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    • 34. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体存储器件及其制造方法
    • US20080179677A1
    • 2008-07-31
    • US12022382
    • 2008-01-30
    • Takeshi MurataMakoto MizukamiFumitaka Arai
    • Takeshi MurataMakoto MizukamiFumitaka Arai
    • H01L27/12H01L21/84
    • H01L27/105H01L21/84H01L27/11526H01L27/11529H01L27/1203
    • Semiconductor storage devices in which a plurality of semiconductor element devices having different functions are disposed in the appropriate region of the partial SOI substrate and the interface between each gate insulator and each gate electrode is formed to be the same level, and manufacturing methods thereof are disclosed. According to one aspect, there is provided a semiconductor storage device includes a first semiconductor region provided in a semiconductor substrate including a buried insulator having opening portions, a second semiconductor region without including buried insulator, a plurality of first semiconductor element devices disposed above the buried insulator, a plurality of second semiconductor element devices each disposed in a region including a region above the opening portion of the buried insulator, and a plurality of third semiconductor element devices disposed in the second semiconductor region.
    • 其中具有不同功能的多个半导体元件器件设置在部分SOI衬底的适当区域中并且每个栅绝缘体和每个栅电极之间的界面形成为相同水平的半导体存储器件,并且其制造方法被公开 。 根据一个方面,提供一种半导体存储装置,包括设置在包括具有开口部分的埋入式绝缘体的半导体衬底中的第一半导体区域,不包括埋入绝缘体的第二半导体区域,设置在掩埋层上方的多个第一半导体元件器件 绝缘体,多个第二半导体元件器件,每个第二半导体元件器件设置在包括所述埋入绝缘体的开口部分上方的区域的区域中,以及设置在所述第二半导体区域中的多个第三半导体元件器件。