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    • 33. 发明授权
    • Manufacturing method of semiconductor device and manufacturing method of mask
    • 半导体器件的制造方法和掩模的制造方法
    • US08435702B2
    • 2013-05-07
    • US12563265
    • 2009-09-21
    • Tsuneo TerasawaTakeshi Yamane
    • Tsuneo TerasawaTakeshi Yamane
    • G03F1/00
    • G03F1/24B82Y10/00B82Y40/00Y10T403/13
    • Provided is a technique capable of improving the dimensional accuracy of a transfer pattern in a lithography technique in which EUV light is used and the EUV light is incident obliquely on a mask and an image of the EUV light reflected from the mask is formed on a semiconductor substrate (resist film), thereby transferring the pattern formed on the mask onto the semiconductor substrate. The present invention is based on a lithography technique in which EUV light is used and an exposure optical system in which the EUV light is obliquely incident on a mask is used. In this lithography technique, an absorber and a difference in level are formed on the mask, and a projective component projected on a mask surface out of a direction cosine component of the incident light is set to be almost orthogonal to an extending direction of the difference in level.
    • 提供了一种技术,其能够提高使用EUV光的光刻技术中的转印图案的尺寸精度,并且EUV光倾斜地入射到掩模上,并且在半导体上形成从掩模反射的EUV光的图像 衬底(抗蚀剂膜),从而将形成在掩模上的图案转印到半导体衬底上。 本发明基于使用EUV光的光刻技术和其中EUV光倾斜入射在掩模上的曝光光学系统。 在该光刻技术中,在掩模上形成吸收体和水平差,并且投射到入射光的方向余弦分量的掩模表面上的投射分量被设定为与差异的延伸方向几乎正交 在水平。
    • 35. 发明申请
    • MASK INSPECTION METHOD AND MASK INSPECTION APPARATUS
    • 屏蔽检查方法和面罩检查装置
    • US20120218543A1
    • 2012-08-30
    • US13403105
    • 2012-02-23
    • Takeshi YAMANETsuneo Terasawa
    • Takeshi YAMANETsuneo Terasawa
    • G01J3/00G01N21/00
    • G01N21/956G01N2021/8822G01N2021/95676
    • According to one embodiment, a method of detecting a defect of a semiconductor exposure mask includes acquiring a background intensity from a surface height distribution of the mask, acquiring a standard background intensity distribution from the background intensity, making light of an arbitrary wavelength incident on the mask, and acquiring an image at a position of interest of the mask, acquiring background intensity raw data, based on a signal intensity of the acquired image at the position of interest and a mean value of image intensity data in a peripheral area of the position of interest, finding a correction coefficient of the signal intensity, based on a ratio of the background intensity raw data to the standard background intensity distribution, correcting the signal intensity by multiplying the signal intensity.
    • 根据一个实施例,一种检测半导体曝光掩模的缺陷的方法包括从掩模的表面高度分布获取背景强度,从背景强度获取标准背景强度分布,使入射到 掩模,并且获取所述掩模的感兴趣位置处的图像,基于感兴趣位置处获取的图像的信号强度和所述位置的周边区域中的图像强度数据的平均值来获取背景强度原始数据 根据背景强度原始数据与标准背景强度分布的比率,求出信号强度的校正系数,通过乘以信号强度来校正信号强度。
    • 39. 发明申请
    • MASK DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS
    • 掩蔽缺陷检查方法和缺陷检查装置
    • US20120063667A1
    • 2012-03-15
    • US13230030
    • 2011-09-12
    • Takeshi YAMANETsuneo Terasawa
    • Takeshi YAMANETsuneo Terasawa
    • G06K9/00
    • G01N21/956G01N2021/95676
    • According to one embodiment, in a method for inspecting a defect of an exposure mask, using an optical system which acquires a dark-field image, an arbitrary partial region where a uniform dark-field image is obtained on the mask is allocated at a defocus position to acquire an image. A detection threshold is decided using signal intensities of the acquired image and an area ratio between a desired inspection region and the partial region, so that a signal count indicating signal intensities greater than the detection threshold in the inspection region is less than a target false detection count. The mask is allocated in a just-in-focus position to acquire an image of the inspection region. A signal having a signal intensity of the acquired image, which indicates an intensity greater than the detection threshold, is determined as a defect.
    • 根据一个实施例,在用于检查曝光掩模的缺陷的方法中,使用获取暗视场图像的光学系统,在掩模上获得均匀的暗场图像的任意部分区域被分配在散焦 获取图像的位置。 使用所获取的图像的信号强度和期望检查区域和部分区域之间的面积比来确定检测阈值,使得指示在检查区域中大于检测阈值的信号强度的信号计数小于目标错误检测 计数。 掩模被分配在刚刚聚焦位置以获取检查区域的图像。 具有指示强度大于检测阈值的获取图像的信号强度的信号被确定为缺陷。
    • 40. 发明申请
    • Image input apparatus and inspection apparatus
    • 图像输入装置和检查装置
    • US20050196059A1
    • 2005-09-08
    • US11064014
    • 2005-02-24
    • Hiromu InoueTsuneo TerasawaShinichi ImaiTakehiko Nomura
    • Hiromu InoueTsuneo TerasawaShinichi ImaiTakehiko Nomura
    • G01B11/24G01N21/956G06K9/36G06T1/00H01L21/66
    • G03F7/70616G01N21/9501G01N21/956G01N2021/95676
    • An image input apparatus for inputting an image of an object and outputting the image as an electric signal, the image input apparatus comprises a stage which supports the object, a laser interferometer which measures a position of the stage, a light source which emits a pulse light, an illumination optical system which irradiates the object with an illuminating light, a sensor which converts an image-formed optical image into an electric image signal, an imaging optical system which forms an image of the object on the sensor, a synchronization control circuit which controls a light-emission interval of the light source and synchronization of the sensor on the basis of position information of the laser interferometer, a light quantity monitor which measures a quantity of light, and a light quantity correction circuit which corrects the electric image signal on the basis of an output of the light quantity monitor.
    • 一种用于输入对象的图像并输出图像作为电信号的图像输入装置,所述图像输入装置包括支撑所述对象的平台,测量所述平台位置的激光干涉仪,发出脉冲的光源 光,将照明光照射到物体上的照明光学系统,将图像形成的光学图像转换为电子图像信号的传感器,在传感器上形成物体的图像的成像光学系统,同步控制电路 其基于激光干涉仪的位置信息,测量光量的光量监视器和校正电图像信号的光量校正电路来控制光源的发光间隔和传感器的同步 基于光量监视器的输出。