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31. 发明专利

DE69933619D1 未知
公开(公告)号：DE69933619D1
公开(公告)日：2006-11-30
申请号：DE69933619
申请日：1999-07-30
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01P1/04 , H01L23/66 , H05K1/02 , H05K1/14
摘要： There is described a high-frequency module comprising a high-frequency device-mounting package and an external circuit board characterized in that said high-frequency device-mounting package (A) includes a dielectric substrate (1) having a first grounding layer (4) contained therein, said dielectric substrate (1) mounting a high-frequency device (2) on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines (3) connected to said high-frequency device (2), and having, formed on the other surface thereof, second high-frequency signal transmission lines (7) coupled to said first high-frequency signal transmission lines (3), said external circuit board (B) is constituted by a dielectric board (20) having third high-frequency signal transmission lines (25) and a second grounding layer (26), said third high-frequency signal transmission lines (25) being formed on one surface of said dielectric board (20), and said second grounding layer (26) being formed on the other surface of said dielectric board (20) or inside thereof; and said high-frequency device-mounting package (A) and said external circuit board (B) are arranged side by side, and the second high-frequency signal transmission lines (7) of the high-frequency device-mounting package (A) are electrically connected to the third high-frequency signal transmission lines (25) of the external circuit board (B) through linear electrically conducting members (31). The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

32. 发明专利

DE69835633D1 未知
公开(公告)号：DE69835633D1
公开(公告)日：2006-10-05
申请号：DE69835633
申请日：1998-04-27
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , FUJII MIKIO , KITAZAWA KENJI
IPC分类号： H01P5/107 , H01L23/66
摘要： A high-frequency package comprising a dielectric substrate, a high-frequency element that operates in a high-frequency region and is mounted in a cavity formed on said dielectric substrate, and a microstrip line formed on the surface or in an inner portion of said dielectric substrate and electrically connected to said high-frequency element, wherein a signal transmission passage of a waveguide is connected to a linear conducting passage or to a ground layer constituting the microstrip line. In the junction portion of the waveguide, for example, an end of the linear conducting passage is electromagnetically opened, so that the end portion works as a monopole antenna inside the waveguide that is connected. The high-frequency package makes it possible to connect the waveguide without adversely affecting the sealing of the high-frequency element and to transmit high-frequency signals with a low loss.

33. 发明专利

DE10159685A1 未知
公开(公告)号：DE10159685A1
公开(公告)日：2002-05-29
申请号：DE10159685
申请日：2001-11-28
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI
IPC分类号： H01L23/12 , H01L23/14 , H01L23/66 , H01L25/04 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/02 , H05K3/42 , H05K3/40

34. 发明公开

EP2518820A4 LINE CONVERSION STRUCTURE AND ANTENNA USING SAME 审中-公开
标题翻译： LEAD转换结构和天线，以便
公开(公告)号：EP2518820A4
公开(公告)日：2014-08-27
申请号：EP10839294
申请日：2010-12-16
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI
IPC分类号： H01P5/10 , H01P5/107 , H01Q13/10
CPC分类号： H01P5/1007 , H01P5/107 , H01Q13/10

35. 发明专利

JP2013046291A Antenna substrate and antenna module 有权
标题翻译：天线基板和天线模块
公开(公告)号：JP2013046291A
公开(公告)日：2013-03-04
申请号：JP2011183807
申请日：2011-08-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01Q23/00 , H01L23/00 , H01L23/12 , H01Q21/08 , H05K9/00
CPC分类号： H01L2224/16225 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To increase the number of multiple mounting pads on a lower surface of a substrate to deal with the increase of the data amount while reducing the interference between a surface conductor layer for a chip and a surface conductor layer for an antenna.SOLUTION: An antenna substrate 1 includes: a dielectric layer 11 having an upper surface including a recessed part 12 where pads for chip mounting 19 are provided; surface conductor layers for an antenna 13 provided around the recessed part 12 of the dielectric layer 11; and mounting pads 14 provided on a lower surface of the dielectric layer 11. An antenna module includes the antenna substrate 1 and a chip 2 having connection pads 2a housed in the recessed part 12 of the antenna substrate 1.
摘要翻译：要解决的问题：为了增加衬底的下表面上的多个安装焊盘的数量以处理数据量的增加，同时减少用于芯片的表面导体层和表面导体层之间的干扰，天线。解决方案：天线基板1包括：电介质层11，其具有包括设置有用于芯片安装用焊盘19的凹部12的上表面; 设置在电介质层11的凹部12周围的用于天线13的表面导体层; 以及设置在电介质层11的下表面上的安装焊盘14.天线模块包括天线基板1和具有容纳在天线基板1的凹部12中的连接焊盘2a的芯片2.版权所有（C ）2013，JPO＆INPIT

