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31. 发明授权

US08585998B2 Method for producing graphite film, and graphite film produced by the method 有权
标题翻译：通过该方法制造石墨膜的方法和石墨膜
公开(公告)号：US08585998B2
公开(公告)日：2013-11-19
申请号：US11629432
申请日：2005-06-09
申请人： Yasushi Nishikawa , Shuhei Wakahara , Mutsuaki Murakami
发明人： Yasushi Nishikawa , Shuhei Wakahara , Mutsuaki Murakami
IPC分类号： C01B31/04
CPC分类号： C01B31/04 , C01B32/20 , H01L23/373 , H01L2924/0002 , H01L2924/00
摘要： A graphite film excelling in heat conductivity, especially, a graphite film of high heat conductivity that even when its thickness is large, would not suffer damage by heat treatment. There is provided a process for producing a graphite film, including graphitizing a raw material film of a polymer film and/or carbonized polymer film, characterized by including (i) holding the raw film in a vessel capable of direct passage of current through voltage application and (ii) applying voltage to the vessel to thereby induce electrification so that graphitization is carried out. There is further provided a process for producing a graphite film, characterized by including the step of holding the raw material film in vessel (A) being electrifiable, subsequently holding the resultant vessel (A) in vessel (B) being electrifiable and effecting current passage through the whole so that graphitization is carried out.
摘要翻译：导热性优异的石墨膜，特别是高导热性的石墨膜，即使其厚度大，也不会受到热处理的损害。提供一种生产石墨膜的方法，包括将聚合物膜和/或碳化聚合物膜的原料膜石墨化，其特征在于包括（i）将原料膜保持在能够通过电压施加直接通过电流的容器中和（ii）向容器施加电压，从而引起电化，从而进行石墨化。还提供了一种石墨膜的制造方法，其特征在于包括将容器（A）中的原料膜保持在带电状态的步骤，随后将容器（B）中的所得容器（A）保持在带电状态并进行电流通过整体上进行石墨化。

32. 发明授权

US08501874B2 Thermosetting resin composition, multilayer body using same, and circuit board 有权
标题翻译：热固性树脂组合物，使用其的多层体和电路板
公开(公告)号：US08501874B2
公开(公告)日：2013-08-06
申请号：US12188898
申请日：2008-08-08
申请人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Itoh , Koji Okada , Mutsuaki Murakami
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C07F9/24 , C08F283/00 , C08F283/04 , C08G18/77 , C08G59/14 , C08G65/32 , C08G65/48 , C08G69/48 , C08G79/02 , C08K5/49 , C08K5/51 , C08K5/5399 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12 , C08L75/04 , C08L77/00 , C08L85/02
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译：本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例组分（B）和组分（C）。通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈化合物（D）和氰酸酯化合物（E）。磷腈化合物（D）包括通过使苯氧基磷腈化合物（D-1）交联而制得的交联的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物 -2）具有至少一个酚羟基。通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。

33. 发明授权

US08092900B2 Solution, component for plating, insulating sheet, laminate, and printed circuit board 有权
标题翻译：解决方案，电镀部件，绝缘片，层压板和印刷电路板
公开(公告)号：US08092900B2
公开(公告)日：2012-01-10
申请号：US11659363
申请日：2005-08-04
申请人： Kanji Shimoosako , Takashi Ito , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
发明人： Kanji Shimoosako , Takashi Ito , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
IPC分类号： B32B15/08
CPC分类号： H05K3/387 , C08G73/106 , C08G77/54 , C08L79/08 , C08L83/14 , C09J179/08 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/31 , C23C18/38 , H05K1/0346 , H05K1/036 , H05K3/181 , H05K2201/0154 , H05K2201/0162 , Y10S428/901 , Y10T428/24355 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 μm or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.
摘要翻译：本发明的目的是提供一种适用于例如制造印刷电路板，溶液和包括该组分的印刷电路板的电镀用部件，该电镀用部件对化学镀具有良好的粘附性甚至当组件的表面的表面粗糙度小时也提供在组件的表面上。该目的通过包括至少一个用于化学镀的表面a的化学镀的部件来实现，表面a具有以0.002mm的截止值测量的算术平均粗糙度为0.5μm或更小的表面粗糙度，以及表面 a含有具有硅氧烷结构的聚酰亚胺树脂。

