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31. 发明授权

US06509604B1 Nitridation barriers for nitridated tunnel oxide for circuitry for flash technology and for LOCOS/STI isolation 失效
标题翻译：用于闪存技术和LOCOS / STI隔离电路的氮化隧道氧化物的氮化屏障
公开(公告)号：US06509604B1
公开(公告)日：2003-01-21
申请号：US09491457
申请日：2000-01-26
申请人： Tuan Duc Pham , Mark T. Ramsbey , Yu Sun , Chi Chang
发明人： Tuan Duc Pham , Mark T. Ramsbey , Yu Sun , Chi Chang
IPC分类号： H01L29788
CPC分类号： H01L21/76202 , H01L21/76224 , H01L27/1052 , Y10S438/981
摘要： A semiconductor chip having a plurality of flash memory devices, shallow trench isolation in the periphery region, and LOCOS isolation in the core region. A hard mask is used first to create the shallow trench isolation. The LOCOS isolation is then created. Subsequent etching is used to remove stringers. The flash memory is able to use shallow trench isolation to limit encroachment. The flash memory may also have a nitridated tunnel oxide barrier layer. A hard mask is used to prevent nitride contamination of the gate oxide layer.
摘要翻译：具有多个闪速存储器件的半导体芯片，周边区域中的浅沟槽隔离以及芯区域中的LOCOS隔离。首先使用硬掩模来创建浅沟槽隔离。然后创建LOCOS隔离。随后的蚀刻用于去除桁条。闪存能够使用浅沟槽隔离来限制侵占。闪存也可以具有氮化的隧道氧化物阻挡层。使用硬掩模来防止栅极氧化物层的氮化物污染。

32. 发明授权

US5981364A Method of forming a silicon gate to produce silicon devices with improved performance 失效
标题翻译：形成硅栅极以产生具有改进性能的硅器件的方法
公开(公告)号：US5981364A
公开(公告)日：1999-11-09
申请号：US568195
申请日：1995-12-06
申请人： Mark T. Ramsbey , Hsingya Arthur Wang , Yu Sun
发明人： Mark T. Ramsbey , Hsingya Arthur Wang , Yu Sun
IPC分类号： H01L21/28 , H01L29/49
CPC分类号： H01L21/28035 , H01L29/4925
摘要： Disclosed herein is a method of forming a silicon gate stack onto a silicon substrate for a silicon device. The method of forming the silicon gate stack comprises the steps of growing an oxide layer onto the silicon substrate, depositing a thin layer of silicon to form a thin layer of silicon over the oxide layer, depositing a thick layer of silicon over the thin layer of silicon, and introducing impurities into only the thick layer of silicon to form a silicon gate whereby the silicon gate includes the thin layer of silicon and the thick layer of silicon having the impurities. The impurities being introduced with a concentration, the impurities concentration and the thick layer thickness impeding an encroachment by the oxide layer into the silicon gate during application of a protective screen oxide layer around the silicon gate stack.
摘要翻译：本文公开了一种在硅器件的硅衬底上形成硅栅叠层的方法。形成硅栅极堆叠的方法包括以下步骤：在硅衬底上生长氧化物层，沉积薄层的硅以在氧化物层上形成薄的硅层，在薄层上沉积厚的硅层硅，并且将杂质引入仅硅的厚层中以形成硅栅极，由此硅栅极包括硅的薄层和具有杂质的厚的硅层。引入浓度的杂质，杂质浓度和厚层厚度在施加硅栅堆叠周围的保护性屏蔽氧化物层时阻碍氧化层侵入硅栅中。

