专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20050029666A1 Semiconductor device structural body and electronic device 审中-公开
标题翻译：半导体器件结构体和电子器件
公开(公告)号：US20050029666A1
公开(公告)日：2005-02-10
申请号：US10487990
申请日：2002-08-27
申请人： Yasutoshi Kurihara , Yoshimasa Takahashi , Tsuneo Endoh , Mikio Negishi , Masashi Yamaura , Hirokazu Nakajima , Yosuke Sakurai , Hironori Kodama
发明人： Yasutoshi Kurihara , Yoshimasa Takahashi , Tsuneo Endoh , Mikio Negishi , Masashi Yamaura , Hirokazu Nakajima , Yosuke Sakurai , Hironori Kodama
IPC分类号： B23K35/02 , B23K35/26 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/367 , H01L23/495 , H01L23/498 , H01L23/552 , H01L23/64 , H05K3/28 , H05K3/34 , H01L23/48
CPC分类号： H01L24/85 , B23K35/0244 , B23K35/262 , C04B37/026 , C04B2237/12 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/127 , C04B2237/368 , C04B2237/401 , C04B2237/407 , C04B2237/708 , C04B2237/72 , H01L21/561 , H01L21/563 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/3677 , H01L23/49575 , H01L23/49805 , H01L23/552 , H01L23/642 , H01L24/01 , H01L24/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/133 , H01L2224/13339 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29223 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29249 , H01L2224/29255 , H01L2224/29264 , H01L2224/29266 , H01L2224/2927 , H01L2224/29272 , H01L2224/293 , H01L2224/29339 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4912 , H01L2224/49175 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81801 , H01L2224/85 , H01L2224/85203 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/35121 , H05K3/284 , H05K3/3442 , H05K3/3484 , H05K2201/0215 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/01014 , H01L2924/01028 , H01L2224/83 , H01L2224/92247 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/01029
摘要： A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.
摘要翻译：公开了一种半导体器件，其中将粘合芯片部件和布线部件的焊料层封装在树脂层中，并且焊料层由金属粉末分布在基体金属中的复合体构成。当将其中芯片部件与焊料一起安装在布线部件中的半导体器件时，将树脂密封的焊接部件二次安装在外部布线部件上，由于流出而导致焊料的流出和短路，可以防止切断部件和芯片部件的位移。

32. 发明申请

US20050019161A1 Rotary fluid machine 审中-公开
标题翻译：旋转流体机
公开(公告)号：US20050019161A1
公开(公告)日：2005-01-27
申请号：US10489641
申请日：2002-09-20
申请人： Hiroshi Ichikawa , Tsuneo Endoh , Tsutomu Takahashi , Yasunari Kimura
发明人： Hiroshi Ichikawa , Tsuneo Endoh , Tsutomu Takahashi , Yasunari Kimura
IPC分类号： F01L33/02 , F01B13/06 , F01C1/344 , F01C11/00 , F01C20/14 , F01C21/02 , F01C21/08 , F01C21/18 , F01K7/00 , F02B53/00 , F04B1/047 , F04B53/00 , F04B53/10 , F04C18/344 , F01D25/00
CPC分类号： F01C21/18 , F01B13/061 , F01B13/068 , F01C1/3446 , F01C11/006 , F01C21/08 , F02B53/00 , F04B1/047 , F04C2230/602 , F04C2240/601 , F04C2240/605
摘要： A rotary fluid machine is provided that includes a rotor rotatably housed within a casing, a hollow rotating shaft (113) that rotates integrally with the rotor, and a fixed shaft (102) that is relatively rotatably fitted into the inner periphery of the rotating shaft (113); wherein the fixed shaft (102) is floatingly supported in the casing via a fixed shaft support spring (95) having an alignment action. When rotational runout of the rotor is transmitted to the fixed shaft (102) via the rotating shaft (113), the alignment action of the fixed shaft support spring (95) suppresses the rotational runout of the rotor, and any increase in the frictional resistance in a sliding section between the rotating shaft (113) and the fixed shaft (102) and the occurrence of abnormal wear can be prevented effectively, and the leakage of steam from a rotary valve (V) provided on the sliding surfaces of the rotating shaft (113) and the fixed shaft (102) can be reduced.
摘要翻译：本发明提供一种旋转流体机械，其具有可旋转地容纳在壳体内的转子，与转子一体地旋转的中空旋转轴（113），以及相对旋转自如地嵌合在旋转轴的内周的固定轴（113）; 其中所述固定轴（102）经由具有对准作用的固定轴支撑弹簧（95）浮动地支撑在所述壳体中。当转子的旋转跳动通过旋转轴（113）传递到固定轴（102）时，固定轴支撑弹簧（95）的对准作用抑制转子的旋转跳动，并且摩擦阻力的任何增加在旋转轴（113）和固定轴（102）之间的滑动部分中，可以有效地防止异常磨损的发生，并且蒸汽从设置在旋转轴的滑动表面上的旋转阀（V）泄漏（113）和固定轴（102）可以减小。