34. 发明授权

US07758842B2 Filmy graphite and process for producing the same 有权
标题翻译：薄膜石墨及其制造方法
公开(公告)号：US07758842B2
公开(公告)日：2010-07-20
申请号：US10570074
申请日：2003-09-02
申请人： Yasushi Nishikawa , Mutsuaki Murakami , Kiyokazu Akahori
发明人： Yasushi Nishikawa , Mutsuaki Murakami , Kiyokazu Akahori
IPC分类号： C01B31/04 , B60C1/00
CPC分类号： C01B31/04 , C01B32/20 , C04B35/522 , C04B35/524 , C04B2235/656 , C04B2235/96 , C04B2235/9607 , C08G73/1053 , Y10T428/31721
摘要： A process for producing a filmy graphite includes the steps of forming a polyimide film having a birefringence of 0.12 or more and heat-treating the polyimide film at 2,400° C. or higher.
摘要翻译：一种薄膜状石墨的制造方法，其特征在于，形成双折射为0.12以上的聚酰亚胺膜，在该聚酰亚胺膜上进行2,400℃以上的热处理。

35. 发明申请

US20090251849A1 Energy Storage Device Having Novel Energy Storage Means 审中-公开
标题翻译：具有新型储能装置的储能装置
公开(公告)号：US20090251849A1
公开(公告)日：2009-10-08
申请号：US12084154
申请日：2006-11-02
申请人： Hideo Yamagishi , Masamitsu Tachibana , Mutsuaki Murakami , Yasuhiro Tsukada , Hiroyuki Furutani
发明人： Hideo Yamagishi , Masamitsu Tachibana , Mutsuaki Murakami , Yasuhiro Tsukada , Hiroyuki Furutani
IPC分类号： H01G9/038 , H01G9/035
CPC分类号： H01G9/038 , H01G9/155 , H01G9/22 , H01G11/02 , H01G11/06 , H01G11/62 , Y02E60/13 , Y02T10/7022
摘要： Disclosed is an energy storage device having high energy density and excellent power density. For example, electric double layer capacitors, redox capacitors, lithium ion electrolyte type capacitors and devices applying any of them are greatly improved in the energy density without deteriorating their advantages such as high power density, high charge/discharge efficiency and long life. Specifically disclosed is an energy storage device containing a positive electrode, a negative electrode and an electrolyte solution, which device is characterized in that a compound capable of performing a doping/dedoping reaction is present in the electrolyte solution.
摘要翻译：公开了具有高能量密度和优异的功率密度的能量存储装置。例如，双电层电容器，氧化还原电容器，锂离子电解质型电容器和应用它们的器件在能量密度方面大大提高，而不会降低其功率密度高，充电/放电效率高以及长寿命等优点。具体公开了包含正极，负极和电解质溶液的能量存储装置，该装置的特征在于，在电解液中存在能够进行掺杂/去掺杂反应的化合物。

