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    • 32. 发明授权
    • Stereoscopic image displaying apparatus
    • 立体图像显示装置
    • US08441584B2
    • 2013-05-14
    • US12854344
    • 2010-08-11
    • Tsuyoshi OhyamaMasato ImaiTsutomu Tanaka
    • Tsuyoshi OhyamaMasato ImaiTsutomu Tanaka
    • G02F1/1343G02F1/1335G02B27/22
    • G02B27/2214G02F1/134309H04N13/315H04N13/317H04N13/356
    • A stereoscopic image displaying apparatus is provided. The stereoscopic image displaying apparatus, including: an image generation section having a plurality of pixels for a plurality of colors arranged in a two-dimensional matrix and adapted to drive the pixels for the colors to generate a color image; and a parallax applying section adapted to apply a parallax to the image to allow color display of a three-dimensional image and capable of changing over a parallax direction between a first direction of the color image and a second direction perpendicular to the first direction. The parallax applying section has a first parallel state and a second parallel state. The image generation section and the parallax application section are configured so that the rates of the colors at the pixels for the colors corresponding to light transmission regions between adjacent ones of the parallax barrier regions are uniform or got closer in both of the parallel states.
    • 提供立体图像显示装置。 所述立体图像显示装置包括:图像生成部,具有以二维矩阵排列的多种颜色的多个像素,适于驱动所述颜色的像素,生成彩色图像; 以及视差施加部,其适于对所述图像施加视差,以允许三维图像的彩色显示,并且能够在所述彩色图像的第一方向和垂直于所述第一方向的第二方向之间的视差方向上变化。 视差施加部具有第一平行状态和第二平行状态。 图像生成部和视差施加部被配置为使得与相邻的视差屏障区域中的光透射区域对应的颜色的像素的颜色的速率在两个并行状态下均匀或更接近。
    • 35. 发明授权
    • Liquid crystal display device
    • 液晶显示装置
    • US06721024B1
    • 2004-04-13
    • US09612389
    • 2000-07-07
    • Katsuhiko KishimotoToshihisa UchidaMasato Imai
    • Katsuhiko KishimotoToshihisa UchidaMasato Imai
    • G02F113
    • G02F1/133707G02F1/133753G02F1/1397G02F2001/133374G02F2001/133757
    • The liquid crystal display device of the present invention includes a first substrate, a second substrate, and a liquid crystal layer sandwiched by the first and second substrates. The first substrate includes polymer walls made of a transparent resin, the liquid crystal layer has a plurality of liquid crystal regions separated from one another by the polymer walls, and liquid crystal molecules in the plurality of liquid crystal regions are aligned axially symmetrically with respect to respective axes formed in the plurality of liquid crystal regions, the axes being vertical to a surface of the first substrate, and liquid crystal molecules above the polymer walls are aligned axially symmetrically with respect to respective axes formed on the polymer walls, the axes being vertical to the surface of the first substrate.
    • 本发明的液晶显示装置包括第一基板,第二基板以及被第一基板和第二基板夹持的液晶层。 第一基板包括由透明树脂制成的聚合物壁,液晶层具有通过聚合物壁彼此分离的多个液晶区域,并且多个液晶区域中的液晶分子相对于 形成在多个液晶区域中的各轴,该轴垂直于第一基板的表面,并且聚合物壁上方的液晶分子相对于形成在聚合物壁上的相应轴线轴对称地排列,轴是垂直的 到第一基板的表面。
    • 36. 发明授权
    • Method of manufacturing semiconductor wafer
    • 制造半导体晶片的方法
    • US06323140B1
    • 2001-11-27
    • US09646718
    • 2001-02-26
    • Masanori MayusumiMasato ImaiKazutoshi InoueShinji Nakahara
    • Masanori MayusumiMasato ImaiKazutoshi InoueShinji Nakahara
    • H01L2131
    • C30B29/06C30B25/02H01L21/02488H01L21/02532H01L21/0262Y10S438/906
    • Disclosed is a method for manufacturing a semiconductor wafer having an epitxial layer on a surface thereof, by the steps of forming a pritective oxide film on a surface of a semiconductor wafer prior to loading of the wafer into an eptaxial growth furnace, removing the protective oxide film formed on the surface of the wafer by heating after the wafer is loaded in the furnace, and performing epitaxial growth of the epitaxial layer on the surface from which the protective oxide film is removed in the furnace. The protective oxide film is removed by heating the wafer in the furnace in an ambience of hydrogen gas at a pressure ranging from 0.0133×105 Pa to 1.013×105 Pa and at a temperature ranging from 800° C. to 1,000 ° C., or by heating the wafer in the furnace at a pressure of 5×106 Pa or under and at a temperature ranging from 800° C. to 1,000° C.
