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31. 发明申请

US20120104613A1 BONDING WIRE FOR SEMICONDUCTOR DEVICE 有权
标题翻译：用于半导体器件的接合线
公开(公告)号：US20120104613A1
公开(公告)日：2012-05-03
申请号：US13349155
申请日：2012-01-12
申请人： Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi
发明人： Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi
IPC分类号： H01L23/532
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
摘要： It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.
摘要翻译：本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄用于细间距连接。接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同。外层的厚度为0.021〜0.12μm。

32. 发明申请

US20120094121A1 COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR 有权
标题翻译：铜合金接线用于半导体
公开(公告)号：US20120094121A1
公开(公告)日：2012-04-19
申请号：US13380123
申请日：2010-06-23
申请人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Daizo Oda
发明人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Daizo Oda
IPC分类号： C22C9/08 , B32B15/20
CPC分类号： B23K35/302 , B21C1/003 , B21C37/047 , B23K35/0261 , C22C9/00 , C22F1/08 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/4321 , H01L2224/435 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48507 , H01L2224/4851 , H01L2224/48599 , H01L2224/48624 , H01L2224/48824 , H01L2224/85181 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20755 , Y10T428/2958 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/013 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01012
摘要： The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity/temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities.
摘要翻译：本发明是用于半导体元件的铜基接合线。本发明的接合线可以以廉价的材料成本制造，并且在高湿度/温度环境中具有优异的PCT可靠性。此外，本发明的接合线通过热循环试验表现出良好的TCT可靠性; 有利的压合球形; 有利的楔形粘合性; 良好的循环成形性等。具体地，本发明的接合线是通过拉伸含有0.13〜1.15质量％的Pd，余量由铜和不可避免的杂质构成的铜合金制造的半导体用铜合金接合线。

33. 发明授权

US08112190B2 Boat control system and boat 有权
标题翻译：船控系统和船
公开(公告)号：US08112190B2
公开(公告)日：2012-02-07
申请号：US12109369
申请日：2008-04-25
申请人： Takashi Yamada
发明人： Takashi Yamada
IPC分类号： B60L3/00
CPC分类号： B63H21/213 , B63H20/00 , B63H21/22
摘要： A boat control system detects a wire break status in a duplicated communication system. A hull of a boat is provided with a main remote control side ECU and a subremote control side ECU, and the subremote control side ECU communicates with an engine side ECU via the main remote control side ECU. Both of the remote control side ECUs are provided with storage buffers in which communication status confirmation data transmitted between nodes is stored. A broken wire detection section of the engine side ECU starts a determination when a system is started, and broken wire detection sections of both of the remote control side ECUs start a determination when communication status confirmation data is received from another node. Data indicating that communication is in an abnormal status is stored as an initial value in a main remote control data storage buffer.
摘要翻译：船控系统检测重复通信系统中的断线状态。船体具有主遥控侧ECU和副遥控侧ECU，副翼控制侧ECU经由主遥控侧ECU与发动机侧ECU通信。两个遥控侧ECU都设置有存储缓冲器，其中存储有节点之间传输的通信状态确认数据。发动机侧ECU的断线检测部在系统起动时开始判定，并且当从另一节点接收到通信状态确认数据时，两个遥控侧ECU的断线检测部开始判定。指示通信处于异常状态的数据作为初始值存储在主遥控数据存储缓冲器中。

34. 发明申请

US20110310058A1 OBJECT DISPLAY DEVICE 审中-公开
标题翻译：对象显示设备
公开(公告)号：US20110310058A1
公开(公告)日：2011-12-22
申请号：US13203457
申请日：2010-02-25
申请人： Takashi Yamada , Tomotake Aono
发明人： Takashi Yamada , Tomotake Aono
IPC分类号： G06F3/041
CPC分类号： G06F3/04845 , G06F3/0414 , G06F3/0482 , G06F3/0488 , G06F3/04883
摘要： An object display device is disclosed. An object display device includes a display unit, a detection unit and a control unit. The display unit is configured to display an object. The detection unit is configured to detect a location and a load of a pressing to the display unit. The control unit can control a movement of the object based on conditions of first and second pressings.
摘要翻译：公开了一种物体显示装置。目标显示装置包括显示单元，检测单元和控制单元。显示单元被配置为显示对象。检测单元被配置为检测对显示单元的按压的位置和负载。控制单元可以基于第一和第二按压的条件来控制物体的移动。