33. 发明授权

US06566194B1 Salicided gate for virtual ground arrays 有权
标题翻译：用于虚拟地面阵列的闸门
公开(公告)号：US06566194B1
公开(公告)日：2003-05-20
申请号：US09968465
申请日：2001-10-01
申请人： Mark T. Ramsbey , Yu Sun , Chi Chang
发明人： Mark T. Ramsbey , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/1052 , H01L27/115 , H01L27/11531
摘要： The present invention provides processes for doping and saliciding word lines in a virtual ground array flash memory device without causing shorting between bit lines. According to one aspect of the invention, word lines are doped prior to patterning the poly layer from which the word lines are formed in the core region. Thereby, the poly layer protects the substrate between the word lines from doping that could cause shorting between bit lines. According to another aspect of the invention, word lines are exposed while spacer material, dielectric, or like material protects the substrate between word lines. The spacer material or dielectric prevents the substrate from becoming salicided in a manner that, like doping, could cause shorting between bit lines. The invention provides virtual ground array flash memory devices with doped and salicided word lines, but no shorting between bit lines even in virtual ground arrays where there are no oxide island isolation regions between bit lines.
摘要翻译：本发明提供了在虚拟接地阵列闪速存储器件中掺杂和打字字线的方法，而不引起位线之间的短路。根据本发明的一个方面，在对在芯区域内形成字线的多层图案进行图案化之前，对字线进行掺杂。因此，多层保护字线之间的衬底免受可能导致位线之间短路的掺杂。根据本发明的另一方面，字线被暴露，而隔离材料，电介质或类似材料在字线之间保护衬底。间隔物材料或电介质防止衬底以像掺杂那样在位线之间引起短路的方式变为水溶液。本发明提供了具有掺杂和含水字线的虚拟接地阵列闪存器件，但即使在位线之间不存在氧化物岛隔离区域的虚拟接地阵列中也不会在位线之间发生短路。

34. 发明授权

US06399984B1 Species implantation for minimizing interface defect density in flash memory devices 有权
标题翻译：用于最小化闪存器件中的界面缺陷密度的物种植入
公开(公告)号：US06399984B1
公开(公告)日：2002-06-04
申请号：US09882242
申请日：2001-06-15
申请人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
发明人： Yider Wu , Mark T. Ramsbey , Chi Chang , Yu Sun , Tuan Duc Pham , Jean Y. Yang
IPC分类号： H01L29788
CPC分类号： H01L27/11568 , H01L27/115
摘要： A predetermined species such as nitrogen is placed at an interface between a bit line junction and a dielectric layer of a control dielectric structure of a flash memory device to minimize degradation of such an interface by minimizing formation of interface defects during program or erase operations of the flash memory device. The predetermined species such as nitrogen is implanted into a bit line junction of the flash memory device. A thermal process is performed that heats up the semiconductor wafer such that the predetermined species such as nitrogen implanted within the semiconductor wafer thermally drifts to the interface between the bit line junction and the control dielectric structure during the thermal process. The predetermined species such as nitrogen at the interface minimizes formation of interface defects and thus degradation of the interface with time during the program or erase operations of the flash memory device.
摘要翻译：将诸如氮的预定物质放置在闪存存储器件的控制电介质结构的位线结和电介质层之间的界面处，以通过在编程或擦除操作期间最小化界面缺陷的形成来最小化这种界面的劣化闪存设备。将诸如氮的预定物质注入到闪速存储器件的位线结中。执行加热半导体晶片的热处理，使得在热处理期间注入到半导体晶片内的预定物质例如氮漂移到位线结和控制电介质结构之间的界面。在闪存器件的编程或擦除操作期间，预定种类例如接口处的氮使界面缺陷的形成最小化，从而使界面的时效性降低。

35. 发明授权

US06133619A Reduction of silicon oxynitride film delamination in integrated circuit inter-level dielectrics 有权
标题翻译：集成电路级间介质中氮氧化硅薄膜的分层还原
公开(公告)号：US06133619A
公开(公告)日：2000-10-17
申请号：US144521
申请日：1998-08-31
申请人： Kashmir Sahota , Richard J. Huang , David Matsumoto , Mark T. Ramsbey , Yu Sun , Judith Quan Rizzuto
发明人： Kashmir Sahota , Richard J. Huang , David Matsumoto , Mark T. Ramsbey , Yu Sun , Judith Quan Rizzuto
IPC分类号： H01L21/312 , H01L21/314 , H01L21/768 , H01L51/00
CPC分类号： H01L21/76801 , H01L21/76819 , H01L21/76831 , H01L21/76834 , H01L21/3124 , H01L21/3145
摘要： Outgassing from a dielectric gap fill layer, e.g., a low dielectric constant material such as HSQ, and attendant deformation or delamination of a barrier dielectric layer on an overlying patterned conductive layer during subsequent thermal processing are avoided or significantly reduced by controlling the thickness of the dielectric cap layer on the dielectric gap fill layer. Embodiments include depositing a conformal SiON barrier on a first conductive pattern, depositing a HSQ gap fill layer on the conformal SiON barrier layer, depositing a silicon oxide cap layer and planarizing such that the thickness of the planarized silicon cap layer is at least 2500 .ANG., thereby avoiding deformation and/or delamination of a conformal SiON barrier layer on an overlying patterned conductive layer during subsequent thermal processing.
摘要翻译：从介电间隙填充层，例如低介电常数材料（例如HSQ）以及随后的热处理过程中覆盖的图案化导电层上的阻挡介电层的伴随变形或分层的脱气被避免或显着减少，通过控制电介质间隙填充层上的介电覆盖层。实施例包括在第一导电图案上沉积保形SiON阻挡层，在保形SiON阻挡层上沉积HSQ间隙填充层，沉积氧化硅覆盖层并进行平坦化，使得平坦化硅覆盖层的厚度为至少2500，从而避免在随后的热处理期间覆盖的图案化导电层上的保形SiON阻挡层的变形和/或分层。

