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31. 发明授权

US06566679B2 Integrated semiconductor superlattice optical modulator 有权
公开(公告)号：US06566679B2
公开(公告)日：2003-05-20
申请号：US10246967
申请日：2002-09-18
申请人： Dmitri E. Nikonov , Mario J. Paniccia
发明人： Dmitri E. Nikonov , Mario J. Paniccia
IPC分类号： H01L2978
CPC分类号： B82Y20/00 , G02F1/01708 , G02F1/025 , Y10T24/4051
摘要： Devices and techniques for integrating a silicon superlattice optical modulator on a silicon substrate with other circuit elements. The superlattice structure is designed to convert the indirect bandgap structure of silicon into a direct bandgap structure to achieve more efficient optical absorption. The modulator can be fabricated based on a structure of a circuit element by using standard fabrication processes for silicon integrated circuits such as metal oxide semiconductor processing.

32. 发明授权

US06504965B2 Method and apparatus for self-testing and maintaining alignment of an optical beam in an optical switch 失效
标题翻译：自动测试和维持光开关中的光束对准的方法和装置
公开(公告)号：US06504965B2
公开(公告)日：2003-01-07
申请号：US09733795
申请日：2000-12-07
申请人： Mario J. Paniccia , Dean A. Samara-Rubio
发明人： Mario J. Paniccia , Dean A. Samara-Rubio
IPC分类号： G02B635
CPC分类号： G02B6/3588 , G02B6/3512 , G02B6/3544
摘要： An optical processing element such as an optical switch for which continuous or periodic self-testing and/or alignment is provided. In one embodiment, an optical sensor is disposed in a semiconductor substrate layer within a region surrounding an optical path of an optical output port of the optical processing element. In one embodiment, an optical fiber optically coupled to the optical output port is disposed in a V-groove in which the optical sensor is disposed. In one embodiment, circuitry is coupled to the optical sensor to adjust continuously or periodically over time the alignment of an optical beam directed to the optical output port.
摘要翻译：一种光学处理元件，例如提供连续或周期性自我测试和/或对准的光学开关。在一个实施例中，光学传感器设置在围绕光学处理元件的光学输出端口的光路的区域内的半导体衬底层中。在一个实施例中，光耦合到光输出端口的光纤被布置在其中布置有光学传感器的V形槽中。在一个实施例中，电路耦合到光学传感器，以随着时间的推移连续或周期地调整指向光输出端口的光束的对准。

33. 发明授权

US06434289B1 Method and apparatus for confining an optical beam in an optical switch 有权
标题翻译：将光束限制在光开关中的方法和装置
公开(公告)号：US06434289B1
公开(公告)日：2002-08-13
申请号：US09676294
申请日：2000-09-28
申请人： Mario J. Paniccia , Yi Ding , Dmitri E. Nikonov
发明人： Mario J. Paniccia , Yi Ding , Dmitri E. Nikonov
IPC分类号： G02B626
CPC分类号： G02F1/025 , G02B2006/12145
摘要： A device for confining an optical beam in an optical switch. In one embodiment, the disclosed optical switch includes an optical switching device disposed between an optical input port and an optical output port in a semiconductor substrate layer disposed between a plurality of optical confinement layers such that an optical beam is confined to remain within the layers. In one embodiment, a plurality of semiconductor substrate layers are included in the optical switch. Each of the semiconductor substrate layers is disposed between optical confinement layers such that optical beams passing through the semiconductor substrate layers are confined to remain within the semiconductor substrate layers until exiting through respective optical output ports. In one embodiment, integrated circuitry such as driver circuitry, controller circuitry, logic circuitry, coder-decoder circuitry, microprocessor circuitry or the like is included in at least one of the semiconductor substrate layers.
摘要翻译：用于将光束限制在光开关中的装置。在一个实施例中，所公开的光开关包括设置在设置在多个光限制层之间的半导体衬底层中的光输入端口和光输出端口之间的光开关器件，使得光束被限制在残留在层内。在一个实施例中，光开关中包括多个半导体衬底层。每个半导体衬底层设置在光学限制层之间，使得通过半导体衬底层的光束被限制为保留在半导体衬底层内，直到通过相应的光学输出端口离开。在一个实施例中，诸如驱动器电路，控制器电路，逻辑电路，编码器 - 解码器电路，微处理器电路等的集成电路被包括在至少一个半导体衬底层中。

