设在形成在绝缘层的表面上的第一槽部中的电极层。

37. 发明申请

US20120326563A1 ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：超声波传感器及其制造方法
公开(公告)号：US20120326563A1
公开(公告)日：2012-12-27
申请号：US13462756
申请日：2012-05-02
申请人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
发明人： Boum Seock Kim , Sung Kwon Wi , Eun Tae Park
IPC分类号： H01L41/04 , B29C45/14
CPC分类号： B29C45/1671 , B06B1/06 , B29C45/14639 , G01H11/08 , H01L41/042 , H01L41/1132 , H01L41/25
摘要： Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a conductive case; a piezoelectric element fixed to a bottom. surface of the case through a conductive adhesive; a temperature compensation capacitor positioned over the piezoelectric element; a first lead wire lead from the outside of the case and electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; a second lead wire lead from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor and the case; and a first molding part closely adhered to outer portions of the temperature compensation capacitor and the first and second lead wires.
摘要翻译：这里公开了一种超声波传感器及其制造方法。超声波传感器包括：导电壳体; 固定在底部的压电元件。表壳通过导电胶粘剂; 位于所述压电元件上方的温度补偿电容器; 第一引线从壳体的外部引出并且电连接到温度补偿电容器和压电元件的一个表面; 第二引线从壳体的外部引出并且电连接到温度补偿电容器和壳体的另一个表面; 以及与温度补偿电容器和第一和第二引线的外部紧密粘合的第一模制部件。

38. 发明授权

US08213155B2 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US08213155B2
公开(公告)日：2012-07-03
申请号：US12340200
申请日：2008-12-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/228
CPC分类号： H01G4/35 , H01G4/012 , H01G4/232 , H01G4/30 , H01G4/38
摘要： There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.
摘要翻译：提供了一种多层片状电容器，其包括：电容器主体，包括布置在其中的第一和第二电容器单元; 以及第一至第四外部电极，其中所述第一电容器单元包括第一和第二内部电极，并且所述第一电容器单元包括多个电容器元件，每个电容器元件具有反复层叠的一对第一和第二内部电极，所述第二电容器单元包括第三电极单元和第四内部电极，并且第二电容器单元包括至少一个电容器元件，其具有重复层叠的一对第三和第四内部电极，并且第一电容器单元的电容器元件中的至少一个与其他电容器元件不同第一电容器单元的第一和第二内部电极的叠层数或谐振频率。

39. 发明授权

US08194389B2 Multilayer chip capacitor including two terminals 有权
标题翻译：多层片式电容器包括两个端子
公开(公告)号：US08194389B2
公开(公告)日：2012-06-05
申请号：US12245865
申请日：2008-10-06
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/06 , H01G4/228
CPC分类号： H01G4/005 , H01G4/30
摘要： A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.
摘要翻译：一种多层片状电容器包括：电容器主体，包括彼此面对的第一和第二较长侧表面;以及彼此面对的第一和第二短边表面，分别设置在第一和第二长边侧表面的第一和第二外部电极，每个电极对包括第一和第二内部电极，以及一个或多个第二内部电极对，每个包括第三和第四内部电极。第一至第四内部电极各自具有一个引线并且沿堆叠方向依次布置。第一至第四内部电极具有分别延伸到第一至第四角部或与其相邻的部分的第一至第四引线，并且与第一和第二外部电极交替连接。第一内部电极对和第二内部电极对使得电流相对于长边方向在相反的方向上斜向流动。

40. 发明授权

US08184444B2 Electrode pad for mounting electronic component and structure for mounting electronic component 有权
标题翻译：用于安装电子部件的电极垫和用于安装电子部件的结构
公开(公告)号：US08184444B2
公开(公告)日：2012-05-22
申请号：US12425068
申请日：2009-04-16
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H05K1/0231 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611
摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.
摘要翻译：提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

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