35. 发明申请

US20110274603A1 EXHAUST GAS PURIFICATION CATALYST, EXHAUST GAS PURIFICATION APPARATUS USING THE SAME AND EXHAUST GAS PURIFICATION METHOD 审中-公开
标题翻译：排气净化催化剂，使用其的排气净化装置和排气净化方法
公开(公告)号：US20110274603A1
公开(公告)日：2011-11-10
申请号：US13142354
申请日：2010-01-26
申请人： Akira Kohara , Yoshiro Hirasawa , Takashi Yamada
发明人： Akira Kohara , Yoshiro Hirasawa , Takashi Yamada
IPC分类号： B01D53/94 , B01J29/04 , B01J21/12 , B01J21/06 , B01J21/08
CPC分类号： B01D53/945 , B01D2255/1023 , B01D2255/1025 , B01D2255/2042 , B01D2255/2092 , B01D2255/407 , B01D2258/014 , B01J23/002 , B01J23/63 , B01J35/0006 , B01J35/002 , B01J2523/00 , F01N2370/02 , F01N2510/06 , Y02A50/2324 , Y02T10/22 , B01J2523/25 , B01J2523/31 , B01J2523/3712 , B01J2523/48 , B01J2523/824 , B01J2523/828
摘要： An exhaust gas purification catalyst, which is suitable as a Three Way Catalyst for efficiently purifying carbon monoxide (CO), hydrocarbons (HC), and nitrogen oxides (NOx) in exhaust gas discharged from a gasoline automobile, an exhaust gas purification apparatus using the same and an exhaust gas purification method.It is provided by an exhaust gas purification catalyst, wherein catalyst components for purifying hydrocarbons (HC), carbon monoxide (CO) and nitrogen oxides (NOx) contained in exhaust gas are coated onto a honeycomb type structure as a catalyst composition layer, characterized in that the catalyst components comprise an activated metal (A), a heat resistant inorganic oxide (B) and a cerium-zirconium composite oxide (c) containing a pyrochlore phase in a crystal structure, in the same catalyst composition layer, and the activated metal (A) is a palladium and a rhodium and does not contain a platinum.
摘要翻译：一种废气净化催化剂，其适合作为用于有效地净化从汽油车辆排出的废气中的一氧化碳（CO），烃（HC）和氮氧化物（NOx））的三元催化剂，使用相同的废气净化方法。由废气净化催化剂提供，其中将用于净化废气中的烃（HC），一氧化碳（CO）和氮氧化物（NOx））的催化剂组分涂覆到作为催化剂组合物层的蜂窝型结构上，其特征在于催化剂组分包含在同一催化剂组合物层中的在晶体结构中含有烧绿石相的活化金属（A），耐热无机氧化物（B）和铈锆复合氧化物（c），活化金属（A）是钯和铑，不含铂。