36. 发明授权

US06232646B1 Shallow trench isolation filled with thermal oxide 失效
标题翻译：浅沟隔离填充热氧化物
公开(公告)号：US06232646B1
公开(公告)日：2001-05-15
申请号：US09082607
申请日：1998-05-20
申请人： Yu Sun , Angela T. Hui , Yue-Song He , Tatsuya Kajita , Mark Chang , Chi Chang , Hung-Sheng Chen
发明人： Yu Sun , Angela T. Hui , Yue-Song He , Tatsuya Kajita , Mark Chang , Chi Chang , Hung-Sheng Chen
IPC分类号： H01L2900
CPC分类号： H01L21/7621 , H01L21/76232
摘要： A semiconductor apparatus and method for producing shallow trench isolation. The method includes the steps providing a semiconductor substrate member fabricated having a thin barrier oxide layer on which are fabricated a plurality of spaced apart silicon nitride pads. The regions between the spaced apart nitride pads delineate U-shaped regions for forming shallow isolation trenches and are layered with silicon oxide and polysilicon. The U-shaped regions provide a buffer region of oxide and polysilicon material adjacent opposing silicon nitride pads that prevent erosion of the nitride during etch formation of the isolation trench. The polysilicon is further etched to form a wider, second U-shaped region having sloped sidewalls that provide opposing spacer-forming buffer material that facilitates forming a V-shaped isolation trench region into the semiconductor substrate member a predetermined depth without eroding the silicon nitride pads. The V-shaped trench is subsequently filled with silicon dioxide that is grown by a hot thermal oxide process. The upper portion of the V-shaped isolation trench may be further filled with deposited silicon dioxide followed by a chemical mechanical polishing process.
摘要翻译：一种用于产生浅沟槽隔离的半导体装置和方法。该方法包括提供制造具有薄的阻挡氧化物层的半导体衬底构件的步骤，在其上制造多个间隔开的氮化硅衬垫。间隔开的氮化物衬垫之间的区域划定用于形成浅隔离沟槽的U形区域并且与氧化硅和多晶硅层叠。 U形区域提供邻近相对的氮化硅焊盘的氧化物和多晶硅材料的缓冲区，其在隔离沟槽的蚀刻形成期间防止氮化物的侵蚀。多晶硅被进一步蚀刻以形成更宽的第二U形区域，其具有倾斜的侧壁，其提供相对的间隔物形成缓冲材料，其有利于在不侵蚀氮化硅焊盘的情况下在半导体衬底构件中形成预定深度的V形隔离沟槽区域。随后，V形沟槽填充二氧化硅，二氧化硅通过热的热氧化工艺生长。 V形隔离沟槽的上部可以进一步填充沉积的二氧化硅，随后进行化学机械抛光工艺。