34. 发明授权

US06374003B1 Method and apparatus for optically modulating light through the back side of an integrated circuit die using a plurality of optical beams 有权
标题翻译：使用多个光束通过集成电路晶片的背面光学调制光的方法和装置
公开(公告)号：US06374003B1
公开(公告)日：2002-04-16
申请号：US09410195
申请日：1999-09-30
申请人： Yi Ding , Mario J. Paniccia
发明人： Yi Ding , Mario J. Paniccia
IPC分类号： G02B612
CPC分类号： G02F1/218 , G02B2006/12107 , G02B2006/12142 , G02F2001/0152 , G02F2201/307
摘要： An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. A first infrared optical beam having a photon energy less than the band gap energy of the semiconductor substrate is directed through the back side of the semiconductor substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. A second infrared optical beam having a photon energy greater than or equal to the band gap energy of the semiconductor substrate is directed through the back side of the semiconductor substrate to generate free charge carriers and increase the modulation depth of the optical modulator. The diffraction grating modulates the phase of a portion of the deflected optical beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and non-phase modulated portions of the deflected optical beam. The interference causes amplitude modulation of the zeroth order diffraction or higher order diffractions of the deflected first optical beam, from which the integrated circuit signal can be extracted.
摘要翻译：一种光学调制器，其通过倒装芯片封装集成电路的背面来调制通过半导体衬底的光。在一个实施例中，光学调制器设置在倒装芯片封装集成电路管芯内。光学调制器包括偏转器和衍射光栅。具有小于半导体衬底的带隙能量的光子能量的第一红外光束被引导通过集成电路裸片的半导体衬底的背面，通过衍射光栅偏转偏转器并从背面侧退出集成电路管芯。具有大于或等于半导体衬底的带隙能量的光子能量的第二红外光束被引导通过半导体衬底的背面以产生自由电荷载流子并增加光调制器的调制深度。衍射光栅响应于集成电路信号调制偏转光束的一部分的相位。在偏转的光束的相位调制部分和非相位调制部分之间产生衍射干涉。干涉引起偏转的第一光束的零级衍射的振幅调制或高阶衍射，从中可以提取集成电路信号。

35. 发明授权

US06251706B1 Method for cooling the backside of a semiconductor device using an infrared transparent heat slug 失效
标题翻译：使用红外透明散热片冷却半导体器件背面的方法
公开(公告)号：US06251706B1
公开(公告)日：2001-06-26
申请号：US09066718
申请日：1998-04-23
申请人： Mario J. Paniccia
发明人： Mario J. Paniccia
IPC分类号： H01L2310
CPC分类号： H01L23/373 , G01R31/2891 , G01R31/311 , H01L23/3732 , H01L23/3738 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional cooling technique.
摘要翻译：一种允许从集成电路半导体衬底的背面去除热量的装置和方法，同时通过半导体衬底的背面进行基于光学的测试。在一个实施例中，本发明包括一种具有附着在装置的背面的红外透明散热片。热量通过红外线透明散热片从半导体器件中去除，然后通过传统的冷却技术进行热冷却。

36. 发明授权

US5930588A Method for testing an integrated circuit device 失效
标题翻译：集成电路器件测试方法
公开(公告)号：US5930588A
公开(公告)日：1999-07-27
申请号：US41372
申请日：1998-03-11
申请人： Mario J. Paniccia
发明人： Mario J. Paniccia
IPC分类号： G01R31/311 , H01L21/66 , G01R31/26
CPC分类号： G01R31/311 , G01N21/9501 , G01N21/9505 , H01L22/12 , H01L2224/48091 , H01L2924/30107
摘要： A method for testing an integrated circuit situated on the top of a semiconductor substrate. The method includes the steps of focusing a photon onto a portion of the integrated circuit through an anti-reflective coating disposed on the back side of the semiconductor substrate and detecting the photon after the photon is reflected from the integrated circuit.
摘要翻译：一种用于测试位于半导体衬底顶部的集成电路的方法。该方法包括以下步骤：通过设置在半导体衬底背面上的抗反射涂层将光子聚焦到集成电路的一部分上，并在光子从集成电路反射之后检测光子。

