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31. 发明授权

US08662708B2 Double heat sink LED tube 有权
标题翻译：双散热LED管
公开(公告)号：US08662708B2
公开(公告)日：2014-03-04
申请号：US13275803
申请日：2011-10-18
申请人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
发明人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
IPC分类号： F21V33/00
CPC分类号： F21V23/06 , F21K9/27 , F21V23/001 , F21V29/71
摘要： A LED tube having double heat sinks is disclosed. One of the embodiment shows a first plurality of light unit is fixed onto the top heat sink, and a second plurality of light unit is fixed onto the bottom heat sink, while with the light chips configured in between the two heat sinks for light emission to the ambient.
摘要翻译：公开了具有双重散热器的LED管。其中一个实施例示出了将第一多个光单元固定到顶部散热器上，并且将第二多个光单元固定到底部散热器上，同时将两个散热片之间的光芯片配置成用于发光环境。

32. 发明申请

US20110252908A1 RETURN STRUCTURE FOR A BALL SCREW WITH A CHAIN TYPE ROLLING ASSEMBLY 有权
标题翻译：具有链式滚动总成的球螺旋的返回结构
公开(公告)号：US20110252908A1
公开(公告)日：2011-10-20
申请号：US13172724
申请日：2011-06-29
申请人： Ming-Yao Lin , Chang-Hsin Kuo
发明人： Ming-Yao Lin , Chang-Hsin Kuo
IPC分类号： F16H25/22
CPC分类号： F16H25/2219 , F16H25/2238 , Y10T74/19767 , Y10T74/19777
摘要： A ball screw comprises a screw, a nut, two return assemblies and a rolling assembly. The two return assemblies are disposed in two ends of the nut, and each of the return assemblies is defined with a return passage provided with two guiding grooves at two sides thereof for guiding the linking portions of the rolling assembly. The guiding grooves twist an angle of about 90 degrees within the return portion of each of the return assemblies to prevent the linking portions from being stretched or extruded improperly to reduce the deformation to the lowest, thus effectively extending the service life of the rolling assembly.
摘要翻译：滚珠丝杠包括螺钉，螺母，两个返回组件和滚动组件。两个返回组件设置在螺母的两端中，并且每个返回组件由在其两侧设置有两个引导槽的返回通道限定，用于引导滚动组件的连接部分。引导槽在每个返回组件的返回部分内扭转大约90度的角度，以防止连接部分被不适当地拉伸或挤压，以将变形减小到最低，从而有效地延长了滚动组件的使用寿命。

33. 发明授权

US07775784B2 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US07775784B2
公开(公告)日：2010-08-17
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L21/56
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

34. 发明申请

US20100107794A1 Circulating device for motion guide apparatus 有权
标题翻译：运动导向装置循环装置
公开(公告)号：US20100107794A1
公开(公告)日：2010-05-06
申请号：US12455879
申请日：2009-06-09
申请人： Ming-Yao Lin , Chang Hsin Kuo , Zong-Sian Jiang
发明人： Ming-Yao Lin , Chang Hsin Kuo , Zong-Sian Jiang
IPC分类号： F16H25/22
CPC分类号： F16H25/2214 , Y10T74/19744 , Y10T74/19749 , Y10T74/19753 , Y10T74/19767 , Y10T74/19772 , Y10T74/19777
摘要： A motion guide device includes a ball nut attached onto a shaft and having helical grooves for receiving ball bearing elements, a tubular member is engaged with the ball nut and includes a ball circulating pathway communicative with the helical groove of the ball nut, and includes an intermediate segment, two curved segments, and two end coupling segments each having a ball guiding channel which includes a wider inner section for guiding and circulating the flexible coupling member of a ball coupler to smoothly move through the ball guiding channel of each end coupling segment and for preventing the flexible coupling member from being twisted. The tubular member is preferably formed by two half members.
摘要翻译：运动导向装置包括一个安装在轴上的滚珠螺母，并具有用于接收滚珠轴承元件的螺旋槽，一个管状件与滚珠螺母啮合并包括一个与滚珠螺母螺旋槽连通的滚珠循环路径，中间段，两个弯曲段和两个端部联接段，每个端部联接段具有球引导通道，其包括较宽的内部区段，用于引导和循环球形联接器的柔性联接构件以平滑地移动通过每个端部联接段的球引导通道，用于防止挠性联接件扭曲。管状构件优选由两个半构件形成。

35. 发明申请

US20080149951A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20080149951A1
公开(公告)日：2008-06-26
申请号：US11643786
申请日：2006-12-22
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Ming-Yao Lin , Wen-Yung Yeh , Chia-Chang Kuo , Sheng-Pan Huang
IPC分类号： H01L33/00 , H01L29/205
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/09701 , H01L2924/3011 , H01L2924/00014
摘要： A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.
摘要翻译：一种发光器件，包括具有可连接到电源的两个电导体的携带元件，设置在所述承载元件上并电连接到所述两个电导体的发光元件以及电连接到所述发光元件的至少一个校正元件，其中所述发光元件适于在所述两个电导体与所述电源连接时提供光源，并且所述至少一个校正元件允许所述发光元件具有温度补偿，电压校正或浪涌吸收的功能。

