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    • 31. 发明授权
    • Low latency mobile initiated tunneling handoff
    • 低延迟移动发起的隧道切换
    • US06832087B2
    • 2004-12-14
    • US10185344
    • 2002-06-28
    • Youngjune GwonDaichi FunatoGuangrui FuAtsushi Takeshita
    • Youngjune GwonDaichi FunatoGuangrui FuAtsushi Takeshita
    • H04Q720
    • H04L63/164H04W36/0011H04W36/0016H04W36/08H04W36/12H04W36/14H04W80/04
    • The present invention provides a tunnel-based IP handoff process that can minimize the handoff latency associated with the standard Mobile IP registration. In the present invention, when neighboring nodes are detected, these detected nodes are identified as candidate nodes. Detection of just the existence of neighboring nodes should be possible even in situations where these neighboring nodes use different access technologies. For instance, pilot beacon signals may be taken as indication of the existence of candidate nodes although it may be impossible to compare them quantitatively if the beacon signals emanate from different access technologies. As soon as candidate nodes are identified, tunnels are established between the source node and the candidate nodes. The tunnels are used to forward data to the mobile node after a communication link between the mobile node and the source node goes down. As soon as the mobile node enters one of the neighboring networks and identifies a target node, the tunnels are torn down except the tunnel for the target node.
    • 本发明提供了一种基于隧道的IP切换过程,其可以将与标准移动IP注册相关联的切换延迟最小化。 在本发明中,当检测到相邻节点时,将这些检测到的节点标识为候选节点。 即使在这些相邻节点使用不同的接入技术的情况下,也只能检测相邻节点的存在。 例如,可以将导频信标信号作为候选节点的存在的指示,但是如果信标信号来自不同的接入技术,则可能不可能定量比较它们。 一旦识别候选节点,就在源节点和候选节点之间建立隧道。 隧道用于在移动节点和源节点之间的通信链路关闭之后将数据转发到移动节点。 一旦移动节点进入相邻网络之一并识别目标节点,除了目标节点的隧道之外,隧道也被拆除。
    • 32. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08624286B2
    • 2014-01-07
    • US13600066
    • 2012-08-30
    • Atsushi Takeshita
    • Atsushi Takeshita
    • H01L23/34
    • H04B10/802H01L31/02005H01L31/167H01L2224/45144H01L2224/48091H01L2224/48247H01L2924/3025H01L2924/00014H01L2924/00
    • According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body.
    • 根据一个实施例,一种半导体器件包括用第一树脂模制的第一主体,用第一树脂模制的第二主体和用第二树脂模制的第三主体。 第一主体包括第一发光元件,初级引线,第一光接收元件和次级引线。 第二主体包括第二发光元件,初级引线,第二光接收元件和次级引线。 第三主体包括第一主体和第二主体。 至少一个公共引线包括主引线或次引线,以及在第一主体和第二主体之间延伸的部分,该部分被连接到第一主体的第一薄膜覆盖,第二薄膜连接到第二主体 身体。
    • 33. 发明授权
    • Light emitting device
    • 发光装置
    • US08610166B2
    • 2013-12-17
    • US13432955
    • 2012-03-28
    • Atsushi TakeshitaYuichi IkedoTetsuya Muranaka
    • Atsushi TakeshitaYuichi IkedoTetsuya Muranaka
    • H01L33/54
    • H01L33/486H01L33/62H01L2924/0002H01L2924/00
    • According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion.
    • 根据一个实施例,发光器件包括第一引线,发光元件,第二引线和成型体。 发光元件固定在第一引线上。 远离第一引线提供第二引线,并通过金属线与发光元件电连接。 由密封树脂制成的成型体覆盖发光元件,第一引线和第二引线的端部,发光元件固定在第一读取的端部,并且金属线被接合在端部 第二引线的一部分。 所述第一槽设置在所述第二引线的前表面中的第一和第二部分之间,所述第一部分与所述成型体的外边缘接触,并且所述金属线被接合在所述第二部分上。
    • 37. 发明申请
    • 3-Dimensional Image Display Device and 3-Dimensional Image Display Method
    • 三维图像显示设备和三维图像显示方法
    • US20080192310A1
    • 2008-08-14
    • US10587971
    • 2005-02-09
    • Masashi TsuboiTsutomu HorikoshiAtsushi Takeshita
    • Masashi TsuboiTsutomu HorikoshiAtsushi Takeshita
    • G03H1/08
    • G03H1/0841G03H1/0808
    • A three-dimensional image display device is provided which allows a reduction in redundant calculation and high-speed obtainment of an optimum control image to be recorded on an optical wavefront control unit This invention relates to a three-dimensional image display device for displaying a three-dimensional image by irradiating illuminating light at an optical wavefront control unit which records a control image. The three-dimensional image display device of this invention includes a control image optimizing unit which calculates three-dimensional images corresponding to a group of control images based on constraints inherent to the optical wavefront control unit, selects a control image corresponding to a three-dimensional image satisfying a predetermined condition from the group of control images and records the selected control image on the optical wavefront control device.
    • 提供一种三维图像显示装置,其能够减少要记录在光波阵面控制单元上的最佳控制图像的冗余计算和高速获取。三维图像显示装置技术领域本发明涉及一种三维图像显示装置, 通过在记录控制图像的光波前控制单元处照射照明光来进行三维图像。 本发明的三维图像显示装置包括控制图像优化单元,其根据光波前控制单元固有的约束计算与一组控制图像对应的三维图像,选择对应于三维图像的三维图像 从所述控制图像组满足预定条件的图像,并将所选择的控制图像记录在所述光学波前控制装置上。