37. 发明授权

US5923086A Apparatus for cooling a semiconductor die 失效
标题翻译：用于冷却半导体管芯的装置
公开(公告)号：US5923086A
公开(公告)日：1999-07-13
申请号：US856267
申请日：1997-05-14
申请人： Paul Winer , Mario J. Paniccia , Karl J. Ma
发明人： Paul Winer , Mario J. Paniccia , Karl J. Ma
IPC分类号： G01R31/26 , H01L23/467 , H01L23/473 , H01L23/34 , H01L23/10
CPC分类号： H01L23/467 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/15312
摘要： A method and an apparatus for cooling a semiconductor die. In one embodiment, a C4 packaged semiconductor die is thermally coupled to a cooling plate having an opening. The opening of the cooling plate is disposed over a back side surface of the semiconductor die such that direct unobstructed access to the exposed back side surface of the semiconductor die is provided. A conformable thermal conductor, such as indium, is disposed between the semiconductor die and the cooling plate to improve the thermal coupling between the semiconductor and cooling plate. In one embodiment, the semiconductor die is mounted on a circuit board and a cooling block is disposed on the opposite side of the circuit board. The cooling plate is thermally coupled to the cooling block with heat transfer conduits, such as thermal screws, that extend through the circuit board to transfer the heat from the semiconductor die through the cooling plate through the heat transfer conduits to the cooling block located on the opposite side of the circuit board. In one embodiment, coolant is circulated through the cooling block to remove heat from the cooling block.
摘要翻译：一种用于冷却半导体管芯的方法和装置。在一个实施例中，C4封装的半导体管芯与具有开口的冷却板热耦合。冷却板的开口设置在半导体管芯的背侧表面上，使得能够直接不受障碍地进入半导体管芯的暴露的背面。在半导体管芯和冷却板之间设置诸如铟的适形热导体，以改善半导体和冷却板之间的热耦合。在一个实施例中，半导体管芯安装在电路板上，并且冷却块设置在电路板的相对侧上。冷却板通过热传导管道（例如热螺丝）热耦合到冷却块，其延伸穿过电路板，以将来自半导体管芯的热量通过冷却板通过传热导管传递到位于电路板的相对侧。在一个实施例中，冷却剂循环通过冷却块以从冷却块去除热量。

38. 发明授权

US08204381B2 Broadband radio transceiver with optical transform 有权
标题翻译：带光变换的宽带无线电收发器
公开(公告)号：US08204381B2
公开(公告)日：2012-06-19
申请号：US10749184
申请日：2003-12-30
申请人： Evan R. Green , Mario J. Paniccia , Sean M. Koehl , Richard Jones , Guy S. Anthony
发明人： Evan R. Green , Mario J. Paniccia , Sean M. Koehl , Richard Jones , Guy S. Anthony
IPC分类号： H04B10/00
CPC分类号： H04B10/2575 , H04B1/71635 , H04B1/71637 , H04B2210/006 , H04L27/2096 , H04L27/223 , H04L27/2601
摘要： A broadband receiving apparatus includes an antenna to receive a radio signal having a plurality of modulation frequencies. An amplifier drives a laser source from the broadband radio signal to produce an optical signal having a plurality of spectral components. A diffraction grating transforms the optical signal into its spectral components. An array of photo-detectors converts the spectral components into electronic signals corresponding to the plurality of modulation frequencies. A transmitting apparatus includes an array of coherent laser emitters driven by electronic signals corresponding to a plurality of modulation frequencies to produce optical signals corresponding to a plurality of spectral components. A diffraction grating inverse transforms the spectral components into a composite optical signal. A photo-detector converts the composite optical signal into a composite electronic signal including the plurality of modulation frequencies. An amplifier amplifies the composite electronic signal for transmission as a broadband radio signal.
摘要翻译：宽带接收装置包括用于接收具有多个调制频率的无线电信号的天线。放大器从宽带无线电信号驱动激光源以产生具有多个频谱分量的光信号。衍射光栅将光信号转换成其光谱分量。光检测器阵列将光谱分量转换成对应于多个调制频率的电子信号。发送装置包括由对应于多个调制频率的电子信号驱动的相干激光发射器的阵列，以产生对应于多个频谱分量的光信号。衍射光栅将光谱分量逆变换成复合光信号。光检测器将复合光信号转换成包括多个调制频率的复合电子信号。放大器放大复合电子信号作为宽带无线电信号进行传输。

