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31. 发明授权

US5965937A Thermal interface attach mechanism for electrical packages 失效
标题翻译：电气封装的热接口连接机构
公开(公告)号：US5965937A
公开(公告)日：1999-10-12
申请号：US990856
申请日：1997-12-15
申请人： Chia-Pin Chiu , Gregory Turturro
发明人： Chia-Pin Chiu , Gregory Turturro
IPC分类号： H01L23/433 , H05K7/20 , H01L23/16
CPC分类号： H01L23/433 , H05K7/2049 , H01L2924/0002
摘要： An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a substrate such as a printed circuit board. A cover may be attached to an opposite side of the substrate. There is typically a space between the integrated circuit package and the thermal plate that is filled with a thermal grease. The spring is located between the cover and the substrate in a manner which deflects the spring and exerts a force on the substrate. The spring force pushes the substrate and the integrated circuit package into the thermal plate. The spring may be designed to always provide a sufficient force to ensure a minimum space between the integrated circuit package and the thermal plate for assemblies produced in a mass production process.
摘要翻译：本发明的电子盒包括将集成电路封装件推入热板的弹簧。集成电路封装和基板连接到诸如印刷电路板的基板。盖可以附接到基板的相对侧。在集成电路封装和热板之间通常有一个填充有导热油脂的空间。弹簧以使弹簧偏转并在基底上施加力的方式位于盖和基板之间。弹簧力将基板和集成电路封装推入热板。弹簧可以设计成总是提供足够的力以确保集成电路封装和用于在批量生产过程中生产的组件的热板之间的最小空间。

32. 发明授权

US5953209A Push and pull dual-fan heat sink design 失效
标题翻译：推拉双风扇散热器设计
公开(公告)号：US5953209A
公开(公告)日：1999-09-14
申请号：US990713
申请日：1997-12-15
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H05K7/20 , H05H7/20
CPC分类号： H05K7/20154
摘要： An electronic cartridge that includes a pair of fans which push and pull air from a heat sink of an electronic cartridge. The heat sink is mounted to the electronic cartridge. The cartridge may include integrated circuit packages which generate heat that flows into the heat sink. A first fan is attached to the heat sink and induces a flow of air into the sink. A second fan is attached to the heat sink and induces a flow of air away from the sink. The heat sink typically has a plurality of fins that are separated by a plurality of channels. The fans induce a flow of air across the channels from the first fan to the second fan. The flow of air across the channels reduces the likelihood of dead air zones within the heat sink and hot spots on the cartridge.
摘要翻译：一种电子墨盒，包括一对风扇，其从电子墨盒的散热片推动和拉出空气。散热器安装在电子墨盒上。墨盒可以包括产生流入散热器的热的集成电路封装。第一个风扇连接到散热器，并引起空气流入水槽。第二个风扇连接到散热器，并引起空气流离开水槽。散热器通常具有由多个通道分离的多个散热片。风扇引导空气从第一风扇到第二风扇通过通道。穿过通道的空气流减少了散热片内的死气区和墨盒上的热点的可能性。

33. 发明申请

US20190006731A1 HEAT SINK FOR 5G MASSIVE ANTENNA ARRAY AND METHODS OF ASSEMBLING SAME 审中-公开
公开(公告)号：US20190006731A1
公开(公告)日：2019-01-03
申请号：US15638715
申请日：2017-06-30
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01Q1/02 , H05K7/20
摘要： A massive array antenna apparatus is configured with a cantilevered heat pipe that allows a semiconductive millimeter-wave device to move independently from a heat-sink base during thermal expansion and contraction.

34. 发明申请

US20150270169A1 METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTRONIC PACKAGE 有权
标题翻译：将第一电子包连接到第二电子包的方法
公开(公告)号：US20150270169A1
公开(公告)日：2015-09-24
申请号：US14219749
申请日：2014-03-19
申请人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
发明人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
IPC分类号： H01L21/768 , H01L21/56 , H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L21/4853 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L24/03 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/16227 , H01L2224/48227 , H01L2224/81801 , H01L2225/06517 , H01L2225/06548 , H01L2225/06555 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01029 , H01L2924/06 , H01L2924/15311 , H01L2924/15321 , H01L2924/1815 , H01L2924/381
摘要： A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
摘要翻译：一种制造电子封装的方法。该方法包括用电导体填充模具以在模具内形成多个电互连。模具包括填充有多个电导体以形成多个电互连的开口。制造电子封装的方法还包括将模具附接到基板，使得电互连件接合基板上的电触点。制造电子封装的方法还可以包括在电绝缘体上形成接合电互连并将管芯连接到衬底上的导电焊盘，使得管芯电连接到至少一些电互连。

