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31. 发明授权

US08486613B2 Method of manufacturing nano-structure and method of manufacturing a pattern using the method 有权
标题翻译：使用该方法制造纳米结构的方法和制造图案的方法
公开(公告)号：US08486613B2
公开(公告)日：2013-07-16
申请号：US12636202
申请日：2009-12-11
申请人： Sang-Ouk Kim , Seong-Jun Jeong , Su-Mi Lee , Bong-Hoon Kim , Ji-Eun Kim , Jae-Ho You , Moon-Gyu Lee , Seung-Ho Nam
发明人： Sang-Ouk Kim , Seong-Jun Jeong , Su-Mi Lee , Bong-Hoon Kim , Ji-Eun Kim , Jae-Ho You , Moon-Gyu Lee , Seung-Ho Nam
IPC分类号： G03F7/26
CPC分类号： B81C1/00031 , B81C2201/0149
摘要： According to an example embodiment of the present invention, a photoresist pattern is formed on a base substrate including a neutral layer. A sacrifice structure including a first sacrifice block and a second sacrifice block is formed on the base substrate having the photoresist pattern, and the sacrifice structure is formed from a first thin film including a first block copolymer. Thus, a chemical pattern is formed to form a nano-structure. Therefore, the nano-structure may be easily formed on a substrate having a large size by using a block copolymer, and productivity and manufacturing reliability may be improved.
摘要翻译：根据本发明的示例性实施例，在包括中性层的基底基板上形成光致抗蚀剂图案。在具有光致抗蚀剂图案的基底上形成包括第一牺牲块和第二牺牲块的牺牲结构，牺牲结构由包括第一嵌段共聚物的第一薄膜形成。因此，形成化学图案以形成纳米结构。因此，可以通过使用嵌段共聚物容易地在具有大尺寸的基板上形成纳米结构，并且可以提高生产率和制造可靠性。

32. 发明授权

US08124880B2 Circuit board and method for manufacturing thereof 有权
标题翻译：电路板及其制造方法
公开(公告)号：US08124880B2
公开(公告)日：2012-02-28
申请号：US11976207
申请日：2007-10-22
申请人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
发明人： Shuhichi Okabe , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
IPC分类号： H05K1/03
CPC分类号： H05K1/0265 , H05K1/116 , H05K3/107 , H05K3/108 , H05K3/205 , H05K3/421 , H05K2201/0379 , H05K2201/0394 , H05K2201/09509 , H05K2201/09736 , H05K2203/0361
摘要： A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stacked on a carrier; stacking and pressing together the carrier and an insulator, such that a surface of the carrier having the conductive relievo pattern faces the insulator; transcribing the conductive relievo pattern into the insulator by removing the carrier; forming a conduction pattern, including a third plating layer and a second metal layer stacked sequentially in correspondence with a second circuit pattern, on the surface of the insulator having the conductive relievo pattern transcribed; removing the first plating layer and seed layer; and removing the first and second metal layers, can provide a circuit board that has high-density circuit patterns without an increased amount of insulator.
摘要翻译：一种电路板的制造方法，其特征在于，包括：在堆叠在载体上的种子层上，形成导电消除图案，所述导电解像图案包括依次与第一电路图案对应地层叠的第一镀层，第一金属层和第二镀层 ; 将载体和绝缘体堆叠并压在一起，使得具有导电缓冲图案的载体的表面面向绝缘体; 通过移除载体将导电释放图案转印到绝缘体中; 在具有转印的导电消除图案的绝缘体的表面上形成包括与第二电路图案顺序堆叠的第三镀层和第二金属层的导电图案; 去除第一镀层和籽晶层; 并且去除第一和第二金属层可以提供具有高密度电路图案而不增加绝缘体量的电路板。