33. 发明授权

US06846163B2 Rotary fluid machine having rotor segments on the outer periphery of a rotor core 失效
标题翻译：旋转流体机械在转子芯的外周上具有转子段
公开(公告)号：US06846163B2
公开(公告)日：2005-01-25
申请号：US10363649
申请日：2001-09-04
申请人： Tsutomu Takahashi , Kensuke Honma , Naoki Itoh , Tsuneo Endoh
发明人： Tsutomu Takahashi , Kensuke Honma , Naoki Itoh , Tsuneo Endoh
IPC分类号： F01B13/06 , F01C1/344 , F01C11/00 , F01C21/08 , F02G5/00 , F04B27/06 , F04C23/00 , F04B23/10 , F01B21/04
CPC分类号： F01C21/0836 , F01B13/061 , F01B13/068 , F01C1/3446 , F01C11/006 , F02G5/00 , Y02T10/166
摘要： In a rotary fluid machine including pistons (37) reciprocally received in cylinders (33) provided in a rotor (27), and vanes (44) fitted in vane grooves provided in the rotor (27) for reciprocal movement, the rotor (27) includes a rotor core (31) which is supported on a rotary shaft (21) and in which the cylinders (33) are accommodated, and twelve rotor segments (32) separated in a circumferential direction and fixed to surround an outer peripheral surface of the rotor core (31); and each of the vane grooves (43) is defined between the adjacent rotor segments (32). Thus, the dimensional accuracy of the vane grooves (43) can be enhanced without need for a special accurate working or processing. In addition, the transmission of heat from the rotor core (31) of a relatively high temperature to the rotor segments (32) of a relatively low temperature can be blocked, whereby the dissipation of the heat to the outside of the rotor (27) can be suppressed, leading to an enhancement in heat efficiency, and moreover, the thermal deformation of various portions of the rotor (27) can be moderated.
摘要翻译：在包括设置在转子（27）中的气缸（33）中往复运动的活塞（37）和安装在转子（27）中用于往复运动的叶片槽中的叶片（44）的旋转流体机械中，转子包括支撑在旋转轴（21）上并且容纳有气缸（33）的转子铁心（31）和沿圆周方向分离并固定以包围气缸（33）的外周面的十二个转子段（32）转子芯（31）; 并且每个叶片槽（43）被限定在相邻的转子段（32）之间。因此，可以提高叶片槽（43）的尺寸精度，而不需要特殊的精确加工或加工。此外，可以阻止从较高温度的转子铁芯（31）向较低温度的转子段（32）传递热量，由此将热量散发到转子（27）的外部，可以抑制热效率的提高，而且能够缓和转子（27）的各部分的热变形。

34. 发明授权

US06725662B2 Drive device 失效
标题翻译：驱动装置
公开(公告)号：US06725662B2
公开(公告)日：2004-04-27
申请号：US10149065
申请日：2002-11-14
申请人： Tsuyoshi Baba , Hiroyuki Niikura , Yasunobu Kawakami , Hiroyuki Horimura , Tsuneo Endoh
发明人： Tsuyoshi Baba , Hiroyuki Niikura , Yasunobu Kawakami , Hiroyuki Horimura , Tsuneo Endoh
IPC分类号： F02G300
CPC分类号： F02B41/10 , F01K23/065 , F02G5/04 , F25B27/02 , Y02A30/274 , Y02T10/163 , Y02T10/166 , Y10T477/23
摘要： In a drive system, there is provided a waste heat recovering device forming a Rankine cycle by an evaporator for heating water with waste heat of an internal combustion engine to generate high-pressure vapor, the internal combustion engine being connected to a transmission, a displacement-type expander for converting high-pressure vapor generated by the evaporator to an output with constant torque, a condenser for liquefying low-pressure vapor discharged from the expander, and a feed pump for supplying water liquefied by the condenser to the evaporator. The expander is connected to a power generator/motor via a planetary gear mechanism, and the expander is connected to an output shaft of the internal combustion engine via the planetary gear mechanism and a belt-type continuously variable transmission. A change gear ratio of the belt-type continuously variable transmission is controlled such that a rotational speed of the internal combustion engine and a rotational speed of the expander are matched with each other and are transmitted to the transmission. Hence, it is possible to effectively drive the driven portion by using the output of the expander of the waste heat recovering device.
摘要翻译：在驱动系统中，提供了一种通过蒸发器形成兰金循环的废热回收装置，用于对内燃机的废热进行加热的水，以产生高压蒸汽，内燃机连接到变速器，排量型膨胀器，用于将由蒸发器产生的高压蒸气转换成具有恒定转矩的输出，用于液化从膨胀器排出的低压蒸汽的冷凝器，以及用于将由冷凝器液化的水供应到蒸发器的进料泵。膨胀机通过行星齿轮机构与发电机/电动机连接，膨胀机通过行星齿轮机构和带式无级变速器与内燃机的输出轴连接。控制带式无级变速器的变速比，使得内燃机的转速和膨胀机的转速相互匹配，并传递给变速器。因此，可以通过使用废热回收装置的膨胀机的输出来有效地驱动从动部。

