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    • 33. 发明授权
    • Method for fabricating bulbous-shaped vias
    • 制造球状通孔的方法
    • US07071088B2
    • 2006-07-04
    • US10227105
    • 2002-08-23
    • Michael P. C. WattsSidlgata V. Sreenivasan
    • Michael P. C. WattsSidlgata V. Sreenivasan
    • H01L21/44
    • G03F7/0002B82Y10/00B82Y40/00H01L21/0272H01L21/28587H01L21/312H01L21/76804H01L21/76817
    • The present invention provides a method for fabricating bulbous-shaped vias on a substrate, having a surface, by disposing, on the substrate, a polymerizable fluid composition. A mold is placed in contact with the polymerizable fluid composition. The mold includes a relief structure on a surface thereof to create a recess in a layer of the polymerizable fluid composition. The polymerizable fluid composition is subjected to conditions to cause polymerization, forming a polymerized layer having a solidified indentation. An opening to the surface of the substrate is formed by removing material disposed on the substrate surface through etch processes. In a further embodiment a conductive layer may be disposed in the opening to form a gate. A lift-off process may be employed to remove the polymerized layer.
    • 本发明提供一种在基板上制造球状通孔的方法,其具有通过在基板上设置可聚合流体组合物的表面。 将模具放置成与可聚合流体组合物接触。 模具在其表面上包括浮雕结构,以在可聚合流体组合物的层中形成凹部。 可聚合流体组合物经历引起聚合的条件,形成具有固化压痕的聚合层。 通过蚀刻处理去除设置在基板表面上的材料来形成通向基板表面的开口。 在另一个实施例中,导电层可以设置在开口中以形成栅极。 可以采用剥离工艺来除去聚合层。