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    • 31. 发明申请
    • Immersion lithography contamination gettering layer
    • 浸没光刻污染吸气层
    • US20060275706A1
    • 2006-12-07
    • US11144857
    • 2005-06-03
    • Daniel CorlissDario GilDario GoldfarbSteven HolmesDavid HorakKurt KimmelKaren PetrilloDmitriy Shneyder
    • Daniel CorlissDario GilDario GoldfarbSteven HolmesDavid HorakKurt KimmelKaren PetrilloDmitriy Shneyder
    • G03F7/20
    • G03F7/2041G03F7/11Y10S430/162
    • A method of forming an image in a photoresist layer. The method includes, providing a substrate; forming the photoresist layer over the substrate; forming a contamination gettering topcoat layer over the photoresist layer, the contamination gettering topcoat layer including one or more polymers and one or more cation complexing agents; exposing the photoresist layer to actinic radiation through a photomask having opaque and clear regions, the opaque regions blocking the actinic radiation and the clear regions being transparent to the actinic radiation, the actinic radiation changing the chemical composition of regions of the photoresist layer exposed to the radiation forming exposed and unexposed regions in the photoresist layer; and removing either the exposed regions of the photoresist layer or the unexposed regions of the photoresist layer. The contamination gettering topcoat layer includes one or more polymers, one or more cation complexing agents and a casting solvent.
    • 在光致抗蚀剂层中形成图像的方法。 该方法包括提供基板; 在衬底上形成光致抗蚀剂层; 在光致抗蚀剂层上形成污染吸气顶涂层,吸收顶涂层的污染物包括一种或多种聚合物和一种或多种阳离子络合剂; 将光致抗蚀剂层暴露于通过具有不透明和透明区域的光掩模的光化辐射,不透明区域阻挡光化辐射,透明区域对于光化辐射是透明的,光化辐射改变曝光于光致抗蚀剂层的光致抗蚀剂层的区域的化学组成 在光致抗蚀剂层中形成曝光和未曝光区域的辐射; 以及去除光致抗蚀剂层的曝光区域或光致抗蚀剂层的未曝光区域。 污染吸附顶涂层包括一种或多种聚合物,一种或多种阳离子络合剂和流延溶剂。
    • 32. 发明申请
    • AUTOMATED SUB-FIELD BLADING FOR LEVELING OPTIMIZATION IN LITHOGRAPHY EXPOSURE TOOL
    • 自动化的子场开采用于平面曝光工具中的优化优化
    • US20060160037A1
    • 2006-07-20
    • US10905706
    • 2005-01-18
    • Colin BrodskyScott BukofskySteven Holmes
    • Colin BrodskyScott BukofskySteven Holmes
    • G03F7/20
    • G03F7/70466
    • A method of exposing images on a wafer having varying topography during lithographic production of microelectronic devices. The method initially includes determining topography of a wafer, dividing the wafer into two or more separate regions based on the wafer topography, and determining desired focus distance for exposing a desired image on each of the separate regions of the wafer. The method then includes exposing a desired image on one of the regions of the wafer at the desired focus distance while blocking remaining regions and exposing a desired image on another of the regions of the wafer at the desired focus distance while blocking remaining regions. The desired focus distance may be different for each of the separate wafer regions.
    • 一种在微电子器件的光刻生产期间在具有变化的形貌的晶片上曝光图像的方法。 该方法最初包括确定晶片的形貌,基于晶片形貌将晶片分成两个或更多个分离的区域,以及确定用于在晶片的每个分离区域上曝光所需图像的期望焦距。 该方法然后包括以期望的聚焦距离在晶片的一个区域上曝光期望的图像,同时阻挡剩余的区域并且以期望的焦距在所需的聚焦距离的另一个区域上曝光期望的图像,同时阻挡剩余的区域。 对于每个单独的晶片区域,期望的对焦距离可以是不同的。