33. 发明申请

US20110221074A1 Board on chip package 审中-公开
标题翻译：板上封装
公开(公告)号：US20110221074A1
公开(公告)日：2011-09-15
申请号：US13067219
申请日：2011-05-17
申请人： Myung-Sam Kang , Chang-Sup Ryu , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
发明人： Myung-Sam Kang , Chang-Sup Ryu , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
IPC分类号： H01L23/488
CPC分类号： H01L23/3128 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/81801 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/30105 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A board on chip package including a photo solder resist having a cavity and a pattern on one side, the pattern corresponding to a circuit wire; a solder ball pad accommodated in the cavity; a circuit wire electrically connected with the solder ball pad, and formed on the other side of the photo solder resist; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material to mold the semiconductor chip.
摘要翻译：一种片上封装，包括具有空腔和一侧图案的光阻焊剂，该图案对应于电路线; 容纳在腔中的焊球垫; 与焊锡球焊盘电连接并形成在光阻焊剂的另一侧上的电路线; 通过倒装芯片焊接安装在焊球垫上的半导体芯片; 以及用于模制半导体芯片的钝化材料。

34. 发明申请

US20110168992A1 NOVEL COMPOUND, METHOD FOR PREPARING SAME AND ORGANIC ELECTRONIC DEVICE USING SAME 有权
标题翻译：新型化合物，其制备方法和使用其的有机电子器件
公开(公告)号：US20110168992A1
公开(公告)日：2011-07-14
申请号：US13120380
申请日：2009-09-23
申请人： Jae-Soon Bae , Ji-Eun Kim , Jeung-Gon Kim , Jun-Gi Jang
发明人： Jae-Soon Bae , Ji-Eun Kim , Jeung-Gon Kim , Jun-Gi Jang
IPC分类号： H01L51/54 , C07D333/50 , C07D409/10 , C07D307/92
CPC分类号： C07D333/74 , C07D209/86 , C07D263/57 , C07D307/92 , C07D333/36 , C07D403/04 , C07D405/10 , C07D409/10 , H01L51/0061 , H01L51/0073 , H01L51/0074 , H01L51/008 , H01L51/5012 , H01L51/5048 , H01L2251/308 , Y02E10/549
摘要： The present invention relates to a novel compound, a method for manufacturing the same, and an organic electronic device using the same, and the novel compound according to the present invention may act as a hole injection, hole transport, electron injection and transport, or light emitting material in an organic light emitting device and an organic electronic device, and the device according to the present invention shows excellent properties in terms of efficiency, a driving voltage, and stability.
摘要翻译：本发明涉及一种新型化合物及其制造方法和使用该化合物的有机电子器件，本发明的新化合物可以用作空穴注入，空穴传输，电子注入和输送，或有机发光器件中的发光材料和有机电子器件，根据本发明的器件在效率，驱动电压和稳定性方面显示出优异的性能。

35. 发明申请

US20110057208A1 LIGHT EMITTING DISPLAY DEVICE 有权
标题翻译：发光显示装置
公开(公告)号：US20110057208A1
公开(公告)日：2011-03-10
申请号：US12699468
申请日：2010-02-03
申请人： HEE-CHUL JEON , Ji-Eun Kim , Jung-I Yun , Sang-Min Hong
发明人： HEE-CHUL JEON , Ji-Eun Kim , Jung-I Yun , Sang-Min Hong
IPC分类号： H01L33/08
CPC分类号： H01L51/5246 , H01L27/3244
摘要： Provided is an organic light emitting display device sealed maintaining durability by preventing permeation of oxygen and moisture and improving impact resistance. The light emitting display device includes a first substrate; a second substrate disposed facing toward the first substrate; an emission unit disposed between the first substrate and the second substrate and comprising a plurality of light emitting devices; a first sealant disposed between the first substrate and the second substrate, and surrounding the emission unit and combining the first substrate and the second substrate; a first region formed between around a flat portion of the first sealant and a margin of the second substrate; a second region formed between around a corner of the first sealant and a margin of the second substrate; a second sealant disposed in the first region; and a third sealant disposed in the second region.
摘要翻译：提供一种有机发光显示装置，其通过防止氧气和水分的渗透并改善耐冲击性而保持耐久性。发光显示装置包括：第一基板; 面向第一基板的第二基板; 发射单元，设置在所述第一基板和所述第二基板之间，并且包括多个发光装置; 第一密封剂，其设置在所述第一基板和所述第二基板之间，并且包围所述发光单元并且组合所述第一基板和所述第二基板; 形成在所述第一密封剂的平坦部分和所述第二基板的边缘之间的第一区域; 形成在所述第一密封剂的角部和所述第二基板的边缘之间的第二区域; 设置在所述第一区域中的第二密封剂; 以及设置在所述第二区域中的第三密封剂。

