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    • 34. 发明授权
    • Semiconductor integrated circuit device including a memory device having
memory cells with increased information storage capacitance
    • 半导体集成电路器件包括具有增加的信息存储电容的存储单元的存储器件
    • US5578849A
    • 1996-11-26
    • US341966
    • 1994-11-16
    • Yoshitaka TadakiJun MurataToshihiro SekiguchiHideo AokiKeizo KawakitaHiroyuki UchiyamaMichio NishimuraMichio TanakaYuji EzakiKazuhiko SaitohKatsuo YuharaSongsu Cho
    • Yoshitaka TadakiJun MurataToshihiro SekiguchiHideo AokiKeizo KawakitaHiroyuki UchiyamaMichio NishimuraMichio TanakaYuji EzakiKazuhiko SaitohKatsuo YuharaSongsu Cho
    • H01L21/3205H01L21/8242H01L23/52H01L27/10H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L27/10852H01L27/10817H01L2924/0002
    • A memory device has a semiconductor substrate, and memory cells provided at intersections between word line conductors and bit line conductors. Each memory cell has a switching transistor and an information storage capacitor. Adjacent two memory cells for each bit line conductor form a memory cell pair unit structure, in which first semiconductor regions of the transistors of the adjacent two memory cells are united at their boundary into a single region and are connected to one of the bit line conductors via a bit line connection conductor, the gate electrodes of the transistors of the adjacent two memory cells are connected to word line conductors adjacent to each other, respectively, the second semiconductor regions of the transistors of the adjacent two memory cells are connected to the respective information storage capacitors. A series of memory cell pair unit structures formed under one bit line conductor is positionally shifted with respect to a series of memory cell pair unit structures formed under adjacent first and second bit line conductors on opposite sides of the one bit line conductor, respectively, such that a second information storage capacitor of a memory cell pair unit structure formed under the adjacent first bit line conductor and a first information storage capacitor of a memory cell pair unit structure formed under the adjacent second bit line conductor are located adjacent to a bit line connection conductor of a memory cell pair unit structure formed under the one bit line conductor.
    • 存储器件具有半导体衬底和设置在字线导体和位线导体之间的交叉点处的存储单元。 每个存储单元具有开关晶体管和信息存储电容器。 每个位线导体的相邻的两个存储单元形成存储单元对单元结构,其中相邻两个存储单元的晶体管的第一半导体区域在其边界处被结合成单个区域并连接到位线导体之一 通过位线连接导体,相邻的两个存储单元的晶体管的栅电极分别连接到彼此相邻的字线导体,相邻两个存储单元的晶体管的第二半导体区域连接到相应的两个存储单元的晶体管的第二半导体区域 信息存储电容器。 形成在一个位线导体下方的一系列存储单元对单元结构分别相对于位于一个位线导体的相对侧上相邻的第一和第二位线导体下方的一系列存储单元对单元结构位移地移位, 形成在相邻的第一位线导体下方的存储单元对单元结构的第二信息存储电容器和形成在相邻的第二位线导体下方的存储单元对单元结构的第一信息存储电容器位于与位线连接 形成在一个位线导体下的存储单元对单元结构的导体。
    • 36. 发明授权
    • Ultrasonic transducer and manufacturing method
    • 超声波换能器及制造方法
    • US08294225B2
    • 2012-10-23
    • US12407414
    • 2009-03-19
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka Tadaki
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka Tadaki
    • H01L21/00
    • B06B1/0292Y10T29/49005
    • This invention provides a technique whereby, even if a step is produced by splitting a lower electrode into component elements, resistance increase of an upper electrode, damage to a membrane and decrease of dielectric strength between an upper electrode and the lower electrode, are reduced. In an ultrasonic transducer comprising plural lower electrodes, an insulation film covering the lower electrodes, plural hollow parts formed to overlap the lower electrodes on the insulation film, an insulation film filling the gaps among the hollow parts, an insulation film covering the hollow parts and insulation film, plural upper electrodes formed to overlap the hollow parts on the insulation film and plural interconnections joining them, the surfaces of the hollow parts and insulation film are flattened to the same height.
    • 本发明提供一种技术,即使通过将下部电极分割成成分元件而产生台阶,也能够降低上部电极的电阻增加,膜的损伤以及上部电极与下部电极之间的介电强度的降低。 在包括多个下电极的超声波换能器中,覆盖下电极的绝缘膜,形成为与绝缘膜上的下电极重叠的多个中空部,填充中空部之间的间隙的绝缘膜,覆盖中空部的绝缘膜, 绝缘膜,形成为与绝缘膜上的中空部分重叠的多个上电极和连接它们的多个互连,中空部分和绝缘膜的表面被平坦化到相同的高度。
    • 37. 发明授权
    • Ultrasonic transducer and manufacturing method
    • 超声波换能器及制造方法
    • US07512038B2
    • 2009-03-31
    • US11671040
    • 2007-02-05
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka Tadaki
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka Tadaki
    • H04R19/00
    • B06B1/0292Y10T29/49005
    • This invention provides a technique whereby, even if a step is produced by splitting a lower electrode into component elements, resistance increase of an upper electrode, damage to a membrane and decrease of dielectric strength between an upper electrode and the lower electrode, are reduced. In an ultrasonic transducer comprising plural lower electrodes, —an insulation film covering the lower electrodes, —plural hollow parts formed to overlap the lower electrodes on the insulation film, —an insulation film filling the gaps among the hollow parts, an insulation film covering the hollow parts and insulation film, plural upper electrodes formed to overlap the hollow parts on the insulation film and plural interconnections joining them, —the surfaces of the hollow parts and insulation film are flattened to the same height.
