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31. 发明授权

US07549206B2 Shell flow sensor 失效
公开(公告)号：US07549206B2
公开(公告)日：2009-06-23
申请号：US11891787
申请日：2007-08-13
申请人： Robert E. Higashi , Son T. Lu , Jeffrey A. Ridley
发明人： Robert E. Higashi , Son T. Lu , Jeffrey A. Ridley
IPC分类号： H01S4/00
CPC分类号： G01F1/6845 , G01F1/6842 , Y10T29/49002
摘要： A flow sensor system and a method for fabricating the same. A substrate is provided, comprising a detector wafer upon which a flow sensor is formed. One or more shells can then be configured upon the substrate whose walls form a flow channel. The flow channel is fabricated directly upon the substrate in a manner that allows the flow channel to couple heat transfer directly to the flow sensor in order to eliminate the need for two or more different types of sacrificial layers during the fabrication of the flow sensor upon the substrate and in which the shell(s) is coupled with fluidic measurement to provide for the flow sensor.

32. 发明申请

US20080168842A1 THERMAL VACUUM GAUGE 有权
标题翻译：热真空计
公开(公告)号：US20080168842A1
公开(公告)日：2008-07-17
申请号：US11623561
申请日：2007-01-16
申请人： Robert E. Higashi
发明人： Robert E. Higashi
IPC分类号： G01L21/10
CPC分类号： G01L21/10 , G01L11/002
摘要： A system for determining a gas pressure or gauging a vacuum in a hermetically sealed enclosure. One or more heater structures and one or more temperature sensor structures situated on a substrate may be used in conjunction for measuring a thermal conductivity of a gas in the enclosure. Each heater has significant thermal isolation from each sensor structure. Electronics connected to each heater and sensor of their respective structures may provide processing to calculate the pressure or vacuum in the enclosure. The enclosure may contain various electronic components such as bolometers.
摘要翻译：用于确定气体压力或在气密密封的外壳中测量真空的系统。位于基板上的一个或多个加热器结构和一个或多个温度传感器结构可以结合用于测量外壳中的气体的导热性。每个加热器具有与每个传感器结构相当的热隔离。连接到每个加热器和各自结构的传感器的电子器件可提供计算外壳中的压力或真空度的处理。外壳可能包含各种电子部件，如辐射热计。

33. 发明授权

US6036872A Method for making a wafer-pair having sealed chambers 失效
标题翻译：制造具有密封室的晶片对的方法
公开(公告)号：US6036872A
公开(公告)日：2000-03-14
申请号：US52645
申请日：1998-03-31
申请人： R. Andrew Wood , Jeffrey A. Ridley , Robert E. Higashi
发明人： R. Andrew Wood , Jeffrey A. Ridley , Robert E. Higashi
IPC分类号： G01J1/02 , B29C43/56 , B81B1/00 , H01L27/16 , H01L37/02 , C23F1/00
CPC分类号： B29C43/56 , B81B1/00 , G01J5/045 , H01L27/16 , B29C2043/561 , B29C43/32
摘要： A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.
摘要翻译：一种用于制造在一个晶片中具有至少一个凹槽的晶片对的方法，并且所述凹部形成为室，另一个晶片的附接具有在其外表面上与沉积层堵塞的端口。该层的沉积可以在非常低的压力环境中进行，从而确保密封室中的相同种类的环境。腔室可以封闭至少一个装置，如热电传感器，测辐射热计，发射器或其他类型的装置。晶片对通常将具有多个室，分别具有器件，并且可以被分成多个芯片。

34. 发明授权

US5300915A Thermal sensor 失效
标题翻译：热传感器
公开(公告)号：US5300915A
公开(公告)日：1994-04-05
申请号：US887495
申请日：1986-07-16
申请人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
发明人： Robert E. Higashi , James O. Holmen , Robert G. Johnson
IPC分类号： H01L27/16 , H01L27/14 , G01J5/20 , G01J5/24 , H01L31/101
CPC分类号： G01J5/20 , H01L27/16 , Y10T29/49085
摘要： A two-level IR detector imaging array of high fill-factor design. The upper microbridge detector level is spaced above and overlies the integrated circuit and bus lines on the substrate surface below.
摘要翻译：高填充因子设计的二级红外检测器成像阵列。上部微桥检测器电平在下方的基板表面上的集成电路和总线之间间隔开并覆盖。