36. 发明授权

US07664131B2 Channel resource assignment method for fair channel resource reservation and QoS in mesh WPAN 失效
标题翻译：用于公平信道资源预留的信道资源分配方法和网络WPAN中的QoS
公开(公告)号：US07664131B2
公开(公告)日：2010-02-16
申请号：US11511051
申请日：2006-08-28
申请人： Young-Ae Chun , Ji-Eun Kim , Sang-Jae Lee , Sang-Sung Choi , Kwang-Roh Park , Byung-Joo Lee , Seung-Hyong Rhee
发明人： Young-Ae Chun , Ji-Eun Kim , Sang-Jae Lee , Sang-Sung Choi , Kwang-Roh Park , Byung-Joo Lee , Seung-Hyong Rhee
IPC分类号： H04B7/212
CPC分类号： H04W72/04 , H04W28/26 , H04W48/12 , H04W74/08 , H04W84/10
摘要： Provided is a channel resource assignment method for fair channel resource reservation in a mesh WPAN, in which the amount of channel resources is fairly reserved when devices share the channel resources. The channel resource assignment method in a mesh Wireless Personal Area Network (WPAN) includes the steps of: (a) transmitting beacons of all devices and adding an amount of channel resource to be reserved to the beacons so as to assign the channel resource for fair channel resource reservation between corresponding devices and adjacent devices when a mesh network is configured; (b) accumulating the amount of the channel resources reserved by all the adjacent devices except the corresponding device; and (c) determining the amount of the channel resources to be reserved.
摘要翻译：提供了一种用于网格WPAN中的公平信道资源预留的信道资源分配方法，其中当设备共享信道资源时，信道资源量被相当保留。网状无线个人区域网络（WPAN）中的信道资源分配方法包括以下步骤：（a）发送所有设备的信标，并向信标添加一定量的信道资源以便为信标分配信道资源当配置网状网络时，相应设备和相邻设备之间的信道资源预留; （b）累积除相应设备之外的所有相邻设备预留的信道资源量; 和（c）确定要保留的信道资源的数量。

37. 发明申请

US20090026080A1 APPARATUS AND METHOD FOR SEPARATING PARTICLES 审中-公开
标题翻译：分离颗粒的装置和方法
公开(公告)号：US20090026080A1
公开(公告)日：2009-01-29
申请号：US12279093
申请日：2007-02-16
申请人： Chang-Soo Han , Ji-Eun Kim
发明人： Chang-Soo Han , Ji-Eun Kim
IPC分类号： B01D57/02 , B03C5/02
CPC分类号： B03C5/026 , B03C5/005
摘要： A particle separator for separating different types of particles with different properties includes a channel unit including a flow channel through which a first fluid having particles with at least one physical characteristic and a second fluid that flows near the first fluid, and a plurality of outflow channels that are connected to the flow channel and that separate the fluid having passed the flow channel; and a field forming unit, installed adjacent to the flow channel, for separating the particles included in the first fluid from the first fluid and generating a non-uniform field so that the particles may flow together with the second fluid.
摘要翻译：用于分离具有不同性质的不同类型的颗粒的颗粒分离器包括通道单元，该通道单元包括流动通道，具有至少一种物理特性的颗粒的第一流体和流过第一流体附近的第二流体的流路，以及多个流出通道其连接到流动通道并且分离通过流动通道的流体; 以及与所述流动通道相邻设置的用于将包含在第一流体中的颗粒与第一流体分离并产生不均匀场的场形成单元，使得颗粒可与第二流体一起流动。