36. 发明专利

JP2009159203A Antenna with dielectric lens 审中-公开
标题翻译：天线与电介质镜头
公开(公告)号：JP2009159203A
公开(公告)日：2009-07-16
申请号：JP2007333717
申请日：2007-12-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01Q15/08 , H01P5/107 , H01Q13/06 , H01Q19/06 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna with a dielectric lens, which facilitates an adjustment in directivity and is thinned, in an ultra high frequency antenna for millimeter wave radio communication or the like.
SOLUTION: The antenna with the dielectric lens comprises: a dielectric substrate 1 with a high frequency line 4 formed on its front side; a dielectric resonator 7 disposed on a rear side of the dielectric substrate 1 so as to be electromagnetically coupled with the high frequency line 4 via an exciting slot 5; and a dielectric lens 8 disposed on an output side of the dielectric resonator 7. The high frequency line 4 and the dielectric lens 8 are coupled via the dielectric resonator 7, so that the dielectric lens 8 is disposed in proximity to the dielectric substrate 1.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了在毫米波无线电通信的超高频天线等中提供具有电介质透镜的天线，其有助于方向性的调整和减薄。解决方案：具有介电透镜的天线包括：电介质基板1，其前侧形成有高频线4; 介质谐振器7，设置在电介质基板1的后侧，经由激励槽5与高频线路4电磁耦合; 以及布置在介质谐振器7的输出侧的电介质透镜8.高频线4和电介质透镜8通过介质谐振器7耦合，使得电介质透镜8设置在电介质基片1附近。版权所有（C）2009，JPO＆INPIT

37. 发明专利

JP2007266867A Waveguide converter 审中-公开
标题翻译：波形转换器
公开(公告)号：JP2007266867A
公开(公告)日：2007-10-11
申请号：JP2006087612
申请日：2006-03-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01P5/107
摘要： PROBLEM TO BE SOLVED: To provide a highly efficient waveguide converter having no radiation from a high-frequency line to an outer space. SOLUTION: The waveguide converter includes a high-frequency line consisting of a dielectric substrate having first and second surfaces, and consisting of a plurality of layers, a first ground layer formed on the first surface of the dielectric substrate or in the inside of the dielectric substrate, and a signal conductor formed on a layer between the first ground layer and the second surface of the dielectric substrate; a slot formed on the layer where the first ground layer is provided and electromagnetically coupled to the high-frequency line; and a shielding conductor formed in the inside of the dielectric substrate and surrounding a dielectric region between the slot and the second surface. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种没有从高频线到外部空间的辐射的高效波导转换器。解决方案：波导转换器包括由具有第一表面和第二表面的电介质基底构成的高频线，由多个层组成，第一接地层形成在电介质基底的第一表面上或内部以及形成在所述第一接地层和所述电介质基板的第二表面之间的层上的信号导体; 在所述层上形成的槽，其中所述第一接地层被提供并且电磁耦合到所述高频线; 以及形成在所述电介质基板的内部并且围绕所述狭槽和所述第二表面之间的电介质区域的屏蔽导体。版权所有（C）2008，JPO＆INPIT

