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    • 35. 发明授权
    • Etch-enhanced technique for lift-off patterning
    • 用于剥离图案的蚀刻增强技术
    • US07985530B2
    • 2011-07-26
    • US11856862
    • 2007-09-18
    • Gerard M. SchmidDouglas J. Resnick
    • Gerard M. SchmidDouglas J. Resnick
    • G03F7/26
    • H01L21/0272B82Y10/00B82Y40/00G03F7/00G03F7/0002
    • An enhanced process forming a material pattern on a substrate deposits the material anisotropically on resist material patterned to correspond to an image of the material pattern. The material is etched isotropically to remove a thickness of the material on sidewalls of the resist pattern while leaving the material on a top surface of the resist pattern and portions of the surface of the substrate. The resist pattern is removed by dissolution thereby lifting-off the material on the top surface of the resist pattern while leaving the material on the substrate surface as the material pattern. Alternately, a first material layer is deposited on the resist pattern and a second material layer is deposited and planarized. The second material layer is etched exposing the first material while leaving the second material in features of the resist pattern. The first material and the resist are removed leaving the first material pattern.
    • 在衬底上形成材料图案的增强工艺在各向异性上沉积材料,其图案化的抗蚀剂材料对应于材料图案的图像。 将材料各向同性地蚀刻以除去抗蚀剂图案的侧壁上的材料的厚度,同时将材料留在抗蚀剂图案的顶表面和基板的表面的部分。 通过溶解除去抗蚀剂图案,从而使抗蚀剂图案的顶表面上的材料脱离,同时将材料留在基材表面上作为材料图案。 或者,第一材料层沉积在抗蚀剂图案上,并且第二材料层被沉积并平坦化。 蚀刻第二材料层暴露第一材料,同时将第二材料留在抗蚀剂图案的特征中。 去除第一材料和抗蚀剂留下第一材料图案。
    • 39. 发明申请
    • Method of Creating a Template Employing a Lift-Off Process
    • 创建使用脱离过程的模板的方法
    • US20090130598A1
    • 2009-05-21
    • US11943907
    • 2007-11-21
    • Gerard M. SchmidDouglas J. ResnickMichael N. Miller
    • Gerard M. SchmidDouglas J. ResnickMichael N. Miller
    • G03F7/00
    • G03F7/0002B82Y10/00B82Y40/00
    • A method of forming a lithographic template, the method including, inter alia, creating a multi-layered structure, by forming, on a body, a conducting layer, and forming on the conducting layer, a patterned layer having protrusions and recessions, the recessions exposing portions of the conducting layer; depositing a hard mask material anisotropically on the multi-layered structure covering a top surface of the patterned layer and the portions of the conducting layer; removing the patterned layer by a lift-off process, with the hard mask material remaining on the portions of the conducting layer; positioning a resist pattern on the multi-layered structure to define a region of the multi-layered structure; and selectively removing portions of the multi-layered structure in superimposition with the region using the hard mask material as an etching mask.
    • 一种形成光刻模板的方法,所述方法尤其包括通过在主体上形成导电层并在导电层上形成具有突起和凹陷的图案层,形成多层结构,所述凹陷 暴露导电层的部分; 在覆盖图案层的顶表面和导电层的部分的多层结构上各向异性地沉积硬掩模材料; 通过剥离过程去除图案层,硬掩模材料残留在导电层的部分上; 将抗蚀剂图案定位在所述多层结构上以限定所述多层结构的区域; 并且使用硬掩模材料作为蚀刻掩模选择性地去除与该区域重叠的多层结构的部分。