38. 发明申请

US20080098597A1 Method of manufacturing circuit board 有权
标题翻译：电路板制造方法
公开(公告)号：US20080098597A1
公开(公告)日：2008-05-01
申请号：US11976072
申请日：2007-10-19
申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
发明人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
IPC分类号： H05K3/02
CPC分类号： H05K3/20 , H05K3/0058 , H05K3/108 , H05K3/4611 , H05K3/4682 , H05K2201/0394 , H05K2201/09481 , H05K2201/09518 , H05K2201/09563 , H05K2203/0152 , H05K2203/0376 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.
摘要翻译：公开了一种制造电路板的方法。一种制造电路板的方法，包括在载体的绝缘层上形成第一电路图案，其中绝缘层和第一种子层依次层叠; 堆叠并按压载体和绝缘板，其中载体侧具有面向绝缘板的第一电路图案; 移除载体以将第一电路图案和绝缘层转移到绝缘板上; 并且在转移到绝缘板的绝缘层上形成第二电路图案，允许精细的间距电路图案能够在板上制造高密度的精细电路图案，并且允许制造具有简单的多层电路板处理。

39. 发明申请

US20080098596A1 Method for forming transcriptional circuit and method for manufacturing circuit board 失效
标题翻译：转录电路形成方法及电路板制造方法
公开(公告)号：US20080098596A1
公开(公告)日：2008-05-01
申请号：US11976071
申请日：2007-10-19
申请人： Sang-Duck Kim , Jung-Hyun Park , Hoe-Ku Jung , Jong-Gyu Choi , Ji-Eun Kim , Jeong-Woo Park
发明人： Sang-Duck Kim , Jung-Hyun Park , Hoe-Ku Jung , Jong-Gyu Choi , Ji-Eun Kim , Jeong-Woo Park
IPC分类号： H05K3/20
CPC分类号： H05K3/20 , H05K3/205 , H05K3/207 , H05K3/386 , H05K2203/0113 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/49163
摘要： A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.
摘要翻译：公开了一种形成转录电路的方法及其制造方法。一种形成转录电路的方法，其包括通过在模板上选择性地形成抗蚀剂来形成对应于电路图案的凹版图案，将导电材料填充到凹版图案中，以及通过将载体压载到载体上而将载体转移到使得载体面向具有填充有导电材料的模板的表面的模板，使得可以形成可以使用现有设备转录成绝缘板的转录电路，由此可以降低成本。

40. 发明授权

US08773371B2 Flat panel display with a touch screen panel 有权
标题翻译：带触摸屏面板的平板显示器
公开(公告)号：US08773371B2
公开(公告)日：2014-07-08
申请号：US12882528
申请日：2010-09-15
申请人： Hee-Chul Jeon , Ji-Eun Kim , Sung-Joo Hwang , Se-Il Cho , Won-Mi Hwang
发明人： Hee-Chul Jeon , Ji-Eun Kim , Sung-Joo Hwang , Se-Il Cho , Won-Mi Hwang
IPC分类号： G06F3/041 , G09G5/10
CPC分类号： G06F3/044 , G02F1/13338 , G06F2203/04111
摘要： A flat panel display integrated with a touch screen panel. The connecting patterns, which connect adjacent first sensing cells and adjacent second sensing cells are formed on the same level of the lower surface of the upper substrate of the flat panel display of the same material as metal patterns formed around the edge of the touch screen panel, and by arranging the connecting patterns not to cross each other. The flat panel display panel can also be integrated with a touch screen having improved visibility by forming the touch screen panel on the upper substrate of the flat panel display such that connecting patterns are formed in the regions between the pixels.
摘要翻译：与触摸屏面板集成的平板显示器。连接相邻的第一感测单元和相邻的第二感测单元的连接图案形成在与触摸屏面板的边缘周围形成的金属图案相同材料的平板显示器的上基板的下表面的相同水平面上并且通过布置连接图案不互相交叉。平板显示面板还可以通过在平板显示器的上基板上形成触摸屏面板而使得在像素之间的区域中形成连接图案的具有改善的可视性的触摸屏。

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