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31. 发明申请

US20130253852A1 METHOD OF CALIBRATING MULTI COMPONENT FORCE DETECTOR PROVIDED IN ROLLING RESISTANCE TESTING MACHINE 有权
标题翻译：校准耐磨试验机中提供的多组分力检测仪的方法
公开(公告)号：US20130253852A1
公开(公告)日：2013-09-26
申请号：US13990024
申请日：2011-12-09
申请人： Toru Okada , Takayuki Fukuda
发明人： Toru Okada , Takayuki Fukuda
IPC分类号： G01L25/00
CPC分类号： G01L25/003 , G01M17/02 , G01M17/021
摘要： A crosstalk correction coefficient of a multi component force detector provided in a rolling resistance testing machine is calibrated. A method of calibrating a multi component force detector provided in a rolling resistance testing machine including a spindle shaft to which a tire is attached, a running drum with a simulation road surface on which the tire is pressed, and a rotation torque meter provided in a rotation shaft of the running drum; in which, in performing a process of calculating a force acting on the tire from a measurement value of the multi component force detector by using a crosstalk correction coefficient that corrects an influence of crosstalk occurring in the multi component force detector, the crosstalk correction coefficient is calibrated by using a rolling test data including a rotation torque measured by the rotation torque meter and a force measured by the multi component force detector.
摘要翻译：在滚动阻力测试机中设置的多分力检测器的串扰校正系数被校准。一种校准设置在滚动阻力试验机中的多分力测力机的方法，所述滚动阻力试验机包括安装有轮胎的主轴，具有轮胎压靠在其上的模拟路面的行驶滚筒，运行滚筒的旋转轴; 其中，在通过使用校正多分力检测器中发生的串扰的影响的串扰校正系数执行从多分力检测器的测量值计算作用在轮胎上的力的处理时，串扰校正系数为通过使用包括由旋转扭矩计测量的旋转扭矩和由多分力检测器测量的力的滚动测试数据进行校准。

32. 发明授权

US08434670B2 Repair apparatus and repair method 失效
标题翻译：修理设备及维修方法
公开(公告)号：US08434670B2
公开(公告)日：2013-05-07
申请号：US12485642
申请日：2009-06-16
申请人： Toru Okada , Satoshi Emoto
发明人： Toru Okada , Satoshi Emoto
IPC分类号： B23K3/00 , B23K3/04 , B23K1/00 , B23K1/018
CPC分类号： H05K3/3494 , B23K1/012 , B23K3/04 , H05K3/225 , H05K2201/10371 , H05K2203/081
摘要： A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.
摘要翻译：修理装置包括加热头装置，其被配置为加热焊接到电路板的焊接部件。加热头装置包括加热头和由加热头加热的接触构件。接触构件由具有比加热头的热导率高的弹簧特性和导热性的材料形成。接触构件被配置成以弹性力与焊接构件的焊接表面接触，以便熔化将焊接构件接合到电路板的焊料。

33. 发明申请

US20120060356A1 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：US20120060356A1
公开(公告)日：2012-03-15
申请号：US13225902
申请日：2011-09-06
申请人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
发明人： Tohru Harada , Mitsuo Takeuchi , Hirokazu Yamanishi , Yoshiaki Yanagida , Toru Okada
IPC分类号： G01R31/28 , B23P21/00
CPC分类号： H05K13/0486 , H01L24/75 , H01L24/81 , Y10T29/49004 , Y10T29/53022
摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
摘要翻译：一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定关于第二传感器的测量结果以及电子部件的位置和倾斜度。

34. 发明授权

US08089562B2 Signal processing circuit 有权
标题翻译：信号处理电路
公开(公告)号：US08089562B2
公开(公告)日：2012-01-03
申请号：US11642903
申请日：2006-12-20
申请人： Toru Okada , Hiroyuki Ebinuma
发明人： Toru Okada , Hiroyuki Ebinuma
IPC分类号： H04N5/18 , H04N5/57 , H04N5/16
CPC分类号： H04N5/53 , H04N7/015 , H04N21/42607
摘要： A signal processing circuit includes an auto gain control circuit and amplifies a signal with an amplification ratio determined based on a synchronous signal level having a positive potential with respect to a black level included in a high definition television video signal. In consequence, during the processing of the high definition television video signal, the signal processing is performed with a desired amplification ratio.
摘要翻译：信号处理电路包括自动增益控制电路，并且以相对于包含在高清晰度电视视频信号中的黑电平具有正电位的同步信号电平确定的放大率来放大信号。因此，在处理高分辨率电视视频信号期间，以期望的放大率进行信号处理。