35. 发明授权

US4895616A Method for making thin film orthogonal microsensor for air flow 失效
标题翻译：制造薄膜正交微传感器用于气流的方法
公开(公告)号：US4895616A
公开(公告)日：1990-01-23
申请号：US342010
申请日：1989-04-24
申请人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
发明人： Robert E. Higashi , James O. Holmen , Steven D. James , Robert G. Johnson , Jeffrey A. Ridley
IPC分类号： G01F1/684 , H01L21/308
CPC分类号： G01F1/6845 , H01L21/308 , H01H2001/0089
摘要： A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.
摘要翻译：一种微桥空气流量传感器，其在氮化硅隔膜下方具有密封的蚀刻腔，使得空腔不容易受到残留膜或积聚在空腔内的其他材料的污染。腔体热隔离了封装在隔膜中的加热器和检测器。通过硅晶片的正面蚀刻来制造空腔。窄槽通过氮化硅膜制成，以露出铝的薄膜（400埃）矩形。第一次蚀刻除去在隔膜下方留下400埃非常浅的空腔的铝。然后将各向异性蚀刻引入浅空腔中以蚀刻硅凹坑。

36. 发明授权

US4885938A Flowmeter fluid composition correction 失效
标题翻译：流量计流体组成校正
公开(公告)号：US4885938A
公开(公告)日：1989-12-12
申请号：US285896
申请日：1988-12-16
申请人： Robert E. Higashi
发明人： Robert E. Higashi
IPC分类号： G01P5/12 , G01F1/68 , G01F1/684 , G01F1/696 , G01F15/04
CPC分类号： G01F15/043 , G01F1/684 , G01F1/6842
摘要： Certain relationships among the mass flow signal the thermal conductivity, specific heat and density of the fluid measured can be used to correct a mass flowmeter measurement with respect to changes in composition of the fluid.

37. 发明授权

US08188561B2 Integral topside vacuum package 有权
标题翻译：整体顶层真空包装
公开(公告)号：US08188561B2
公开(公告)日：2012-05-29
申请号：US12958161
申请日：2010-12-01
申请人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
发明人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
IPC分类号： H01L31/0203
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译：在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。增加的空间体积可以是从顶部晶片的内表面蚀刻材料。该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。顶部晶片的内表面可以具有抗反射图案。此外，抗反射图案可以在顶部晶片的外表面上。两个晶片之间的密封可以是环状的并且具有间隔物材料。此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。

38. 发明申请

US20110070401A1 INTEGRAL TOPSIDE VACUUM PACKAGE 有权
标题翻译：整体吸顶真空包装
公开(公告)号：US20110070401A1
公开(公告)日：2011-03-24
申请号：US12958161
申请日：2010-12-01
申请人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
发明人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
IPC分类号： B32B3/00
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译：在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。增加的空间体积可以是从顶部晶片的内表面蚀刻材料。该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。顶部晶片的内表面可以具有抗反射图案。此外，抗反射图案可以在顶部晶片的外表面上。两个晶片之间的密封可以是环状的并且具有间隔物材料。此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。

39. 发明授权

US07875944B2 Integral topside vacuum package 有权
标题翻译：整体顶层真空包装
公开(公告)号：US07875944B2
公开(公告)日：2011-01-25
申请号：US11832473
申请日：2007-08-01
申请人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
发明人： Robert E. Higashi , Karen M. Newstrom-Peitso , Jeffrey A. Ridley
IPC分类号： H01L31/0203
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译：在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。增加的空间体积可以是从顶部晶片的内表面蚀刻材料。该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。顶部晶片的内表面可以具有抗反射图案。此外，抗反射图案可以在顶部晶片的外表面上。两个晶片之间的密封可以是环状的并且具有间隔物材料。此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。

40. 发明申请

US20090279172A1 MICROELECTROMECHANICAL LAMELLAR GRATING 审中-公开
标题翻译：微电子光学玻璃磨粒
公开(公告)号：US20090279172A1
公开(公告)日：2009-11-12
申请号：US12119184
申请日：2008-05-12
申请人： Robert E. Higashi
发明人： Robert E. Higashi
IPC分类号： G02B5/18 , G02B27/44
CPC分类号： G01J3/4532 , G02B5/1828 , G02B26/0833
摘要： An optical instrument includes a grating. The grating includes a plurality of plates that form a single first plane. The instrument further includes a mirror surface positioned adjacent to the grating. The mirror surface is positioned in a second plane. In an embodiment, the mirror surface is made of a substrate, a silicon wafer positioned on the substrate, and a mirror etch pit surface on the silicon wafer.
摘要翻译：光学仪器包括光栅。光栅包括形成单个第一平面的多个板。仪器还包括邻近光栅定位的镜面。镜面位于第二平面内。在一个实施例中，镜面由衬底，位于衬底上的硅晶片和硅晶片上的镜蚀刻凹坑表面制成。

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