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    • 35. 发明授权
    • Anodizing apparatus and apparatus and method associated with the same
    • 阳极氧化装置及其装置及方法
    • US06202655B1
    • 2001-03-20
    • US09282970
    • 1999-03-31
    • Kenji Yamagata
    • Kenji Yamagata
    • B08B302
    • H01L21/67086C25D11/005C25D11/32C25D17/00C25D17/001C25D17/06H01L21/02238H01L21/02255H01L21/31675H01L21/67028H01L21/6838Y10S134/902
    • A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This makes silicon substrates with various sizes processable. A silicon substrate is held by suction by reducing a pressure in a space in a groove of the suction pad by a pump (120). An opening (103) is formed in the holder (102) so that the both surfaces of the silicon substrate are brought into contact with an HF solution (115). The silicon substrate is anodized by applying a DC voltage by using a platinum electrode (109a) as a negative electrode and a platinum electrode (109b) as a positive electrode, and thereby a substrate having a porous layer is produced.
    • 由耐高温材料制成的支架(102)包括环形吸盘(105,108)。 吸盘(105)用于通过抽吸来保持小的硅衬底,并且吸盘(108)用于通过抽吸来容纳大的硅衬底。 这使得具有各种尺寸的硅衬底可加工。 通过泵(120)减小吸盘的凹槽中的空间中的压力,通过抽吸来保持硅衬底。 在保持器(102)中形成开口(103),使得硅衬底的两个表面与HF溶液(115)接触。 通过使用作为负极的铂电极(109a)和作为正极的铂电极(109b)施加直流电压来阳极氧化硅衬底,由此制造具有多孔层的衬底。
    • 36. 发明授权
    • SOI substrate processing method
    • SOI衬底处理方法
    • US06200878B1
    • 2001-03-13
    • US09211570
    • 1998-12-15
    • Kenji YamagataKiyofumi Sakaguchi
    • Kenji YamagataKiyofumi Sakaguchi
    • H01L21306
    • H01L21/0203C25D11/32H01L21/2007H01L21/76259Y10S438/96Y10S438/977
    • An object of this invention is to provide a substrate processing method capable of satisfactorily performing in etching in the step of removing a porous silicon layer by etching. In order to achieve this object, a substrate processing method includes the anodizing step of forming a porous silicon layer on a major surface of a single-crystal silicon substrate, the silicon film formation step of growing a single-crystal silicon film on the porous silicon layer, the removal step of bonding a first substrate obtained by oxidizing a surface of the single-crystal silicon film to a second substrate as a supporting substrate, and removing a single-crystal silicon portion from a lower surface side of the first substrate to expose the porous silicon layer, and the etching step of etching the exposed porous silicon layer to remove the porous silicon layer on the single-crystal silicon film, wherein in washing after the anodizing step, a time in which the first substrate is removed from the electrolytic solution and exposed to the air until washing is limited to a range in which the porous silicon layer is prevented from remaining on the single-crystal silicon film in the etching step.
    • 本发明的目的是提供一种在通过蚀刻去除多孔硅层的步骤中能够令人满意地进行蚀刻的基板处理方法。 为了实现该目的,基板处理方法包括在单晶硅基板的主表面上形成多孔硅层的阳极氧化步骤,在多孔硅上生长单晶硅膜的硅膜形成步骤 层,将通过将单晶硅膜的表面氧化的第一基板接合到作为支撑基板的第二基板的去除步骤,以及从第一基板的下表面侧去除单晶硅部分以暴露 多孔硅层,以及蚀刻暴露的多孔硅层以除去单晶硅膜上的多孔硅层的蚀刻步骤,其中在阳极氧化步骤之后的洗涤中,将第一基底从电解液中除去的时间 溶液并暴露于空气中,直到洗涤被限制在其中防止多孔硅层残留在单晶硅膜上的范围内 蚀刻步骤。
    • 37. 发明授权
    • Method for forming crystal
    • 晶体形成方法
    • US5653802A
    • 1997-08-05
    • US452863
    • 1995-05-30
    • Kenji Yamagata
    • Kenji Yamagata
    • C30B25/18C30B31/22H01L21/20H01L21/84C30B25/04
    • C30B31/22C30B25/18H01L21/02381H01L21/02488H01L21/02532H01L21/0262H01L21/02645Y10S438/974
    • A method for forming a crystal comprises implanting ions on the surface of a substrate to change the ion concentration in the depth direction of said substrate surface by said ion implantation, subjecting a desired position of said substrate surface with a sufficient area for crystal growth from a single crystal to exposure treatment to/he depth where an exposed surface having larger nucleation density than the nucleation density of the surface of said substrate is exposed, thereby forming a nucleation surface comprising said exposed surface exposed by said exposure treatment and a nonnucleation surface comprising the surface of the substrate remaining without subjected to said exposure treatment, applying a crystal growth treatment for crystal growth from a single nucleus on said substrate to grow a single crystal from said single nucleus or form a polycrystal of a mass of single crystals grown from said single nucleus.
    • 一种用于形成晶体的方法包括:在衬底的表面上注入离子以通过所述离子注入改变所述衬底表面的深度方向上的离子浓度,使所述衬底表面的所需位置具有足够的晶体生长面积 将暴露于具有比所述基板的表面的成核密度大的成核密度的暴露表面暴露于其中的单晶曝光处理,从而形成包含通过所述曝光处理曝光的所述暴露表面的成核表面和包含所述曝光处理的非成核表面 在没有进行曝光处理的情况下保留基板的表面,在所述基板上从单个核应用晶体生长的晶体生长处理以从所述单个核生长单晶,或者形成从所述单个核生长的单晶体的多晶体 核。
    • 40. 发明授权
    • Image pickup apparatus with synchronization processes
    • 具有同步过程的摄像设备
    • US08922660B2
    • 2014-12-30
    • US13352217
    • 2012-01-17
    • Kenji Yamagata
    • Kenji Yamagata
    • H04N5/33H04N5/225H04N13/02H04N5/232
    • H04N5/2251H04N5/23203H04N5/23245H04N13/239H04N13/296
    • An image pickup apparatus includes a light emitting unit and a light receiving unit, a first light path changing unit, and a second light path changing unit, wherein the first light path changing unit is movable from a first state, in which a light flux from the light emitting unit is guided toward a front direction of the image pickup apparatus, into a second state in which a light flux from the light emitting unit is guided toward a front direction and a side direction of the image pickup apparatus, and wherein the second light path changing unit is movable from a first state, in which a light flux from a front direction of the image pickup apparatus is guided to the light receiving unit, into a second state in which light fluxes from a front direction and a side direction.
    • 一种图像拾取装置包括发光单元和光接收单元,第一光路改变单元和第二光路改变单元,其中第一光路改变单元可从第一状态移动,其中来自 发光单元被引导到图像拾取装置的前方,到第二状态,其中来自发光单元的光束被引导到图像拾取装置的正面方向和侧面方向,并且其中第二 光路改变单元可以从其中来自图像拾取装置的前方的光束被引导到光接收单元的第一状态移动到从正面方向和侧面方向光束的第二状态。