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    • 31. 发明申请
    • Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof
    • 制造增塑的,抗增塑的和结晶的导电聚合物及其前体的方法
    • US20090304908A1
    • 2009-12-10
    • US12583030
    • 2009-08-12
    • Marie AngelopoulosYun-Hsin LiaoRavi F. Saraf
    • Marie AngelopoulosYun-Hsin LiaoRavi F. Saraf
    • B05D5/12H01B1/12
    • H01B1/128
    • Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. High levels of electrical conductivity are achieved in in the electrically conductive materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity. In the preferred embodiment, additives are added to a solution containing a solvent and the precursor or electrically conductive polymer. The additives are preferably plasticizer of diluents. As the solvent is removed the material dries and contains a higher degree of crystallinity than in the absence of the additive.
    • 描述了形成具有高结晶度的导电聚合物和导电聚合物前体的材料的方法。 通过在允许它们彼此结合以形成结晶状态的聚合物分子提供高度迁移率的条件下制备材料来实现高结晶度。 在导电材料中实现高水平的导电性而不使材料拉伸定向。 与具有各向同性电导率的拉伸取向膜相比,增强的导电性是各向同性的。 在优选的实施方案中,将添加剂加入到含有溶剂和前体或导电聚合物的溶液中。 添加剂优选稀释剂的增塑剂。 当除去溶剂时,与没有添加剂相比,材料干燥并含有更高的结晶度。
    • 32. 发明申请
    • POLYCRYSTALLINE CONDUCTING POLYMERS AND PRECURSORS THEREOF HAVING ADJUSTABLE MORPHOLOGY AND PROPERTIES
    • 具有可调节形态和性质的多晶硅导电聚合物及其前驱体
    • US20090032775A1
    • 2009-02-05
    • US12137646
    • 2008-06-12
    • Marie AngelopoulosYun-Hsin LiaoRavi F. Saraf
    • Marie AngelopoulosYun-Hsin LiaoRavi F. Saraf
    • H01B1/12C08K5/09C08K5/10C08K5/5317
    • C08G61/12H01B1/128Y10T428/249958
    • Polycrystalline materials containing crystallies of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material containing precursors to electrically conductive polymers and/or electrically conductive polymers. The degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. This is preferable achieved by including additives, such as plasticizers and diluents, to the solution from which the polycrystalline material is formed. The morphology of the polycrystalline material is adjustable to modify the properties of the material such as the degree of crystallinity, crystal grain size, glass transition temperature, thermal coefficient of expansion and degree of electrical conductivity. High levels of electrical conductivity are achieved in in the electrically conductive polycrystalline materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity.
    • 描述了具有可调节高结晶度的导电聚合物和导电聚合物的前体结晶的多晶材料。 微晶之间的区域包含含有导电聚合物和/或导电聚合物的前体的无定形材料。 通过在允许它们彼此结合以形成结晶状态的聚合物分子提供高度迁移率的条件下制备材料来实现结晶度。 优选通过将诸如增塑剂和稀释剂的添加剂添加到形成多晶材料的溶液中来实现。 可以调节多晶材料的形态,以改变材料的性质,例如结晶度,晶粒尺寸,玻璃化转变温度,热膨胀系数和电导率。 在导电多晶材料中实现高水平的导电性,而不拉伸定向该材料。 与具有各向同性电导率的拉伸取向膜相比,增强的导电性是各向同性的。
    • 34. 发明授权
    • Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof
    • 使用调谐聚合物膜作为底层的多层抗蚀剂系统及其制造方法
    • US07361444B1
    • 2008-04-22
    • US09256034
    • 1999-02-23
    • Marie AngelopoulosKatherina E. BabichDouglas Charles LaTulipeQinghuang LinDavid R. MedeirosWayne Martin MoreauKaren E. PetrilloJohn P. Simons
    • Marie AngelopoulosKatherina E. BabichDouglas Charles LaTulipeQinghuang LinDavid R. MedeirosWayne Martin MoreauKaren E. PetrilloJohn P. Simons
    • G03F7/023
    • G03F7/091Y10S430/145
    • Disclosed are multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a multilayer resist structure exhibiting high resolution, residue free lithography and methods of preparing these materials. These underlayer films include the group consisting of novolac based resists whose processing conditions are controlled, polyarylsulfones such as the BARL material, polyhydroxystyrene based derivatives, an example being a copolymer of polyhydroxystyrene and polyhydroxystyrene reacted with anthracenemethanol that contains a cross-linker, and acid catalyst (thermal acid generator), polyimides, polyethers in particular polyarylene ethers, polyarylenesulfides, polycarbonates such as polyarylenecarbonates, epoxies, epoxyacrylates, polyarylenes such as polyphenylenes, polyarylenevinylenes such as polyphenylenevinylenes, polyvinylcarbazole, cyclicolefins, and polyesters. Such films have index of refraction and extinction coefficient tunable from about 1.4 to about 2.1 and from about 0.1 to about 0.6 at UV and DUV wavelengths, in particular 365, 248, 193 and 157 nm and EUV. Moreover, underlayer films produced in the present invention do not interact with the resist limiting interfacial mixing and contamination of resist by an outgassing product. The bilayer and TSI resist structures can be used for 248, 193, 157, EUV, x-ray, e-beam, and ion beam technology.
    • 公开了包括双层和顶面成像的多层抗蚀剂结构,其利用用作ARC的调谐底层,平坦化层和耐蚀刻硬掩模,其特性如光学,化学和物理性质被定制以产生呈现高分辨率的多层抗蚀剂结构 自由光刻及其制备方法。 这些下层膜包括其加工条件被控制的基于酚醛清漆的抗蚀剂的组,诸如BARL材料的聚芳基砜,聚羟基苯乙烯基衍生物,作为与含有交联剂的蒽甲醇反应的聚羟基苯乙烯和聚羟基苯乙烯的共聚物的实例,以及酸催化剂 (热酸生成剂),聚酰亚胺,聚醚,特别是聚亚芳基醚,聚芳基硫醚,聚碳酸酯如聚芳基碳酸酯,环氧化物,环氧丙烯酸酯,聚亚芳基如聚苯撑,聚亚芳基亚乙烯基如聚亚苯基亚乙烯基,聚乙烯基咔唑,环烯烃和聚酯。 这种膜的折射率和消光系数在UV和DUV波长,特别是365,248,293和157nm以及EUV下可调节为约1.4至约2.1和约0.1至约0.6。 此外,在本发明中制备的底层膜不与抗蚀剂界面混合和除气产物对抗蚀剂的污染相互作用。 双层和TSI抗蚀剂结构可用于248,193,157,EUV,X射线,电子束和离子束技术。