37. 发明授权

US06583009B1 Innovative narrow gate formation for floating gate flash technology 有权
标题翻译：用于浮栅闪存技术的创新窄门形成
公开(公告)号：US06583009B1
公开(公告)日：2003-06-24
申请号：US10178106
申请日：2002-06-24
申请人： Angela T. Hui , Kelwin Ko , Hiroyuki Kinoshita , Sameer Haddad , Yu Sun
发明人： Angela T. Hui , Kelwin Ko , Hiroyuki Kinoshita , Sameer Haddad , Yu Sun
IPC分类号： H01L218247
CPC分类号： H01L27/11521 , H01L27/115 , Y10S438/952
摘要： The present invention relates to a method of forming a stacked gate flash memory cell and comprises forming a tunnel oxide layer, a first conductive layer, an interpoly dielectric layer, and a second conductive layer in succession over a semiconductor substrate. The method further comprises forming a sacrificial layer over the second conductive layer, and patterning the sacrificial layer to form a sacrificial layer feature having at least one lateral sidewall edge associated therewith. A sidewall spacer is then formed against the lateral sidewall edge of the sacrificial layer, wherein the spacer has a width associated therewith, and the patterned sacrificial layer feature is removed. Finally, the second conductive layer, the interpoly dielectric and the first conductive layer are patterned using the spacer as a hard mask, and defining the stacked gate, wherein a width of the stacked gate is a function of the spacer width.
摘要翻译：本发明涉及一种形成层叠栅极闪存单元的方法，包括在半导体衬底上连续形成隧道氧化物层，第一导电层，多晶硅间介质层和第二导电层。该方法还包括在第二导电层上形成牺牲层，以及图案化牺牲层以形成具有与其相关联的至少一个侧向侧壁边缘的牺牲层特征。然后在牺牲层的横向侧壁边缘上形成侧壁间隔物，其中间隔件具有与其相关联的宽度，并且去除图案化的牺牲层特征。最后，使用间隔物作为硬掩模来图案化第二导电层，多晶硅间电介质和第一导电层，并且限定堆叠栅极，其中堆叠栅极的宽度是间隔物宽度的函数。

38. 发明授权

US07301193B2 Structure and method for low Vss resistance and reduced DIBL in a floating gate memory cell 有权
标题翻译：浮动栅极存储单元中低Vss电阻和减少DIBL的结构和方法
公开(公告)号：US07301193B2
公开(公告)日：2007-11-27
申请号：US10762445
申请日：2004-01-22
申请人： Shenqing Fang , Timothy Thurgate , Kuo-Tung Chang , Richard Fastow , Angela T. Hui , Kazuhiro Mizutani , Kelwin Ko , Hiroyuki Kinoshita , Yu Sun , Hiroyuki Ogawa
发明人： Shenqing Fang , Timothy Thurgate , Kuo-Tung Chang , Richard Fastow , Angela T. Hui , Kazuhiro Mizutani , Kelwin Ko , Hiroyuki Kinoshita , Yu Sun , Hiroyuki Ogawa
IPC分类号： H01L29/788
CPC分类号： H01L29/66825 , H01L21/28273 , H01L21/743 , H01L29/41766 , H01L29/66636
摘要： According to one exemplary embodiment, a floating gate memory cell comprises a stacked gate structure situated on a substrate and situated over a channel region in the substrate. The floating gate memory cell further comprises a recess formed in the substrate adjacent to the stacked gate structure, where the recess has a sidewall, a bottom, and a depth. According to this exemplary embodiment, the floating gate memory cell further comprises a source situated adjacent to the sidewall of the recess and under the stacked gate structure. The floating gate memory cell further comprises a Vss connection region situated under the bottom of the recess and under the source, where the Vss connection region is connected to the source. The Vss connection region being situated under the bottom of the recess causes the source to have a reduced lateral diffusion in the channel region.
摘要翻译：根据一个示例性实施例，浮动栅极存储器单元包括位于衬底上并位于衬底中的沟道区域上方的堆叠栅极结构。浮动栅极存储单元还包括形成在衬底中的与堆叠的栅极结构相邻的凹部，其中凹部具有侧壁，底部和深度。根据该示例性实施例，浮动栅极存储单元还包括位于与凹部的侧壁相邻并位于堆叠栅极结构下方的源极。浮动栅极存储单元还包括位于凹部底部下方和源极之下的Vss连接区域，其中Vss连接区域连接到源极。位于凹部底部下方的Vss连接区使得源在通道区域中具有减小的横向扩散。