38. 发明专利

JP2006041966A High frequency module 有权
标题翻译：高频模块
公开(公告)号：JP2006041966A
公开(公告)日：2006-02-09
申请号：JP2004219524
申请日：2004-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01Q23/00 , G01S7/03 , H01Q13/02 , H01Q13/06
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module for reducing antenna costs and costs for connecting with an antenna at the time of configuring a radar device or communication equipment in a high frequency module used for a radar or communication using a microwave or a milli-wave. SOLUTION: A high frequency module is provided with a high frequency wave line 2 formed on the upper face of a dielectric substrate 1, a frame-shaped connection electrode 4 formed at a site immediately under one end of the high frequency line 2 on the lower face of the dielectric substrate 1, a wiring board B having a waveguide path 7 in which the internal face of a through-hole 5 is formed of a conductor layer 6, and the upper end of the conductor layer 6 is electrically connected to a connection electrode 4 across a whole periphery and a converting part 3 for converting a transmission mode for transmitting the high frequency line 2 into a waveguide mode for transmitting the waveguide path 7. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种高频模块，用于在用于雷达或使用微波的通信的高频模块中配置雷达设备或通信设备时降低天线成本和与天线的连接成本或一波。解决方案：高频模块设置有形成在电介质基板1的上表面上的高频波形线2，形成在紧邻高频线2的一端的位置处的框状连接电极4 在电介质基板1的下表面上，具有波导路径7的布线基板B，其中通孔5的内表面由导体层6形成，并且导体层6的上端电连接连接到整个周边的连接电极4和用于将用于将高频线2传输的传输模式转换为用于传输波导路径7的波导模式的转换部分3（C）版权所有（C）2006，JPO＆NCIPI

39. 发明专利

JP2004153415A High frequency line-waveguide converter 审中-公开
标题翻译：高频线波形转换器
公开(公告)号：JP2004153415A
公开(公告)日：2004-05-27
申请号：JP2002314410
申请日：2002-10-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01P5/107
摘要： PROBLEM TO BE SOLVED: To provide a planar high frequency line-waveguide converter with a high conversion efficiency wherein reflection due to occurrence of an undesired mode hardly takes place.
SOLUTION: In the high frequency line-waveguide converter provided with: a high frequency line comprising a dielectric layer 2, a line conductor 3 located on the upper side of the dielectric layer, and a ground conductor layer 4 located on the same side to surround one end of the line conductor 3; a slot 5 formed to the ground conductor layer 4 in a way of almost being orthogonal to one end of the line conductor 3 and coupled with the line conductor 3; a shield conductor section 7 placed on a side face or inside of the dielectric layer 2 so as to surround the one end of the line conductor 3 and the slot 5; and a waveguide 6 placed to the lower side of the dielectric layer 2 while the opening of the waveguide 6 is opposed to the one end of the line conductor 3 and the slot 5 and electrically connected to the shield conductor section 7, an internal ground conductor layer 8 having an opening 9 for transmission is provided between the line conductor 3 and the waveguide 6.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种具有高转换效率的平面高频线路波导转换器，其中几乎不发生由于不期望的模式的发生而产生的反射。解决方案：在具有：包括电介质层2的高频线路，位于电介质层上侧的线路导体3和位于其上的接地导体层4的高频线路波导变换器中以围绕线路导体3的一端; 以与线路导体3的一端正交并与线路导体3连接的方式形成在接地导体层4上的槽5; 放置在电介质层2的侧面或内部以围绕线路导体3和槽5的一端的屏蔽导体部分7; 并且波导6放置在电介质层2的下侧，同时波导6的开口与线路导体3和槽5的一端相对并且电连接到屏蔽导体部分7，内部接地导体具有用于透射的开口9的层8设置在线路导体3和波导6之间。版权所有（C）2004，JPO

40. 发明专利

JP2004039739A High-frequency wiring board 审中-公开
公开(公告)号：JP2004039739A
公开(公告)日：2004-02-05
申请号：JP2002192235
申请日：2002-07-01
申请人： Kyocera Corp , 京セラ株式会社
发明人： KORIYAMA SHINICHI
IPC分类号： H01L23/12 , H01P1/00
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring board containing an unnecessary high-frequency absorbing function that can prevent the leakage of unnecessary high-frequency signals from a power supply line even when the function does not use any expensive single-plate capacitor element. SOLUTION: In this high-frequency wiring board, a high-frequency component mounting section, a transmission circuit for high frequency connected to the high-frequency terminal of a high-frequency component 7, and a power source circuit connected to the power supply terminal of the component 7, are formed on the surface of a dielectric substrate 4. Since a power supply line 11e or via hole conductor 20 in the power source circuit is formed of a highly magnetically permeable low-resistant material containing at least one kind of metal selected from among Fe, Co, and Ni having relative permeability of ≥80 and electric resistivity of ≤1.0 (μΩm), this wiring board can absorb the unnecessary high-frequency signals. COPYRIGHT: (C)2004,JPO

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