    • 本发明公开了一种在其表面上具有外延层的半导体晶片的制造方法,其特征在于,在将晶片装入轴向生长炉之前,在半导体晶片的表面形成保护性氧化膜,除去保护氧化物 在晶片装载到炉中之后通过加热在晶片的表面上形成的膜,并且在炉中除去保护性氧化物膜的表面上进行外延层的外延生长。 通过在氢气气氛中在0.0133×10 5 Pa〜1.013×10 5 Pa的压力范围内,在800〜1000℃的温度范围内加热炉内的晶片,或者通过加热来除去保护性氧化膜 炉中的晶片在5×10 6 Pa的压力下或在800℃至1000℃的温度下。
    • 39. 发明授权
    • Method for producing single crystal
    • 单晶生产方法
    • US5488923A
    • 1996-02-06
    • US399558
    • 1995-03-07
    • Masato ImaiHiroyuki NodaYutaka ShiraishiKeishi NiikuraShoei Kurosaka
    • Masato ImaiHiroyuki NodaYutaka ShiraishiKeishi NiikuraShoei Kurosaka
    • C30B15/02C30B29/06H01L21/208C30B15/04
    • C30B15/02
    • The present invention employs the construction wherein a resistor heater is disposed inside a protective cylinder whose tip is open to a molten liquid packing zone of a crucible inside a pulling apparatus so that the resistor heater is above the tip of a lower portion and temperature setting can be made so as to be capable of fusing a starting material. Since the tip of the protective cylinder is positioned inside the molten liquid at the time of pulling of a single crystal, the gaseous phase portion inside the protective cylinder and the gaseous phase portion inside the pulling apparatus are separated apart by the molten liquid and are independent of each other and a starting material polycrystal rod loaded into the protective cylinder can be supplied to the molten liquid surface inside the crucible while being molten at the lower part of the protective cylinder by the resistor heater. In this manner, the single crystal whose impurity concentration is substantially uniform in the longitudinal direction can be grown continuously.
    • 本发明采用这样一种结构,其中电阻器加热器设置在保护筒内部,其顶端与拉制装置内的坩埚的熔融液体包装区域打开,使得电阻器加热器在下部的尖端上方,并且温度设定可以 使其能够熔化起始材料。 由于在拉制单晶时保护筒的尖端位于熔融液体内部,所以保护筒内部的气相部分和拉动装置内部的气相部分被熔融液体分开,并且是独立的 并且通过电阻加热器在保护筒的下部熔融时,可以将加载到保护筒中的原料多晶棒供给到坩埚内的熔融液面。 以这种方式,可以连续生长杂质浓度在纵向方向上基本均匀的单晶。
    • 40. 发明申请
    • Method for producing semiconductor substrate and semiconductor substrate
    • 半导体衬底和半导体衬底的制造方法
    • US20090170292A1
    • 2009-07-02
    • US11658949
    • 2005-07-27
    • Masato ImaiYoshiji Miyamura
    • Masato ImaiYoshiji Miyamura
    • H01L21/20
    • H01L21/26533H01L21/76243
    • A production method for a semiconductor substrate for producing a high quality SGOI substrate 10 in which the dislocation density in a silicon germanium Si1-yGey layer (SGOI layer) formed on an embedded oxide film is reduced and the occurrence of defects is suppressed, by employing the SIMOX method, or a semiconductor substrate. The SGOI substrate is produced by adjusting the composition ratio (x) of the germanium Ge in the silicon germanium Si1-xGex layer prior to the SIMOX method processing, to a composition ratio of a predetermined ratio or less in which the dislocation density in the silicon germanium Si1-yGey layer after the SIMOX method processing becomes a predetermined level or less. Preferably the composition ratio (x) is adjusted to a composition ratio in which the dislocation density in the silicon germanium Si1-yGey layer (SGOI layer) after the SIMOX method processing becomes 106 cm−2 or less. Also preferably, the composition ratio (x) of the germanium Ge in the silicon germanium Si1-xGex layer prior to the SIMOX method processing is set to 0.05 (5%) or less.
    • 一种用于制造高质量SGOI衬底10的半导体衬底的制造方法,其中通过使用在衬底氧化膜上形成的硅锗Si1-yGey层(SGOI层)中的位错密度降低并且缺陷的发生被抑制 SIMOX方法或半导体衬底。 通过将SIMOX法处理前的硅锗Si1-xGex层中的锗Ge的组成比(x)调整为硅中的位错密度的规定比例以下的组成比来制造SGOI基板 在SIMOX方法处理之后的锗Si1-yGey层变为预定水平或更低。 优选将组成比(x)调整为SIMOX法处理后的硅锗Si1-yGey层(SGOI层)中的位错密度为106cm -2以下的组成比。 还优选地,将SIMOX法处理之前的硅锗Si1-xGex层中的锗Ge的组成比(x)设定为0.05(5%)以下。