36. 发明授权

US08004094B2 Copper alloy bonding wire for semiconductor device 有权
标题翻译：用于半导体器件的铜合金接合线
公开(公告)号：US08004094B2
公开(公告)日：2011-08-23
申请号：US12892122
申请日：2010-09-28
申请人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
发明人： Tomohiro Uno , Keiichi Kimura , Takashi Yamada
IPC分类号： H01L21/00
CPC分类号： H01L24/85 , B23K35/302 , B23K2103/12 , C22C9/00 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/05639 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45647 , H01L2224/45663 , H01L2224/45687 , H01L2224/45693 , H01L2224/48227 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01205 , H01L2924/01206 , H01L2924/10253 , H01L2924/20752 , H01L2924/20755 , H01L2924/20756 , H01L2924/01008 , H01L2924/01004 , H01L2924/01013 , H01L2924/01025 , H01L2924/01039 , H01L2924/00015 , H01L2924/00 , H01L2924/013 , H01L2924/00014 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01055 , H01L2924/00013
摘要： The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass productivity. The semiconductor-device copper-alloy bonding wire contains at least one of Mg and P in total of 10 to 700 mass ppm, and oxygen within a range from 6 to 30 mass ppm.
摘要翻译：本发明提供了一种廉价的材料成本的半导体器件铜合金接合线，确保了优异的球接合形状，线接合特性等，并且具有良好的环形成特性，并且具有优异的批量生产率。半导体装置铜合金接合线含有总共10〜700质量ppm的Mg和P中的至少一种，氧在6〜30质量ppm的范围内。

37. 发明授权

US08000097B2 Information processing device and disk drive device 失效
标题翻译：信息处理装置和磁盘驱动装置
公开(公告)号：US08000097B2
公开(公告)日：2011-08-16
申请号：US12082174
申请日：2008-04-09
申请人： Kazuyuki Yamamoto , Toshio Mamiya , Hidetoshi Kabasawa , Katsuhiko Yamada , Takashi Yamada , Hideaki Kumagai
发明人： Kazuyuki Yamamoto , Toshio Mamiya , Hidetoshi Kabasawa , Katsuhiko Yamada , Takashi Yamada , Hideaki Kumagai
IPC分类号： G06F1/16
CPC分类号： G11B33/025 , G11B17/0288 , G11B17/056
摘要： An information processing device is provided. The device includes an upper enclosure; a lower enclosure which supports the upper enclosure with a varied attitude and on which the upper enclosure may be superposed; a disk drive device stored in the upper or lower enclosure and having a disk mounting part on which a disk-shaped recording medium is detachably mounted; and an enclosure moving mechanism setting a disk storage region to have a first thickness with the upper enclosure allowed to have a distance from the lower enclosure when the disk drive device is used and setting the disk storage region to have a second thickness smaller than the first thickness with the upper enclosure allowed to come close to the lower enclosure to reduce the disk storage region when the disk drive device is not used.
摘要翻译：提供信息处理装置。该装置包括上部外壳; 下部外壳，其以不同的姿态支撑上部外壳，并且上部外壳可以叠置在该外壳上; 存储在上壳体或下壳体中并且具有盘安装部分的盘驱动装置，盘形记录介质可拆卸地安装在盘安装部分上; 以及机壳移动机构，当使用所述磁盘驱动装置时，将所述磁盘存储区域设置为具有第一厚度，使所述上壳体允许与所述下壳体距离一定距离，并且将所述磁盘存储区域设置为具有小于所述第一厚度的第二厚度当不使用磁盘驱动器装置时，上壳体的厚度允许靠近下壳体以减小磁盘存储区域。

38. 发明授权

US07974502B2 Optical module and optical switch 有权
标题翻译：光模块和光开关
公开(公告)号：US07974502B2
公开(公告)日：2011-07-05
申请号：US11678175
申请日：2007-02-23
申请人： Shinji Mino , Takeshi Kitagawa , Motohaya Ishii , Takashi Yamada , Akira Himeno , Masayuki Okuno , Shunichi Souma , Takashi Goh
发明人： Shinji Mino , Takeshi Kitagawa , Motohaya Ishii , Takashi Yamada , Akira Himeno , Masayuki Okuno , Shunichi Souma , Takashi Goh
IPC分类号： G02F1/295 , G02F1/01 , G02B6/26 , G02B6/42
CPC分类号： G02F1/3132 , G02B6/29355 , G02F1/31 , G02F1/3136 , G02F2201/16 , H04Q11/0005 , H04Q2011/0013 , H04Q2011/0015 , H04Q2011/0039 , H04Q2011/0052
摘要： An optical module controls its output characteristics electrically and an optical switch constitutes the optical module. An optical waveguide circuit (PLC) and an electronic circuit (IC) for driving the PLC are mounted on the same substrate. The IC is composed of a bare chip to be molded afterward. Wiring of the IC is grouped and integrated on the PLC substrate to achieve higher density and miniaturization of the optical module.
摘要翻译：光学模块电气控制其输出特性，并且光学开关构成光学模块。用于驱动PLC的光波导电路（PLC）和电子电路（IC）安装在同一基板上。 IC由以后成型的裸芯片组成。将IC的布线分组并集成在PLC基板上，以实现更高密度和光学模块的小型化。