36. 发明申请

US20070091641A1 Backlight structure 审中-公开
标题翻译：背光结构
公开(公告)号：US20070091641A1
公开(公告)日：2007-04-26
申请号：US11583944
申请日：2006-10-20
申请人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
发明人： Ming-Te Lin , Sheng-Pan Huang , Shang-Ping Ying , Ya-Hui Chiang , Ming-Yao Lin
IPC分类号： F21V7/04
CPC分类号： G02F1/133605 , G02B6/0031 , G02B6/0046 , G02B6/0078 , G02F1/133603 , G02F1/133609
摘要： A backlight structure is disclosed, which is constituted of a series of backlight devices connecting with one another to form a large-scale backlight area, the backlight device at least being composed of an emitting portion and a light-guiding portion, wherein the emitting portion provides a light source, mixes the light of the light source and provides the mixed light into the light-guiding portion, which then guides the mixed light out. The emitting portion connects with the light-guiding portion to form a fault structure for connecting with another light-guiding portion, thereby forming a large-scale backlight structure by connecting a sequence of the light-guiding portions using the fault structures without size constraints.
摘要翻译：公开了一种背光结构，其由相互连接以形成大规模背光区域的一系列背光装置构成，所述背光装置至少由发光部分和导光部分组成，其中所述发光部分提供光源，混合光源的光，并将混合光提供到导光部分，然后引导混合光。发光部分与导光部分连接以形成用于与另一个导光部分连接的故障结构，从而通过使用故障结构连接一系列导光部分而没有尺寸限制来形成大规模的背光结构。

37. 发明申请

US20070080354A1 Power package and fabrication method thereof 审中-公开
标题翻译：电源封装及其制造方法
公开(公告)号：US20070080354A1
公开(公告)日：2007-04-12
申请号：US11544046
申请日：2006-10-06
申请人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
发明人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48247 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014
摘要： The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.
摘要翻译：本发明涉及一种组合发光二极管（LED）封装结构及其制造方法。组合的LED封装结构包括LED芯片，导电结构和密封剂。密封剂封装LED芯片和导电结构的一部分。导电结构具有厚金属构件和薄金属构件。厚金属构件用于承载LED芯片，为LED芯片提供吸热和散热路径，底部和其侧面的一部分暴露于密封剂的外部以增加散热面积。该薄金属构件经由至少两个导电引线电连接到LED芯片，该导电引线延伸到封装体外部的区域，以用作LED封装结构的外部电极。

38. 发明授权

US08931924B2 Heat sink for LED lamp 有权
标题翻译： LED灯泡散热片
公开(公告)号：US08931924B2
公开(公告)日：2015-01-13
申请号：US13270582
申请日：2011-10-11
申请人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
发明人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
IPC分类号： F21V29/00 , F21K99/00 , F21V3/02 , F21V3/00
CPC分类号： F21K9/23 , F21V3/02 , F21V29/506 , F21V29/777 , F21V29/83 , F21V29/86 , F21V29/89 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A LED lamp is disclosed which is composed of a plurality of light unit, each of the light unit has metal its leads inserted into a heat sink for heat dissipation. A circuit board is optionally to use for electrically coupling the metal leads of each light unit to a control circuit for controlling the on/off of each of the light units.
摘要翻译：公开了一种LED灯，其由多个光单元组成，每个灯单元具有金属引线，其插入散热器中用于散热。电路板可选地用于将每个光单元的金属引线电耦合到用于控制每个光单元的开/关的控制电路。

39. 发明授权

US08502250B2 Light emitting diode package and light emitting diode module 有权
标题翻译：发光二极管封装和发光二极管模块
公开(公告)号：US08502250B2
公开(公告)日：2013-08-06
申请号：US12980358
申请日：2010-12-29
申请人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
IPC分类号： H01L33/60 , H01L33/08
CPC分类号： F21V3/00 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/70 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.
摘要翻译：提供了包括载体，LED芯片，透镜和荧光体层的发光二极管（LED）封装。设置在载体上的LED芯片。封装LED芯片的透镜具有围绕LED芯片的多个翅片和圆锥形凹口。翅片径向向后延伸LED芯片。每个翅片具有至少一个发光表面和邻近发光表面的至少一个反射表面。锥形凹陷的底面作为全反射面。荧光体层设置在透镜的发光面上。还提供LED封装和LED模块。

40. 发明授权

US08455888B2 Light emitting diode module, and light emitting diode lamp 有权
标题翻译：发光二极管模块和发光二极管灯
公开(公告)号：US08455888B2
公开(公告)日：2013-06-04
申请号：US12978646
申请日：2010-12-27
申请人： Ming-Te Lin , Ming-Yao Lin , Shang-Pin Ying , Chih-Hsuan Liu , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Shang-Pin Ying , Chih-Hsuan Liu , Kuang-Yu Tai
IPC分类号： H01L33/48
CPC分类号： F21V3/00 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/70 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.
摘要翻译：提供了一种包括插座的发光二极管（LED）灯，设置在插座上的LED模块和组装到插座的灯壳体。 LED模块包括支撑构件和多个LED封装，其中每个LED封装包括芯片载体，反射构件，LED芯片，透镜和荧光体层。安装在芯片载体上的反射构件具有用于暴露芯片载体的部分的凹部。 LED芯片设置在凹槽中。封装LED芯片的透镜具有发光面，与反射构件接合的第一反射面和第二反射面，其中，LED芯片面向透镜的发光面。

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