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    • 37. 发明专利
    • SCREEN PRINTING MACHINE
    • JPH05185579A
    • 1993-07-27
    • JP471292
    • 1992-01-14
    • MATSUSHITA ELECTRIC IND CO LTD
    • WACHI AKIHIKOYANAIKE SEISHIROU
    • B41F15/08H05K3/12
    • PURPOSE:To provide a screen printing machine which is capable of executing highly accurate printing, answering to requirements for fine pitches, and is available for correct adjustments for positioning regardless of errors arising from mechanical movement of a substrate on which the printing is executed. CONSTITUTION:A screen printing machine described in the subject is constructed in a structure including a screen 5 equipped with a printing mechanism 10 and position adjustment mechanisms 7, 8 and 9, a stage part 1 that holds a substrate 2 on which screen process printing is executed and moves the substrate to a place on a specified position, a position recognition camera 3, an image processing part that applies processing to the images taken by the position recognition camera 3 and recognize therewith positions of position recognition marks 4 and 6 provided to points to be recognized and a control section that applies adjustment to respective positions of the screen 5 and the substrate 2 based on the positions recognized by the position recognition marks 4 and 6. And a position recognition mark S is provided furthermore to the stage part 1 of the aforementioned screen printing machine.
    • 40. 发明专利
    • ADHESIVE COATING DEVICE
    • JPH1133457A
    • 1999-02-09
    • JP19096397
    • 1997-07-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • KAKISHIMA NOBUYUKIWACHI AKIHIKONAKAHIRA HITOSHIKINOU TOSHIYUKI
    • B05C5/00H05K3/00
    • PROBLEM TO BE SOLVED: To correct the deviation of coating position corresponding to the eccentricity of a nozzle by respectively applying an adhesive with an adhesive coating nozzle rotated on a circuit board or a sacrificially applying tape, recognizing the coated adhesive by a camera and automatically measuring the eccentricity of the adhesive coating nozzle from the coating center point. SOLUTION: In the case of applying the adhesive 3 on the circuit board 9 by an adhesive coating device A, the circuit board 9 is transported by a board transporting means 7 and supported with a circuit board control part C. Next, the adhesive is respectively applied to the circuit board 9 or the sacrificially applying tape 6 with the nozzle rotated at 0, -90 deg. and +90, the adhesive is recognized by the camera 4 and the eccentricity of the nozzle 1 from the coated center point of the adhesive is automatically measured. The deviation of the coating position corresponding to the eccentricity of the nozzle is corrected to the designated coating position. After that, the nozzle 1 is positioned on the sacrificially applied tape and after the adhesive is sacrificially applied, is positioned at a coating position on the circuit board 9 and the adhesive 3 is applied to the circuit board 9.