35. 发明授权

US5908012A Combustion control device for an engine 失效
标题翻译：发动机燃烧控制装置
公开(公告)号：US5908012A
公开(公告)日：1999-06-01
申请号：US973825
申请日：1998-04-30
申请人： Tsuneo Endoh
发明人： Tsuneo Endoh
IPC分类号： F02B1/04 , F02B21/02 , F02B23/00 , F02B23/08 , F02B29/00 , F02B29/04 , F02B75/04 , F02B75/16 , F02B75/30 , F02D15/02 , F02D15/04 , F02D45/00 , F02F3/00 , F02M31/20
CPC分类号： F02B21/02 , F02B29/00 , F02B29/0475 , F02B29/0481 , F02B75/044 , F02B75/16 , F02D15/02 , F02D15/04 , F02F3/0015 , F02M31/20 , F02B1/04 , Y02T10/12 , Y02T10/126 , Y02T10/146
摘要： A sub-piston 19 is supported movably in the upward and downward direction on an upper end of a main piston 4 to define an air-fuel mixture cooling chamber 20 between the pistons 4 and 19. The air-fuel mixture cooling chamber 20 communicates with a peripheral edge of a combustion chamber 12. The sub-piston 19 is connected to a cam member 23 which is supported on a crankshaft 7 through a subsidiary connecting rod 21. The volume of the air-fuel mixture cooling chamber 20 is increased and decreased in operative association with the rotation of the crankshaft 7. The air-fuel mixture cooling chamber 20 has an increased volume in a phase from a compression stroke to a point immediately after ignition, and the generation of a knocking is prevented by cooling an air-fuel mixture filled in such air-fuel mixture cooling chamber 20. The volume of the air-fuel mixture cooling chamber 20 is decreased from the instant immediately after ignition, thereby causing the air-fuel mixture in the air-fuel mixture cooling chamber 20 to be pushed into the combustion chamber 12 and burned therein. Thus, even if the compression ratio is increased and the ignition timing is advanced to provide an enhancement in thermal efficiency, it can be ensured that a knocking is difficult to occur.
摘要翻译： PCT No.PCT / JP96 / 01558 Sec。 371日期：1998年4月30日 102（e）1998年4月30日PCT PCT 1996年6月7日PCT公布。 WO96 / 41939 PCT公开号日期1996年12月27日副活塞19在主活塞4的上端沿上下方向可动地支撑，以在活塞4和19之间形成空气 - 燃料混合物冷却室20.空气 - 燃料混合物冷却室20与燃烧室12的周缘连通。副活塞19与凸轮构件23连接，凸轮构件23通过辅助连接杆21支撑在曲轴7上。空气 - 燃料混合物冷却室的体积 20与曲轴7的旋转有关联地增加和减少。空气 - 燃料混合物冷却室20在从压缩冲程到紧接着点火之后的阶段具有增加的体积，并且防止产生爆震通过冷却填充在这种空气 - 燃料混合物冷却室20中的空气燃料混合物。空气 - 燃料混合物冷却室20的体积从点火之后的瞬间减小，从而使空气 - 燃料混合物在空气 - 燃料混合物冷却室20中被推入燃烧室12并在其中燃烧。因此，即使增加压缩比并提高点火正时以提高热效率，也可以确保难以发生爆震。

36. 发明授权

US4785533A Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same 失效
标题翻译：混合集成电路器件及其制造方法及引线框架
公开(公告)号：US4785533A
公开(公告)日：1988-11-22
申请号：US15327
申请日：1987-02-17
申请人： Mituaki Seino , Tsuneo Endoh
发明人： Mituaki Seino , Tsuneo Endoh
IPC分类号： H05K3/34 , H05K3/36 , H05K3/40 , H01R43/00 , H05K1/11
CPC分类号： H05K3/366 , H01R12/58 , H05K2201/09045 , H05K2201/09163 , H05K2201/10386 , H05K2201/10946 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , Y10T29/49121
摘要： The present invention resides in a hybrid integrated circuit device comprising; a plurality of electronic parts; a wiring board mounting the plurality of electronic parts on the primary front surface thereof; and a plurality of leads secured to the edge of the wiring board, the device being featured in that a fixing section of each of the leads consists of a main fixing portion secured to the primary rear surface of the wiring board, and an auxiliary fixing portion secured to the side face of the wiring board, the auxiliary fixing portion of the lead being branched from the main fixing portion thereof such that the branched auxiliary fixing portion is bent at an angle of approximately 90.degree. with respect to the main fixing portion. This provides the hybrid integrated circuit device in which the leads have the enhanced connection strength against the wiring board, and the wiring board has a lower mounted height.
摘要翻译：本发明涉及一种混合集成电路装置，包括：多个电子部件; 将多个电子部件安装在其主前表面上的布线板; 以及固定在所述布线板的边缘的多个引线，其特征在于，每个所述引线的固定部分由固定到所述布线板的主后表面的主固定部分和辅助固定部分固定到布线板的侧面，引线的辅助固定部分从主固定部分分支，使得分支辅助固定部分相对于主固定部分以大约90度的角度弯曲。这提供了混合集成电路器件，其中引线对布线板具有增强的连接强度，并且布线板具有较低的安装高度。