35. 发明授权

US07436062B2 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method 失效
标题翻译：半导体芯片元件，半导体芯片元件安装结构，半导体芯片元件安装装置及安装方法
公开(公告)号：US07436062B2
公开(公告)日：2008-10-14
申请号：US10223454
申请日：2002-08-20
申请人： Norio Kainuma , Shunji Baba , Hidehiko Kira , Toru Okada
发明人： Norio Kainuma , Shunji Baba , Hidehiko Kira , Toru Okada
IPC分类号： H01L23/48 , H01L23/04
CPC分类号： H01L24/28 , H01L21/563 , H01L24/13 , H01L24/14 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/14505 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81205 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05624 , H01L2924/00014 , H01L2224/05664
摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.
摘要翻译：一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形治疗。因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙安装。

36. 发明申请

US20060072040A1 Video signal processing circuit 有权
标题翻译：视频信号处理电路
公开(公告)号：US20060072040A1
公开(公告)日：2006-04-06
申请号：US11242772
申请日：2005-10-04
申请人： Ikuo Osawa , Yoshifumi Yoshida , Hiroyuki Ebinuma , Toru Okada
发明人： Ikuo Osawa , Yoshifumi Yoshida , Hiroyuki Ebinuma , Toru Okada
IPC分类号： H03M1/12
CPC分类号： H04N5/14 , H04N5/08 , H04N5/126 , H04N9/64
摘要： A video signal processing circuit is supplied with an analog composite video signal formed by combining at least a luminance signal with a sync signal, and processes the analog composite video signal. The video signal processing circuit has an analog filter which removes high-frequency components from the analog composite video signal, a sync separation circuit which separates a sync signal from an output signal from the analog filter, an AD converter which performs AD conversion on the analog composite video signal, and a digital video signal processing circuit which performs predetermined video signal processing on the composite video signal digitized by the AD converter, by using the sync signal obtained by the sync separation circuit.
摘要翻译：视频信号处理电路被提供有通过将至少亮度信号与同步信号组合而形成的模拟复合视频信号，并处理模拟复合视频信号。视频信号处理电路具有从模拟复合视频信号中去除高频分量的模拟滤波器，将同步信号与来自模拟滤波器的输出信号分离的同步分离电路，对模拟信号进行AD转换的AD转换器复合视频信号和数字视频信号处理电路，通过使用由同步分离电路获得的同步信号，对由AD转换器数字化的复合视频信号执行预定的视频信号处理。

37. 发明授权

US5985303A Shelf-life extender for food use 失效
标题翻译：用于食物的保质期延长剂
公开(公告)号：US5985303A
公开(公告)日：1999-11-16
申请号：US691561
申请日：1996-08-02
申请人： Toru Okada , Kenji Kuranari
发明人： Toru Okada , Kenji Kuranari
IPC分类号： A01N47/46 , A01N25/10
CPC分类号： A01N47/46
摘要： The invention provides a shelf-life extender for upholding the freshness of food, such as meat, vegetables, fruits, etc., in retail packages or in a refrigerator for an extended period of time. An isothiocyanic acid compound is supported on a matrix such as a natural mucilaginous polysaccharide or a solid organic acid and the supported compound is packaged in synthetic resin film or nonwoven fabric. The invention further provides an aqueous gel composition comprising a specified surfactant, an isothiocyanic acid compound, and a gelling agent and a hydrophobic gel composition comprising a specified hydrophobic dispersion medium, an isothiocyanic acid compound, and a gelling agent.
摘要翻译：本发明提供了一种保质期延长剂，用于在零售包装或冰箱中长期保持食物的新鲜度，例如肉类，蔬菜，水果等。将异硫氰酸化合物负载在天然粘液多糖或固体有机酸等基质上，将负载的化合物包装在合成树脂膜或无纺布中。本发明还提供一种含有特定表面活性剂，异硫氰酸化合物和胶凝剂的水凝胶组合物和包含特定疏水分散介质，异硫氰酸化合物和胶凝剂的疏水性凝胶组合物。