39. 发明授权

US06808992B1 Method and system for tailoring core and periphery cells in a nonvolatile memory 有权
标题翻译：用于定制非易失性存储器中的核心和外围单元的方法和系统
公开(公告)号：US06808992B1
公开(公告)日：2004-10-26
申请号：US10150240
申请日：2002-05-15
申请人： Kelwin Ko , Shenqing Fang , Angela T. Hui , Hiroyuki Kinoshita , Wenmei Li , Yu Sun , Hiroyuki Ogawa
发明人： Kelwin Ko , Shenqing Fang , Angela T. Hui , Hiroyuki Kinoshita , Wenmei Li , Yu Sun , Hiroyuki Ogawa
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11536 , H01L29/6656
摘要： A method and system for providing a semiconductor device are described. The semiconductor device includes a substrate, a core and a periphery. The core includes a plurality of core gate stacks having a first plurality of edges, while the periphery a plurality of periphery gate stacks having a second plurality of edges. The method and system include providing a plurality of core spacers, a plurality of periphery spacers, a plurality of core sources and a plurality of conductive regions. The core spacers reside at the first plurality of edges and have a thickness. The periphery spacers reside at the second plurality of edges and have a second thickness greater than the first thickness. The core sources reside between the plurality of core gate stacks. The conductive regions are on the plurality of core sources. This method allows different thicknesses of the spacers to be formed in the core and the periphery so that the spacers can be tailored to the different requirements of the core and periphery.
摘要翻译：描述了一种用于提供半导体器件的方法和系统。半导体器件包括衬底，芯和周边。芯包括具有第一多个边缘的多个核心栅极叠层，而周边具有多个具有第二多个边缘的外围栅极堆叠。该方法和系统包括提供多个芯间隔件，多个外围间隔件，多个芯源和多个导电区域。芯间隔件位于第一多个边缘处并且具有厚度。外围间隔件位于第二多个边缘处并且具有大于第一厚度的第二厚度。核心源位于多个核心门堆栈之间。导电区域在多个核心源上。该方法允许不同厚度的间隔件形成在芯部和周边中，使得间隔件可以根据芯部和周边的不同要求进行调整。

40. 发明授权

US06927129B1 Narrow wide spacer 有权
标题翻译：狭窄的间距
公开(公告)号：US06927129B1
公开(公告)日：2005-08-09
申请号：US10821312
申请日：2004-04-08
申请人： Yu Sun , Kuo-Tung Chang , Angela T. Hui , Shenqing Fang
发明人： Yu Sun , Kuo-Tung Chang , Angela T. Hui , Shenqing Fang
IPC分类号： H01L21/336 , H01L21/8247 , H01L27/105
CPC分类号： H01L29/6656 , H01L27/105 , H01L27/11526 , H01L27/11534
摘要： A method for fabricating a semiconductor device. Specifically, A method of manufacturing a semiconductor device comprising: depositing a first oxide layer over a periphery transistor comprising a gate stack, a drain side sidewall and a source side sidewall and over a core transistor comprising a gate stack, a source side sidewall and a drain side sidewall; etching the first oxide layer wherein a portion of the first oxide layer remains on the source side sidewall and on the drain side sidewall of the periphery transistor and on the source side sidewall and on the drain side sidewall of the core transistor; etching the first oxide layer from the source side sidewall of the core transistor; depositing a second oxide layer over the periphery transistor and the core transistor; and etching the second oxide layer wherein a portion of the second oxide layer remains on the first oxide layer formed on the source side sidewall and on the drain side sidewall of the periphery transistor and wherein the second oxide layer remains on the source side sidewall and on the drain side sidewall of the core transistor.
摘要翻译：一种半导体器件的制造方法。具体地说，一种制造半导体器件的方法，包括：在包括栅极堆叠，漏极侧壁和源极侧壁的外围晶体管上沉积第一氧化物层，以及包括栅极堆叠，源极侧壁和排水侧壁蚀刻第一氧化物层，其中第一氧化物层的一部分保留在外围晶体管的源极侧壁和漏极侧壁上，并且在芯晶体管的源极侧壁和漏极侧侧壁上残留; 从芯晶体管的源极侧壁蚀刻第一氧化物层; 在外围晶体管和芯晶体管上沉积第二氧化物层; 以及蚀刻所述第二氧化物层，其中所述第二氧化物层的一部分保留在形成在所述外围晶体管的源极侧壁和漏极侧壁上的第一氧化物层上，并且其中所述第二氧化物层保留在所述源侧侧壁上，芯晶体管的漏极侧壁。

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