36. 发明申请

US20090025966A1 Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board 审中-公开
标题翻译：纤维树脂复合材料，层压板，印刷线路板以及印刷电路板的制造方法
公开(公告)号：US20090025966A1
公开(公告)日：2009-01-29
申请号：US11918722
申请日：2006-04-19
申请人： Kanji Shimoosako , Takashi Ito , Shigeru Tanaka , Masaru Nishinaka , Mutsuaki Murakami
发明人： Kanji Shimoosako , Takashi Ito , Shigeru Tanaka , Masaru Nishinaka , Mutsuaki Murakami
IPC分类号： B32B27/04 , B32B27/00 , B05D1/18 , H05K1/09
CPC分类号： H05K3/387 , B32B15/08 , B32B15/20 , B32B27/12 , B32B27/281 , B32B2255/02 , B32B2255/26 , B32B2457/08 , H05K1/036 , H05K1/0366 , H05K3/181 , H05K2201/0154 , Y10T428/31504 , Y10T428/31507 , Y10T428/31663 , Y10T428/31678 , Y10T428/31721 , Y10T428/31786
摘要： The present invention provides: a copper-clad laminate, facilitating the formation of highly reliable fine wires, in which copper foil has been formed firmly on a flat and smooth surface; a laminate; an electroless plating material; a fiber-resin composite; and a printed wiring board obtained with use of them. Further, the present invention provides a method for manufacturing a multilayer printed wiring board on which fine wires can be formed with high accuracy and a multilayer printed wiring board that is obtained by the method. A copper-clad laminate of the present invention includes a plated copper layer (1), a resin layer (2), and a fiber-resin composite layer (3), and is arranged at least such that the plated copper layer (1) and the resin layer (2) are laminated so as to make contact with each other. The copper-clad laminate (10) is arranged such that a plated copper layer is formed on a resin layer having good adhesive properties with respect to copper foil. This makes it possible to cause copper foil adhere firmly to a resin layer even when the resin layer has a flat and smooth surface. Therefore, as compared with a conventional laminate, highly reliable fine wires can be formed.
摘要翻译：本发明提供一种覆铜层压板，其特征在于，在形成平坦光滑的表面上形成铜箔的高可靠性细线，层压板无电镀材料; 纤维树脂复合材料; 以及使用它们获得的印刷线路板。此外，本发明提供一种制造可以高精度地形成细线的多层印刷布线板的方法和通过该方法获得的多层印刷布线板。本发明的覆铜层压板包括电镀铜层（1），树脂层（2）和纤维树脂复合层（3），并且至少布置成使得镀铜层（1）和树脂层（2）彼此接触。覆铜层压板（10）被布置成使得在相对于铜箔具有良好粘合性的树脂层上形成镀覆铜层。这使得即使当树脂层具有平坦和光滑的表面时，也可能使铜箔牢固地粘附到树脂层。因此，与现有的层叠体相比，可以形成高可靠性的细线。

37. 发明申请

US20080218942A1 Conductive polymer solid electrolytic capacitor 失效
标题翻译：导电聚合物固体电解电容器
公开(公告)号：US20080218942A1
公开(公告)日：2008-09-11
申请号：US12068555
申请日：2008-02-07
申请人： Hideo Yamagishi , Kazuyuki Tateishi , Hiroyuki Furutani , Mutsuaki Murakami
发明人： Hideo Yamagishi , Kazuyuki Tateishi , Hiroyuki Furutani , Mutsuaki Murakami
IPC分类号： H01G9/022
CPC分类号： H01G9/028 , H01G9/0036 , H01G11/48 , Y02E60/13
摘要： A solid electrolytic capacitor having an electrolytic layer containing at least two types of ionic liquids and a conductive polymer is provided. Preferably, the ionic liquids include at least one type of ionic liquid for supplying an excellent impedance characteristic and at least one type of ionic liquid for supplying an excellent withstand voltage characteristic. Thus, a solid electrolytic capacitor exhibiting a high withstand voltage and an excellent impedance characteristic can be obtained.
摘要翻译：提供一种具有包含至少两种离子液体和导电聚合物的电解质层的固体电解电容器。优选地，离子液体包括用于提供优异阻抗特性的至少一种离子液体和用于提供优异的耐受电压特性的至少一种离子液体。因此，可以获得具有高耐受电压和优异阻抗特性的固体电解电容器。

38. 发明申请

US20070074896A1 Thermosetting resin composition, laminated body using it, and circuit board 有权
标题翻译：热固性树脂组合物，使用它的层压体和电路板
公开(公告)号：US20070074896A1
公开(公告)日：2007-04-05
申请号：US11542229
申请日：2006-10-04
申请人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Ito , Mutsuaki Murakami
发明人： Shigeru Tanaka , Kanji Shimoohsako , Takashi Ito , Mutsuaki Murakami
IPC分类号： H05K1/02
CPC分类号： B32B27/38 , B32B15/092 , B32B15/20 , B32B27/281 , B32B2270/00 , B32B2307/206 , B32B2307/306 , B32B2457/08 , C08G59/4042 , H05K1/0353 , H05K2201/0154
摘要： It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).
摘要翻译：本发明的目的是提供一种在GHz频带中具有令人满意的粘合性，良好的加工性，高耐热性和优异的介电特性的热固性树脂组合物; 以及包含所述热固性树脂组合物的层压体和电路板。本发明提供一种包含含有至少一种具有特定结构的酰亚胺低聚物的酰亚胺低聚物组分（A）和含有至少一种环氧树脂的环氧树脂组分（B）的热固性树脂组合物。此外，本发明还提供还包含聚酰亚胺树脂组分（C）的热固性树脂组合物。