38. 发明授权

US4136819A Card processing apparatus 失效
标题翻译：卡处理装置
公开(公告)号：US4136819A
公开(公告)日：1979-01-30
申请号：US726753
申请日：1976-09-27
申请人： Tomohiko Torita , Toru Okada , Yuji Yokota
发明人： Tomohiko Torita , Toru Okada , Yuji Yokota
IPC分类号： G06K13/08 , G06K17/00 , G07F7/10 , G06K7/02 , G06K1/20 , G06K7/08 , G06K13/00
CPC分类号： G07F7/10 , G06K13/08 , G06K17/00 , G06Q20/347 , G07F7/1058 , G06K2017/0038 , G06K2017/0067
摘要： This specification discloses a card processing apparatus which is constructed such that a card having information recorded thereon and a paper leaf are superposedly placed on card tray movably disposed in an opening formed within the housing of the apparatus and the following card processing is carried out by pushing the card tray into the interior of the housing: first, the card and the paper leaf are separated from each other and the card alone is transported so that first information recorded on the card is read by reader means, whereafter the card is transported back to the card tray to restore its initial position; next, information extraneously entered is compared with the first information read from the card and only when the two types of information are identical, urge means is operated to urge the superposed card and paper leaf, whereby second information recorded on the card is recorded onto the paper leaf.
摘要翻译：本说明书公开了一种卡处理装置，其结构使得具有记录在其上的信息的纸张和纸张叶片重叠放置在可移动地设置在形成在装置的壳体内的开口中的卡片托盘上，并且通过推动卡片托盘进入外壳的内部：首先，卡片和纸张叶片彼此分离，并且仅传输卡片，以便通过读取器装置读取记录在卡片上的第一信息，然后卡被运送回卡盘恢复其初始位置; 接下来，将从外部输入的信息与从卡读取的第一信息进行比较，只有当两种类型的信息相同时，促使装置被操作以推动叠加的纸张和纸张，由此将记录在卡上的第二信息记录在纸叶。

39. 发明授权

US09645024B2 Method of calibrating multi component force detector provided in rolling resistance testing machine 有权
公开(公告)号：US09645024B2
公开(公告)日：2017-05-09
申请号：US13990028
申请日：2011-12-16
申请人： Toru Okada , Takayuki Fukuda
发明人： Toru Okada , Takayuki Fukuda
IPC分类号： G01L5/16 , G01L25/00 , G01M17/02
CPC分类号： G01L5/16 , G01L25/00 , G01M17/022
摘要： To calibrate a crosstalk correction coefficient of a multi-component force detector provided in a rolling resistance testing machine. A method of calibrating a multi-component force detector provided in a rolling resistance testing machine includes a spindle shaft attached with a tire, a running drum with a simulated road surface for pressing the tire thereon, and a rotation torque meter provided in a rotation shaft of the running drum, wherein when performing a process of calculating a force acting on the tire from a measurement value of the multi-component force detector using a crosstalk correction coefficient for calibrating an influence of crosstalk occurring in the multi-component force detector, the crosstalk correction coefficient is calibrated by using a rolling test data including a rotation torque measured by the rotation torque meter and a force measured by the multi-component force detector.

40. 发明授权

US08604347B2 Board reinforcing structure, board assembly, and electronic device 有权
标题翻译：板加强结构，电路板组装和电子设备
公开(公告)号：US08604347B2
公开(公告)日：2013-12-10
申请号：US13075895
申请日：2011-03-30
申请人： Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
发明人： Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
IPC分类号： H05K1/03 , H05K7/00 , H01L23/58
CPC分类号： H05K3/3436 , H01L23/562 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K2201/10674 , H05K2201/10734 , H05K2201/2009 , Y02P70/613
摘要： Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
摘要翻译：公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部形成为与其中一个凹口成形其轮廓。

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