    • 本发明提供一种技术,即使通过将下部电极分割成成分元件而产生台阶,也能够降低上部电极的电阻增加,膜的损伤以及上部电极与下部电极之间的介电强度的降低。 在包括多个下电极的超声波换能器中, - 覆盖下电极的绝缘膜, - 形成为与绝缘膜上的下电极重叠的 - 中空部分, - 填充中空部分之间的间隙的绝缘膜,覆盖 中空部分和绝缘膜,形成为与绝缘膜上的中空部分重叠的多个上电极和连接它们的多个互连, - 中空部分和绝缘膜的表面被平坦化到相同的高度。
    • 38. 发明申请
    • Ultrasonic transducer and manufacturing method thereof
    • 超声波换能器及其制造方法
    • US20070052093A1
    • 2007-03-08
    • US11489612
    • 2006-07-20
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka TadakiTatsuya Nagata
    • Shuntaro MachidaHiroyuki EnomotoYoshitaka TadakiTatsuya Nagata
    • H01L23/48
    • B06B1/0292
    • Disclosed is an improved construction of an ultrasonic transducer, wherein a charge is not easily injected into an insulating film even when the bottom of a membrane comes in contact with a lower electrode, and a manufacturing method thereof without using the wafer laminating technique. The ultrasonic transducer includes a lower electrode; a cavity layer formed on the first electrode; an insulating film covering the cavity layer; and an upper electrode formed on the insulating film, wherein, the cavity layer includes projections formed into an insulating film protruded from the cavity layer. In addition, an opening is formed into the upper electrode, and this upper electrode having the opening formed therein is deposited at a position not being superposed with the projections of the insulating film when seen from the top.
    • 公开了一种超声换能器的改进结构,其中即使膜的底部与下电极接触,电荷也不容易注入到绝缘膜中,并且其制造方法不使用晶片层压技术。 超声波换能器包括下电极; 形成在所述第一电极上的空腔层; 覆盖空腔层的绝缘膜; 以及形成在绝缘膜上的上电极,其中,所述空腔层包括形成为从所述空腔层突出的绝缘膜的突起。 此外,在上部电极中形成开口,并且其上形成有开口的该上部电极沉积在从顶部观察时不与绝缘膜的突起重叠的位置。
    • 40. 发明授权
    • Semiconductor integrated circuit and method of fabricating the same
    • 半导体集成电路及其制造方法
    • US06483136B1
    • 2002-11-19
    • US09446302
    • 2000-04-14
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • H01L2972
    • H01L27/10852H01L27/10817
    • An active region (L) with a metal insulator semiconductor field effect transistor (MISFET) (Qs) formed therein for selection of a DRAM memory cell, which makes up a memory cell of the DRAM, is arranged to have an island-like pattern that linearly extends in an X direction on one principal surface of a semiconductor substrate (1). The memory-cell selection MISFET (Qs) has an insulated gate electrode (7) (word line WL) that extends along a Y direction on the principal surface of the semiconductor substrate (1) with the same width kept along the length thereof, which gate electrode is arranged to oppose another gate electrode (7) (word line WL) adjacent thereto at a prespecified distance or pitch that is narrower than said width. In addition, a bit line (BL) is provided overlying the memory-cell select MISFET (Qs) in a manner such that the bit line extends in the X direction on the principal surface of the semiconductor substrate (1) with the same width and opposes its neighboring bit line (BL) at a distance or pitch that is wider than said width.
    • 在其中形成有用于选择构成DRAM的存储单元的DRAM存储单元的金属绝缘体半导体场效应晶体管(MISFET)(Qs)的有源区域(L)被布置成具有岛状图案, 在半导体衬底(1)的一个主表面上沿X方向线性地延伸。 存储单元选择MISFET(Qs)具有在半导体衬底(1)的主表面上沿着Y方向延伸的绝缘栅电极(字线WL),沿着其长度保持相同的宽度, 栅电极被布置成以比所述宽度窄的预定距离或间距与与其相邻的另一个栅电极(7)(字线WL)相对。 此外,位线(BL)以这样的方式设置在存储单元选择MISFET(Qs)上,使得位线在半导体衬底(1)的主表面上沿X方向以相同的宽度延伸,并且 以比所述宽度更宽的距离或间距来对置其相邻位线(BL)。