37. 发明授权

US07281380B2 Heat exchange device 失效
标题翻译：换热装置
公开(公告)号：US07281380B2
公开(公告)日：2007-10-16
申请号：US10496078
申请日：2002-11-01
申请人： Masashi Shinohara , Tsuneo Endoh , Atsushi Baba
发明人： Masashi Shinohara , Tsuneo Endoh , Atsushi Baba
IPC分类号： F01K23/10
CPC分类号： F02D41/3005 , F01N3/043 , F01N5/02 , F01N2240/02 , F01P3/12 , F01P3/22 , F01P2060/16 , F02D41/1454 , F02G5/02 , F22B1/1807 , Y02E20/363 , Y02T10/16 , Y02T10/166 , Y02T10/20
摘要： A heat exchange system is provided that includes an evaporator (11) that carries out heat exchange between exhaust gas discharged from an exhaust port (16B) and water, exhaust gas passages (87, 88) on the upstream side in the direction of flow of the exhaust gas being disposed on the radially inner side, an exhaust gas passage (89) on the downstream side being disposed on the radially outer side, and an oxygen concentration sensor cooling portion (92) for cooling a mounting section of an oxygen concentration sensor (91) facing the exhaust gas passage (87) on the most upstream side being positioned on the radially outer side of the exhaust gas passage (87). Water is supplied separately to a water passage (W3) of the evaporator (11) and a water passage (W4) of the oxygen concentration sensor cooling portion (92), and the water passage (W3) of the evaporator (11) is arranged so that the direction of flow of the water is opposite to the direction of flow of the exhaust gas. It is thereby possible to improve the waste heat recovery efficiency of the evaporator (11) that carries out heat exchange between the exhaust gas of an internal combustion engine and water and, in particular, to minimize the escape of heat via the oxygen concentration sensor (91) for detecting the condition of the exhaust gas.
摘要翻译：提供了一种热交换系统，其包括在排气口（16B）排出的废气与水之间进行热交换的蒸发器（11），在流动方向上游侧的排气通路（87,88）的排气在径向内侧配置，下游侧的排气通路（89）配置在径向外侧，氧浓度传感器冷却部（92），用于冷却氧浓度的安装部位于排气通道（87）的径向外侧上的最上游侧的排气通路（87）的传感器（91）。水分别供给蒸发器（11）的水通道（W 3）和氧浓度传感器冷却部分（92）的水通道（W 4）和蒸发器（11）的水通道（W 3））被布置成使得水的流动方向与废气的流动方向相反。由此，能够提高在内燃机的废气与水之间进行热交换的蒸发器（11）的废热回收效率，特别是通过氧浓度传感器使热量逸出最小化 91），用于检测废气的状况。

38. 发明授权

US07176579B2 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US07176579B2
公开(公告)日：2007-02-13
申请号：US10733581
申请日：2003-12-12
申请人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
发明人： Satoru Konishi , Tsuneo Endoh , Hirokazu Nakajima , Masaaki Tsuchiya
IPC分类号： H01L23/538 , H01L23/58
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H05K1/0206 , H05K1/0298 , H05K1/183 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.
摘要翻译：本发明实现了半导体模块的小型化。半导体模块包括在其下表面上具有外部电极端子和散热垫的模块板，其中包括其中的高频功率放大装置的初级晶体管的第一半导体芯片，包含下一级的第二半导体芯片晶体管和其中的最后级晶体管，以及构成匹配电路的集成无源器件。第一半导体芯片和第二半导体芯片和集成无源器件中的至少一个以重叠的方式安装在模块板的上表面上。

40. 发明申请

US20060145352A1 Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：US20060145352A1
公开(公告)日：2006-07-06
申请号：US11338529
申请日：2006-01-23
申请人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人： Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号： H01L23/48
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/262 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/00013 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K2201/0215 , H05K2201/0218 , H05K2201/045 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669
摘要： In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
摘要翻译：在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物，金属球通过化合物结合在一起。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式