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31. 发明授权

US08933369B2 Method of cutting a substrate and method of manufacturing a semiconductor device 有权
标题翻译：切割基板的方法和制造半导体器件的方法
公开(公告)号：US08933369B2
公开(公告)日：2015-01-13
申请号：US12900754
申请日：2010-10-08
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00 , C03C23/00 , B23K26/03 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/08 , B23K26/36 , B23K26/40 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , G02F1/1368
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合即使形成了修改区域。

32. 发明申请

US20110027971A1 METHOD OF CUTTING A SUBSTRATE, METHOD OF PROCESSING A WAFER-LIKE OBJECT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：切割基板的方法，等离子体对象的处理方法以及制造半导体器件的方法
公开(公告)号：US20110027971A1
公开(公告)日：2011-02-03
申请号：US12906534
申请日：2010-10-18
申请人： Fumitsugu FUKUYO , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu FUKUYO , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： H01L21/268 , B23K26/00
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合即使形成了修改区域。

33. 发明授权

US07825350B2 Laser processing method and laser processing apparatus 有权
公开(公告)号：US07825350B2
公开(公告)日：2010-11-02
申请号：US11101543
申请日：2005-04-08
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

34. 发明授权

US07626746B2 Shutter unit and laser processing device using same 有权
标题翻译：快门单元和激光加工设备使用相同
公开(公告)号：US07626746B2
公开(公告)日：2009-12-01
申请号：US10577550
申请日：2004-11-04
申请人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
发明人： Norio Kurita , Tetsuya Osajima , Masayoshi Kusunoki , Tatsuya Suzuki , Toshimitsu Wakuda
IPC分类号： G02B26/08
CPC分类号： G02B5/005
摘要： A shutter unit capable of preventing the scattering of the laser beam upon closing the optical path of the laser beam and capable of being miniaturized, and a laser processing device employing such a shutter unit. In a shutter unit 1, when the optical path of the laser beam L is opened, a rotating member 57 is rotated around an axis line γ, and an opening 61 is positioned on an optical axis α so as to pass the laser beam L therethrough. Meanwhile, when the optical path of the laser beam L is closed, the rotating member 57 is rotated and a reflective surface 62 is positioned on the optical axis α so as to reflect the laser beam L. Here, since the reflected laser beam L is absorbed by an optical absorption member 63, it is possible to prevent the scattering of the laser beam L when the optical path of the laser beam L is closed. In addition, since the opening 61 and reflective surface 62 are both formed on the rotating member 57 which rotates around the axis line γ that is substantially orthogonal to the optical axis α, it is possible to reduce the size of the shutter unit 1.
摘要翻译：一种快门单元，其能够防止在关闭激光束的光路并能够小型化时激光束的散射，以及采用这种快门单元的激光加工装置。在快门单元1中，当激光束L的光路打开时，旋转部件57围绕轴线γ转动，并且开口61位于光轴α上，以使激光束L穿过其中。同时，当激光束L的光路闭合时，旋转部件57旋转，反射面62位于光轴α上，以反射激光束L.这里，由于反射激光束L为通过光吸收构件63吸收，可以防止激光束L的光路闭合时的激光L的散射。此外，由于开口61和反射表面62都形成在围绕基本上与光轴α1正交的轴线gamma旋转的旋转部件57上，所以可以减小快门单元1的尺寸。

35. 发明授权

US07592238B2 Laser processing method and laser processing apparatus 有权
公开(公告)号：US07592238B2
公开(公告)日：2009-09-22
申请号：US11106648
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/78 , H01L21/82
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

36. 发明申请

US20070125757A1 Laser beam machining method 有权
标题翻译：激光束加工方法
公开(公告)号：US20070125757A1
公开(公告)日：2007-06-07
申请号：US10548412
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B23K26/38
CPC分类号： C03B33/091 , B23K26/0604 , B23K26/0624 , B23K26/40 , B23K26/53 , B23K26/60 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/023 , Y02P40/57
摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.
摘要翻译：提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。通过多光子吸收形成的改质区域7沿着切割线5在待处理物体1内形成切割开始区域8。此后，对象物1照射由物体1沿着切割线5吸收的激光L 2，从作为起点的切割起始区域8产生裂缝24，由此能够精确地切割物体1 沿线切割5。扩大其固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着切割线5切割物体1的可靠性。

37. 发明申请

US20060160331A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20060160331A1
公开(公告)日：2006-07-20
申请号：US11106645
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

38. 发明授权

US06992026B2 Laser processing method and laser processing apparatus 有权
公开(公告)号：US06992026B2
公开(公告)日：2006-01-31
申请号：US10385696
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： H01L21/36 , G06F17/00
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

39. 发明授权

US08946592B2 Laser processing method and laser processing apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US08946592B2
公开(公告)日：2015-02-03
申请号：US13432833
申请日：2012-03-28
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00 , C03C23/00 , B23K26/03 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/08 , B23K26/36 , B23K26/40 , B28D5/00 , C03B33/023 , C03B33/08 , C03B33/10 , G02F1/1368
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不会产生工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件表面上的预定切割线上工作的表面，引起多光子吸收并且具有位于工件内部的凝结点，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝结点，在工件内部形成改质区域，由此工件通过从修改区域开始沿着预定切割线开裂工件，并且因为脉冲激光束几乎不被吸收到表面上，所以以小的力切割。

40. 发明授权

US08946591B2 Method of manufacturing a semiconductor device formed using a substrate cutting method 有权
标题翻译：使用基板切割方法制造半导体器件的方法
公开(公告)号：US08946591B2
公开(公告)日：2015-02-03
申请号：US13428336
申请日：2012-03-23
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda
IPC分类号： B23K26/00 , C03C23/00 , B23K26/03 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/08 , B23K26/36 , B23K26/40 , C03B33/023 , C03B33/08 , C03B33/10 , G02F1/1368
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不会产生工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件表面上的预定切割线上工作的表面，引起多光子吸收并且具有位于工件内部的凝结点，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝结点，在工件内部形成改质区域，由此工件通过从修改区域开始沿着预定切割线开裂工件，并且因为脉冲激光束几乎不被吸收到表面上，所以以小的力切割。

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