35. 发明申请

US20150091182A1 DIE ASSEMBLY ON THIN DIELECTRIC SHEET 有权
标题翻译：电介质薄膜组件
公开(公告)号：US20150091182A1
公开(公告)日：2015-04-02
申请号：US14041722
申请日：2013-09-30
申请人： Chia-Pin Chiu , Qing Ma , Robert L. Sankman , Paul B. Fischer , Patrick Morrow , William J. Lambert , Charles A. Gealer , Tyler Osborn
发明人： Chia-Pin Chiu , Qing Ma , Robert L. Sankman , Paul B. Fischer , Patrick Morrow , William J. Lambert , Charles A. Gealer , Tyler Osborn
IPC分类号： H01L25/00 , H01L23/15 , H01L21/48 , H01L25/065
CPC分类号： H01L25/0655 , H01L21/4803 , H01L21/561 , H01L21/568 , H01L23/15 , H01L23/3121 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24137 , H01L2224/2499 , H01L2224/32225 , H01L2224/73204 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.
摘要翻译：描述了形成在薄介电片上的模具组件。在一个示例中，第一和第二管芯具有互连区域。将诸如玻璃，硅或氧化金属之类的电介质片施加在管芯的互连区域上。导电孔形成在电介质片中以与互连区的焊盘连接。堆积层包括通过导电通孔将第一管芯互连区的焊盘连接到第二管芯互连区的焊盘的路由，并且覆盖被施加在管芯，电介质层和堆积层上。

36. 发明授权

US07638874B2 Microelectronic package including temperature sensor connected to the package substrate and method of forming same 有权
标题翻译：微电子封装包括温度传感器连接到封装衬底及其形成方法
公开(公告)号：US07638874B2
公开(公告)日：2009-12-29
申请号：US11474182
申请日：2006-06-23
申请人： Chia-Pin Chiu , John P. Dirner
发明人： Chia-Pin Chiu , John P. Dirner
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/467 , H01L2224/16 , H01L2924/15311
摘要： A microelectronic package, a method of forming the package and a system incorporating the package. The package includes a substrate; a die bonded to the substrate; and a thermal sensor connected to the substrate.
摘要翻译：微电子封装，形成封装的方法和结合封装的系统。所述包装包括基材; 与基板结合的管芯; 以及连接到基板的热传感器。

37. 发明授权

US07637751B1 Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving 有权
公开(公告)号：US07637751B1
公开(公告)日：2009-12-29
申请号：US12456211
申请日：2009-06-12
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01L2224/16225 , H01L2224/73253 , H01R13/2442 , H05K3/326 , H05K3/4015 , H05K2201/0311 , H05K2201/1031 , H05K2201/10719 , Y02P70/611 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222
摘要： The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

38. 发明授权

US07566228B2 Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving 有权
标题翻译：用于将IC器件连接到电路板的滑动电接点和通过扫描进行接触的方法
公开(公告)号：US07566228B2
公开(公告)日：2009-07-28
申请号：US11768382
申请日：2007-06-26
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01L2224/16225 , H01L2224/73253 , H01R13/2442 , H05K3/326 , H05K3/4015 , H05K2201/0311 , H05K2201/1031 , H05K2201/10719 , Y02P70/611 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222
摘要： The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.
摘要翻译：所公开的实施例涉及使用刮削技术形成电接触。电触点包括已经从下面的金属体滑开的弹簧结构，但是弹簧保持与金属体结合，该金属体为弹簧结构提供基座。电接触件的刮刀弹簧部分可包括悬臂状弹簧，线圈状弹簧或任何其它合适类型的弹簧。这种弹簧接点可用于在集成电路器件和电路板（或其他衬底）之间形成电连接。描述和要求保护其他实施例。

39. 发明申请

US20080160330A1 Copper-elastomer hybrid thermal interface material to cool under-substrate silicon 审中-公开
标题翻译：铜 - 弹性体混合热界面材料，用于冷却底部衬底硅
公开(公告)号：US20080160330A1
公开(公告)日：2008-07-03
申请号：US11648214
申请日：2006-12-29
申请人： David Song , Kelly Lofgreen , Barrett Faneuf , Chia-Pin Chiu , Stephen Montgomery , Todd Young , Seth Reynolds
发明人： David Song , Kelly Lofgreen , Barrett Faneuf , Chia-Pin Chiu , Stephen Montgomery , Todd Young , Seth Reynolds
IPC分类号： C22C28/00
CPC分类号： C22C9/00 , B32B15/08 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L23/427 , H01L25/18 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15313 , H01L2924/15323 , Y10T428/12007 , H01L2924/00 , H01L2224/0401
摘要： In some embodiments, copper-elastomer hybrid thermal interface material to cool under-substrate silicon is presented. In this regard, an apparatus is introduced having a layer of copper, a layer of elastomer, and a layer of thin film thermal interface material between the copper and elastomer layers. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，提出了用于冷却底部衬底硅的铜 - 弹性体混合热界面材料。在这方面，引入在铜和弹性体层之间具有铜层，弹性体层和薄膜热界面材料层的装置。还公开并要求保护其他实施例。

40. 发明申请

US20070217147A1 INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH TARGETED CHANNEL CONFIGURATION 审中-公开
标题翻译：集成电路冷凝器微通道组件与目标通道配置
公开(公告)号：US20070217147A1
公开(公告)日：2007-09-20
申请号：US11749444
申请日：2007-05-16
申请人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher , Rajiv Mongia , Himanshu Pokharna , Eric DiStefano
发明人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher , Rajiv Mongia , Himanshu Pokharna , Eric DiStefano
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
摘要翻译：微通道结构中形成有微通道。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。每个子通道具有大于第一宽高比的相应的第二宽高比。

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