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    • 32. 发明授权
    • Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same
    • 用于光学半导体器件的封装,使用封装的光学半导体器件及其制造方法
    • US08981401B2
    • 2015-03-17
    • US12933064
    • 2009-09-30
    • Tomoyuki YamadaTomohiro Futagami
    • Tomoyuki YamadaTomohiro Futagami
    • H01L33/00H01L33/60
    • H01L33/60H01L2224/48091H01L2924/0002H01L2924/00014H01L2924/00
    • The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead frame even when a silicone resin is used as a sealing resin for an optical semiconductor device, and which enables high luminous efficiency for a long time.Specifically, in the package for semiconductor devices, a plating laminate 15, wherein a pure Ag plating layer 4, a thin reflective plating layer 6 serving as the uppermost layer for improving the light reflection ratio, and a resistant plating layer 5 serving as an intermediate layer therebetween and having chemical resistance against at least either metal chlorides or metal sulfides are laminated, is formed on at least the surface of a lead electrode. The reflective plating layer 4 is composed of a pure Ag thin film, and the resistant plating layer 5 is composed of a complete solid solution Au—Ag alloy plating layer.
    • 本发明是一种用于光半导体器件的封装件,以及使用该封装的光半导体器件,其即使当使用硅树脂作为光半导体器件的密封树脂时,也可防止形成在引线框架上的镀层的变色, 并且能够长时间实现高发光效率。 具体而言,在半导体装置用封装体中,使用纯Ag镀层4,作为提高光反射率的最上层的薄反射镀层6和作为中间体的耐电镀层5的电镀层叠体15 至少在引线电极的表面上形成层间并具有至少金属氯化物或金属硫化物的耐化学性的层。 反射镀层4由纯Ag薄膜构成,耐镀层5由完全固溶Au-Ag合金镀层构成。
    • 37. 发明申请
    • LAYOUT VERIFICATION METHOD
    • 布局验证方法
    • US20100229134A1
    • 2010-09-09
    • US12700117
    • 2010-02-04
    • Yutaka MIZUNOTomoyuki Yamada
    • Yutaka MIZUNOTomoyuki Yamada
    • G06F17/50
    • G06F17/5081
    • A layout verification method for verifying a layout of a semiconductor device by a computer having a memory storing layout data and information of operation conditions for a plurality of operation modes in which the semiconductor device is expected to assume during its testing and practical use, the semiconductor device including a semiconductor substrate of one conductivity type, a plurality of wells accommodating at least one of the circuit elements and being applicable to a plurality of different bias voltages in dependence of the operation modes, the method includes specifying combination of all the adjacent pairs of the wells located adjacently to each other within the semiconductor substrate, and the distance of each of all the adjacent pairs of the wells in reference to the layout data, determining, for each of the wells.
    • 一种用于通过计算机验证半导体器件的布局的布局验证方法,所述计算机具有存储布局数据的存储器以及半导体器件在其测试和实际应用期间期望呈现的多种操作模式的操作条件的信息,半导体 包括一个导电类型的半导体衬底的器件,容纳至少一个电路元件的多个阱,并且可以根据操作模式应用于多个不同的偏置电压,该方法包括指定所有相邻对的组合 在半导体衬底内彼此相邻的阱以及相对于布局数据的阱的所有相邻对中的每一个的距离,为每个阱确定。