39. 发明授权

US07115681B2 Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US07115681B2
公开(公告)日：2006-10-03
申请号：US10482897
申请日：2002-07-08
申请人： Kanji Shimo-Ohsako , Takashi Itoh , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
发明人： Kanji Shimo-Ohsako , Takashi Itoh , Masaru Nishinaka , Shigeru Tanaka , Mutsuaki Murakami
IPC分类号： C08L79/08
CPC分类号： H05K1/0346 , C08G59/08 , C08G59/5033 , C08L63/00 , C08L79/08 , C08L2666/20 , C08L2666/22
摘要： The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
摘要翻译：本发明提供一种包含含有特定二酐和二胺的聚酰亚胺和环氧树脂的树脂组合物。树脂组合物可以在相对较低的温度下结合，具有优异的耐热性，粘附性，耐焊接性和PCT后剥离强度的保持率。通过使用包含该树脂组合物的金属箔的聚酰亚胺树脂片或聚酰亚胺树脂片根据半添加方法形成具有良好布线形状，电路牢固牢固和绝缘电阻高的印刷线路板的电路在微电路空间可以获得。

40. 发明授权

US5312705A Photosensitive materials for electrophotography having a double-layer structure of a charge generation layer and a charge transport layer 失效
标题翻译：具有电荷产生层和电荷输送层的双层结构的电子照相用感光材料
公开(公告)号：US5312705A
公开(公告)日：1994-05-17
申请号：US736671
申请日：1991-07-26
申请人： Sohji Tsuchiya , Atsushi Omote , Mutsuaki Murakami
发明人： Sohji Tsuchiya , Atsushi Omote , Mutsuaki Murakami
IPC分类号： G03G5/047 , G03G5/06 , G03G15/02
CPC分类号： G03G5/047 , G03G5/0696
摘要： A photosensitive material for electrophotography which comprises a conductive support, and a charge transport layer and a charge generation layer formed on the conductive support, is described. The charge generation layer is formed from a dispersion which is obtained by mixing X-type and/or .tau.-type metal-free phthalocyanine, with or without at least one other charge generation agent, and a resin binder in a solvent, which is capable of dissolving at least a part of X-type and/or .tau.-type metal-free phthalocyanine, to such an extent that a ratio between X-ray diffraction peak intensities at about 7.5.degree. and at about 9.1.degree. is in the range of 1:1 to 0.1:1. When the at least one other charge generation agent is used in combination, the charge generation layer is formed on the conductive support on which the charge transport layer is formed. If such other agent is not used, the charge generation layer is formed on the charge transport layer with a certain thickness. The photosensitive materials have good photosensitivity, image characteristics and printing resistance.
摘要翻译：描述了一种用于电子照相的感光材料，其包括导电支撑体，以及形成在导电支撑体上的电荷输送层和电荷产生层。电荷产生层由通过将X型和/或tau型无金属酞菁与或不与至少一种其它电荷产生剂混合而得到的分散体和树脂粘合剂在能够溶解的溶剂中形成将至少一部分X型和/或tau型无金属酞菁溶解到使得在约7.5°和约9.1°之间的X射线衍射峰强度之比在1的范围内：1〜0.1：1。当组合使用至少一种其它电荷产生剂时，电荷产生层形成在其上形成电荷传输层的导电载体上。如果不使用这种其他试剂，则在电荷输送层上形成一定厚度的电荷产生层。感光材料具有良好的光敏性，图像特性和耐印刷性。

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