39. 发明申请

US20110035559A1 MEMORY CONTROLLER, MEMORY SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT, AND MEMORY CONTROL METHOD 有权
标题翻译：存储器控制器，存储器系统，半导体集成电路和存储器控制方法
公开(公告)号：US20110035559A1
公开(公告)日：2011-02-10
申请号：US12988396
申请日：2009-04-21
申请人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
发明人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
IPC分类号： G06F12/10 , G06F12/00
CPC分类号： G06F13/1642 , G06F8/4442 , G06F12/0862 , G06F2212/6022
摘要： A memory controller (101) according to this invention includes: a command generation unit (102) which generates access commands each including a physical address, based on an access request including a logical address indicating a rectangular area in image data; and a command issuance unit (105) which issues, to a memory (0), the access commands generated by the command generation unit (102). The command generation unit (102) includes a group determination unit (104) which determines a group to which a bank including data to be accessed belongs, based on the physical address corresponding to the access request. The command generation unit (102) generates a pair of a first and a second access commands which share a prefetch buffer between two banks belonging to different groups, when data to be accessed is continuous across two banks belonging to different groups.
摘要翻译：根据本发明的存储器控制器（101）包括：命令产生单元（102），其基于包括指示图像数据中的矩形区域的逻辑地址的访问请求，生成包括物理地址的访问命令; 以及向存储器（0）发出由命令生成单元（102）生成的访问命令的命令发布单元（105）。命令生成单元（102）包括：组决定单元（104），其基于与访问请求对应的物理地址，确定包含要访问的数据的存储体所属的组。命令生成单元（102）生成一对第一和第二访问命令，当要访问的数据在属于不同组的两个存储体中是连续的时，共享一个属于不同组的两个存储体之间的预取缓冲器。

40. 发明授权

US07779190B2 Arbitration device for arbitrating among a plurality of master devices, arbitration method, and video processing device including the arbitration device 有权
标题翻译：用于在多个主设备之间进行仲裁的仲裁设备，仲裁方法和包括仲裁设备的视频处理设备
公开(公告)号：US07779190B2
公开(公告)日：2010-08-17
申请号：US12559916
申请日：2009-09-15
申请人： Tetsuji Mochida , Tokuzo Kiyohara , Takashi Yamada
发明人： Tetsuji Mochida , Tokuzo Kiyohara , Takashi Yamada
IPC分类号： G06F13/00
CPC分类号： G06F13/1605
摘要： An arbitration device arbitrates among master devices such that each master device is allowed to access a shared memory at a predetermined bandwidth, and the arbitration device permits an access request in a first period that a designer has set as desired if the access request has been made by a specific master device beyond a bandwidth that has been allocated in advance. The arbitration device masks an access request from the specific master device in a second period that follows the first period.
摘要翻译：仲裁装置在主设备之间进行仲裁，使得允许每个主设备以预定带宽访问共享存储器，并且仲裁设备允许设计者在已经设置了访问请求的第一时段中设置访问请求通过特定的主设备超出已预先分配的带宽。仲裁设备在跟随第一周期的第二周期中屏蔽来自特定主设备的访问请求。

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