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31. 发明公开

EP3055019A1 HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER 有权
标题翻译： HERMETIC高级ACCOMPLISHMENTS的半导体晶片等
公开(公告)号：EP3055019A1
公开(公告)日：2016-08-17
申请号：EP14786773.3
申请日：2014-10-09
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： A61N1/375 , A61N1/05 , H01L23/057 , H05K5/00
CPC分类号： C03B23/20 , A61N1/3754 , A61N1/3756 , B81B2207/095 , B81C1/00301 , H01L23/057 , H01L23/10 , H01L2924/0002 , H05K5/0095 , H01L2924/00
摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

32. 发明公开

EP2142083A2 LAYERED STRUCTURE FOR CORROSION RESISTANT INTERCONNECT CONTACTS 审中-公开
标题翻译：层结构用于抗腐蚀连接触点
公开(公告)号：EP2142083A2
公开(公告)日：2010-01-13
申请号：EP08746988.8
申请日：2008-04-28
申请人： MEDTRONIC, INC.
发明人： RUBEN, David A.
IPC分类号： A61B5/02
CPC分类号： A61B5/0215 , A61B2562/028
摘要： The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a first conductive layer, a second conductive layer introduced over the first conductive layer, and a third conductive layer introduced over the second conductive layer. One of the first conductive layer, the second conductive layer, and the third conductive layer comprises titanium-niobium (Ti-Nb).

33. 发明授权

EP1976428B1 MEDIA-EXPOSED INTERCONNECTS FOR TRANSDUCERS 有权
标题翻译：媒体曝光连接器，转换器
公开(公告)号：EP1976428B1
公开(公告)日：2009-11-25
申请号：EP06840258.5
申请日：2006-12-14
申请人： Medtronic, Inc.
发明人： SCHUGT, Michael A. , MOTHILAL, Kamal Deep , LARSON, Lary R. , MATTES, Michael F. , RUBEN, David A.
IPC分类号： A61B5/0215 , A61N1/05
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

34. 发明公开

EP4284498A1 ELECTRONIC PACKAGE AND DEVICE INCLUDING SAME 审中-实审
公开(公告)号：EP4284498A1
公开(公告)日：2023-12-06
申请号：EP22704697.6
申请日：2022-01-31
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , RIES, Andrew J. , SHAH, Pankti N. , HAMACK, Jason D.
IPC分类号： A61N1/39 , A61N1/02 , H01R4/00 , H01R9/00 , H05K7/00 , B81B7/00 , A61N1/378 , A61N1/375 , A61N1/36

35. 发明公开

EP4061574A1 LASER CUTTING SYSTEM 有权
公开(公告)号：EP4061574A1
公开(公告)日：2022-09-28
申请号：EP20820681.3
申请日：2020-11-13
申请人： Medtronic, Inc.
发明人： HE, Xiangnan , RUBEN, David A. , HENSCHEL, Mark E. , KIM, Chunho , WANG, Yongqian , TOLES, Rodney D.
IPC分类号： B23K26/06 , B23K26/38

36. 发明授权

EP3362136B1 SEALED IMPLANTABLE MEDICAL DEVICE 有权
公开(公告)号：EP3362136B1
公开(公告)日：2020-11-04
申请号：EP16760303.4
申请日：2016-08-26
申请人： Medtronic, Inc.
发明人： BARROR, Michael W. , DAY, John K. , RUBEN, David A. , BRADLEY, James D.
IPC分类号： A61N1/05 , A61N1/372 , A61N1/375

37. 发明授权

EP3347902B1 POWER SOURCE 有权
公开(公告)号：EP3347902B1
公开(公告)日：2019-07-24
申请号：EP16767091.8
申请日：2016-09-02
申请人： Medtronic, Inc.
发明人： FENNER, Andreas A. , RUBEN, David A. , MARCKMANN, Jennifer Lorenz , WASSON, James R.
IPC分类号： G21H1/12

38. 发明公开

EP3370823A1 SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE 有权
公开(公告)号：EP3370823A1
公开(公告)日：2018-09-12
申请号：EP16790507.4
申请日：2016-10-27
申请人： Medtronic, Inc.
发明人： DAY, John K. , NIDELKOFF, Michael J. , PETERSON, Kris A. , RIES, Andrew J. , RUBEN, David A. , WIKLUND, Craig L.
IPC分类号： A61N1/378 , A61N1/375
CPC分类号： H05K5/069 , A61J1/00 , A61N1/3758 , A61N1/378 , H01M2/30 , H01M2220/30 , H05K5/0086 , H05K7/1417
摘要： Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

39. 发明公开

EP3237060A1 IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：可植入医疗设备
公开(公告)号：EP3237060A1
公开(公告)日：2017-11-01
申请号：EP15823893.1
申请日：2015-12-22
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： A61N1/375
CPC分类号： H05K5/066 , A61N1/3754 , H05K3/32 , H05K3/38 , H05K3/42 , H05K7/06 , H05K2203/107
摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
摘要翻译：公开了可植入医疗设备系统的各种实施例以及形成这种系统的方法。在一个或多个实施例中，可植入医疗设备系统包括壳体，布置在壳体内的电子器件以及附连到壳体的侧壁并电耦合到电子器件的馈通组件。馈通组件可以包括非导电衬底和馈通。馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料以及设置在非导电衬底的外表面上的通孔上的外部触点，其中外部触点电连接到布置在通孔中的导电材料。在一个或多个实施例中，外部触点通过围绕通孔的激光键合而密封到非导电衬底的外表面。

40. 发明公开

EP1976428A1 MEDIA-EXPOSED INTERCONNECTS FOR TRANSDUCERS 有权
标题翻译：媒体曝光连接器，转换器
公开(公告)号：EP1976428A1
公开(公告)日：2008-10-08
申请号：EP06840258.5
申请日：2006-12-14
申请人： MEDTRONIC, INC.
发明人： SCHUGT, Michael A. , MOTHILAL, Kamal Deep , LARSON, Lary R. , MATTES, Michael F. , RUBEN, David A.
IPC分类号： A61B5/0215 , A61N1/05
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

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