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    • 31. 发明授权
    • Method for providing device isolation and off-state leakage current for
a semiconductor device
    • 用于为半导体器件提供器件隔离和截止状态漏电流的方法
    • US5624859A
    • 1997-04-29
    • US476388
    • 1995-06-07
    • David K. Y. LiuMark T. Ramsbey
    • David K. Y. LiuMark T. Ramsbey
    • H01L21/265H01L21/336H01L21/762
    • H01L29/66575H01L21/26586H01L21/762
    • A method and system for providing a semiconductor device with device isolation and leakage current control which entails processing a semiconductor substrate to form a semiconductor circuit, and providing at least one high energy implant on the semiconductor circuit is disclosed. The high energy implant is provided at an angle to source and drain regions of the semiconductor circuit so as to allow a dosage from the at least one high energy implant below and away from the surface of the active device region. In so doing, a profile is provided in which dopant distribution is substantially uniform. Therefore, the breakdown characteristics are increased and the junction capacitance of the device is reduced. Accordingly, a device manufactured in accordance with the present invention has significant advantages over devices manufactured in accordance with conventional processes.
    • 公开了一种用于提供具有器件隔离和漏电流控制的半导体器件的方法和系统,其需要处理半导体衬底以形成半导体电路,并且在半导体电路上提供至少一个高能量注入。 与半导体电路的源极和漏极区成角度地设置高能量注入,从而允许来自至少一个高能量注入的剂量低于和远离有源器件区域的表面。 在这样做时,提供其中掺杂剂分布基本上均匀的轮廓。 因此,击穿特性增加,并且器件的结电容减小。 因此,根据本发明制造的装置与根据常规方法制造的装置相比具有显着的优点。