39. 发明授权

US07782921B2 Integrated optical detector in semiconductor reflector 有权
标题翻译：集成光检测器在半导体反射器
公开(公告)号：US07782921B2
公开(公告)日：2010-08-24
申请号：US11092059
申请日：2005-03-28
申请人： Andrew C. Alduino , Mario J. Paniccia , Rami Cohen , Assia Barkai , Ansheng Liu
发明人： Andrew C. Alduino , Mario J. Paniccia , Rami Cohen , Assia Barkai , Ansheng Liu
IPC分类号： H01S5/00
CPC分类号： G02B6/4246 , G02B6/4214 , G02B2006/12104
摘要： An electrical-optical coupling and detecting device. An apparatus according to an embodiment of the present invention includes a reflective surface defined on semiconductor material. The reflective surface is to reflect an incident optical beam towards an optical destination. An optical detector is monolithically integrated in the reflective surface of the semiconductor material. The optical detector arranged in the reflective surface of the semiconductor material is to detect the incident optical beam.
摘要翻译：一种电光耦合和检测装置。根据本发明实施例的装置包括限定在半导体材料上的反射表面。反射表面是将入射光束反射到光学目的地。光学检测器单片集成在半导体材料的反射表面中。布置在半导体材料的反射表面中的光学检测器是检测入射光束。

40. 发明申请

US20090067038A1 SEMICONDUCTOR RAMAN RING AMPLIFIER 失效
标题翻译：半导体拉邦放大器
公开(公告)号：US20090067038A1
公开(公告)日：2009-03-12
申请号：US12267501
申请日：2008-11-07
申请人： Ying-hao Kuo , Haisheng Rong , Mario J. Paniccia
发明人： Ying-hao Kuo , Haisheng Rong , Mario J. Paniccia
IPC分类号： H01S3/00
CPC分类号： H04B10/2916 , H01S3/0078 , H01S3/06754 , H01S3/06758 , H01S3/06791 , H01S3/094015 , H01S3/1003 , H01S3/302
摘要： A semiconductor-based Raman ring amplifier is disclosed. A method according to aspects of the present invention includes directing a pump optical beam having a pump wavelength and an input pump power level from an optical waveguide into a ring resonator. The optical waveguide and ring resonator are comprised in semiconductor material. A signal optical beam having a signal encoded thereon at a signal wavelength is directed from the optical waveguide into the ring resonator. The pump optical beam is resonated within the ring resonator to increase a power level of the pump optical beam to a power level sufficient to amplify the signal optical beam via stimulated Raman scattering (SRS) within the ring resonator. A free carrier concentration in the optical waveguide and the ring resonator is reduced to reduce attenuation of the pump optical beam and the signal beam.
摘要翻译：公开了一种基于半导体的拉曼环形放大器。根据本发明的方面的方法包括将具有泵浦波长的泵浦光束和来自光波导的输入泵功率电平引导到环形谐振器中。光波导和环形谐振器包含在半导体材料中。在信号波长处编码有信号的信号光束从光波导引导到环形谐振器中。泵浦光束在环形谐振器内谐振，以将泵浦光束的功率电平增加到足以通过环形谐振器内经受激拉曼散射（SRS）放大信号光束的功率水平。降低光波导和环形谐振器中的自由载流子浓度，以减少泵浦光束和信号光束的衰减。

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