专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

EP3237060B1 IMPLANTABLE MEDICAL DEVICES 有权
公开(公告)号：EP3237060B1
公开(公告)日：2019-06-12
申请号：EP15823893.1
申请日：2015-12-22
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： A61N1/375 , H05K3/32 , H05K5/06 , H05K7/06

32. 发明公开

EP3381050A1 EMBEDDED METALLIC STRUCTURES IN GLASS 有权
公开(公告)号：EP3381050A1
公开(公告)日：2018-10-03
申请号：EP16806380.8
申请日：2016-11-17
申请人： Medtronic, Inc.
发明人： DAY, John K. , RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： H01L23/15 , H01L23/498
CPC分类号： H05K1/0306 , H01L21/6835 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2224/16225 , H05K1/09 , H05K1/115 , H05K1/144 , H05K3/10 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K3/4644 , H05K2201/09036
摘要： A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

33. 发明公开

EP3237061A1 FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME 有权
标题翻译：馈送组件及其形成方法
公开(公告)号：EP3237061A1
公开(公告)日：2017-11-01
申请号：EP15830927.8
申请日：2015-12-22
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： A61N1/375
CPC分类号： H01L23/49827 , A61N1/3754 , H01L21/4853 , H01L21/486 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2924/0002 , H01L2924/00
摘要： Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.
摘要翻译：公开了馈通组件的各种实施例和形成这种组件的方法。在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料，以及设置在非导电衬底的外表面上的通孔上方的外部触点。外部触点可以电连接到布置在通孔中的导电材料。并且外部接触件可以通过包围通孔的接合部密封到非导电基板的外表面。在一个或多个实施例中，该键可以是激光键。

34. 发明公开

EP4284498A1 ELECTRONIC PACKAGE AND DEVICE INCLUDING SAME 审中-实审
公开(公告)号：EP4284498A1
公开(公告)日：2023-12-06
申请号：EP22704697.6
申请日：2022-01-31
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , RIES, Andrew J. , SHAH, Pankti N. , HAMACK, Jason D.
IPC分类号： A61N1/39 , A61N1/02 , H01R4/00 , H01R9/00 , H05K7/00 , B81B7/00 , A61N1/378 , A61N1/375 , A61N1/36

35. 发明公开

EP4061574A1 LASER CUTTING SYSTEM 审中-实审
公开(公告)号：EP4061574A1
公开(公告)日：2022-09-28
申请号：EP20820681.3
申请日：2020-11-13
申请人： Medtronic, Inc.
发明人： HE, Xiangnan , RUBEN, David A. , HENSCHEL, Mark E. , KIM, Chunho , WANG, Yongqian , TOLES, Rodney D.
IPC分类号： B23K26/06 , B23K26/38

36. 发明授权

EP3362136B1 SEALED IMPLANTABLE MEDICAL DEVICE 有权
公开(公告)号：EP3362136B1
公开(公告)日：2020-11-04
申请号：EP16760303.4
申请日：2016-08-26
申请人： Medtronic, Inc.
发明人： BARROR, Michael W. , DAY, John K. , RUBEN, David A. , BRADLEY, James D.
IPC分类号： A61N1/05 , A61N1/372 , A61N1/375

37. 发明授权

EP3347902B1 POWER SOURCE 有权
公开(公告)号：EP3347902B1
公开(公告)日：2019-07-24
申请号：EP16767091.8
申请日：2016-09-02
申请人： Medtronic, Inc.
发明人： FENNER, Andreas A. , RUBEN, David A. , MARCKMANN, Jennifer Lorenz , WASSON, James R.
IPC分类号： G21H1/12

38. 发明公开

EP3370823A1 SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE 有权
公开(公告)号：EP3370823A1
公开(公告)日：2018-09-12
申请号：EP16790507.4
申请日：2016-10-27
申请人： Medtronic, Inc.
发明人： DAY, John K. , NIDELKOFF, Michael J. , PETERSON, Kris A. , RIES, Andrew J. , RUBEN, David A. , WIKLUND, Craig L.
IPC分类号： A61N1/378 , A61N1/375
CPC分类号： H05K5/069 , A61J1/00 , A61N1/3758 , A61N1/378 , H01M2/30 , H01M2220/30 , H05K5/0086 , H05K7/1417
摘要： Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

39. 发明公开

EP3237060A1 IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：可植入医疗设备
公开(公告)号：EP3237060A1
公开(公告)日：2017-11-01
申请号：EP15823893.1
申请日：2015-12-22
申请人： Medtronic, Inc.
发明人： RUBEN, David A. , SANDLIN, Michael S.
IPC分类号： A61N1/375
CPC分类号： H05K5/066 , A61N1/3754 , H05K3/32 , H05K3/38 , H05K3/42 , H05K7/06 , H05K2203/107
摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.
摘要翻译：公开了可植入医疗设备系统的各种实施例以及形成这种系统的方法。在一个或多个实施例中，可植入医疗设备系统包括壳体，布置在壳体内的电子器件以及附连到壳体的侧壁并电耦合到电子器件的馈通组件。馈通组件可以包括非导电衬底和馈通。馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料以及设置在非导电衬底的外表面上的通孔上的外部触点，其中外部触点电连接到布置在通孔中的导电材料。在一个或多个实施例中，外部触点通过围绕通孔的激光键合而密封到非导电衬底的外表面。

40. 发明公开

EP1976428A1 MEDIA-EXPOSED INTERCONNECTS FOR TRANSDUCERS 有权
标题翻译：媒体曝光连接器，转换器
公开(公告)号：EP1976428A1
公开(公告)日：2008-10-08
申请号：EP06840258.5
申请日：2006-12-14
申请人： MEDTRONIC, INC.
发明人： SCHUGT, Michael A. , MOTHILAL, Kamal Deep , LARSON, Lary R. , MATTES, Michael F. , RUBEN, David A.
IPC分类号： A61B5/0215 , A61N1/05
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式