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    • 33. 发明申请
    • HIGH DENSITY ELECTRICAL INTERCONNECT FOR PRINTING DEVICES USING FLEX CIRCUITS AND DIELECTRIC UNDERFILL
    • 使用柔性电路和电介质印刷设备的高密度电气互连
    • US20120274708A1
    • 2012-11-01
    • US13097182
    • 2011-04-29
    • Peter J. NystromGary D. ReddingMark A. Cellura
    • Peter J. NystromGary D. ReddingMark A. Cellura
    • B41J2/045H01L41/22
    • B41J2/14233B41J2002/14491
    • A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
    • 用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜,将柔性电路电连接到多个压电元件,然后在柔性电路和喷射之间分配电介质底部填充物 堆栈子组件。 在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要,并且消除了对图案化间隔层的要求。 在一个实施例中,柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立,而不使用单独的导体,从而消除了由于误插入引起的电气短路的可能性 指挥