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31. 发明申请

WO2013074107A1 METHOD, APPARATUS AND SYSTEM FOR MEMORY VALIDATION 审中-公开
标题翻译：方法，存储器验证的装置和系统
公开(公告)号：WO2013074107A1
公开(公告)日：2013-05-23
申请号：PCT/US2011/061248
申请日：2011-11-17
申请人： INTEL CORPORATION , CHEW, Yen Hsiang
发明人： CHEW, Yen Hsiang
IPC分类号： G06F12/00 , G06F13/14 , G11C7/10
CPC分类号： G06F12/00 , G06F9/4401 , G06F11/106
摘要： Techniques and mechanisms for assuring that one or more addressable locations in memory of a computer platform are transitioned from potentially invalid state to known-valid state. In an embodiment, a memory validation agent separate from a processor of the computer platform performs memory validation writes in response to an indication of power state transition. In another embodiment, the memory validation agent determines information to be included in write commands which implement the memory validation, where the determining the information is decoupled from operation of the processor.
摘要翻译：用于确保计算机平台的存储器中的一个或多个可寻址位置从可能无效状态转变为已知有效状态的技术和机制。在一个实施例中，与计算机平台的处理器分离的存储器验证代理响应于功率状态转换的指示执行存储器验证写入。在另一个实施例中，存储器验证代理确定要包括在实现存储器验证的写入命令中的信息，其中确定信息与处理器的操作分离。

32. 发明申请

WO2010036654A2 REDUNDANT ARRAY OF INDEPENDENT DISKS-RELATED OPERATIONS 审中-公开
标题翻译：冗余阵列与独立磁盘相关的操作
公开(公告)号：WO2010036654A2
公开(公告)日：2010-04-01
申请号：PCT/US2009/057869
申请日：2009-09-22
申请人： INTEL CORPORATION , CHEW, Yen Hsiang
发明人： CHEW, Yen Hsiang
IPC分类号： G06F3/06 , G06F9/06 , G06F21/00
CPC分类号： G06F11/1076 , G06F21/80 , G06F2221/2107
摘要： In an embodiment, an apparatus is provided that may include circuitry to generate, at least in part, and/or receive, at least in part, at least one access request involving a redundant array of independent disks (RAID) storage. The storage may be capable of accessing, in response, at least in part, to the at least one request an encryption and/or parity information. The encryption may be of at least one portion of the data and/or the parity information. The encryption may be stored in (1) encrypted disk stripes in the storage such that the data is unrecoverable based solely upon remaining unencrypted portion of the data and the parity information stored in the storage, and/or (2) one or more respective disk stripes having a number that is determined based at least in part upon one or more encryption levels, if any, associated with at least one characteristic of the data.
摘要翻译：在一个实施例中，提供了一种装置，其可以包括用于至少部分地生成和/或至少部分地接收涉及冗余独立磁盘阵列的至少一个访问请求的电路（RAID）存储。存储器可以至少部分地响应于至少一个请求来访问加密和/或奇偶校验信息。加密可以是数据和/或奇偶校验信息的至少一部分。加密可以存储在存储器中的（1）加密磁盘条带中，使得数据仅基于数据的剩余未加密部分和存储在存储器中的奇偶校验信息而不可恢复，和/或（2）一个或多个相应的磁盘条带具有至少部分基于与数据的至少一个特征相关联的一个或多个加密级别（如果有的话）确定的号码。

33. 发明公开

EP3519924A2 INTERACTION MODE SELECTION BASED ON DETECTED DISTANCE BETWEEN USER AND MACHINE INTERFACE 无效
公开(公告)号：EP3519924A2
公开(公告)日：2019-08-07
申请号：EP17857165.9
申请日：2017-09-05
申请人： Intel Corporation
发明人： CHEW, Yen Hsiang
IPC分类号： G06F3/01 , G06F3/14

34. 发明公开

EP2801024A1 REDUCING THE NUMBER OF READ/WRITE OPERATIONS PERFORMED BY A CPU TO DUPLICATE SOURCE DATA TO ENABLE PARALLEL PROCESSING ON THE SOURCE DATA 审中-公开
标题翻译：减少由CPU进行读，写操作的数量从源数据式两份源数据的并行计算
公开(公告)号：EP2801024A1
公开(公告)日：2014-11-12
申请号：EP12864444.0
申请日：2012-12-27
申请人： Intel Corporation
发明人： CHEW, Yen Hsiang
IPC分类号： G06F9/06 , G06F9/38 , G06F9/30 , G06F13/14
CPC分类号： G06F9/50 , G06F9/30043 , G06F9/3824 , G06F9/3885 , G06F9/544 , G09G5/001 , G09G5/393 , G09G2360/127
摘要： Methods and apparatuses to reduce the number of read/write operations performed by a CPU may involve duplicating source data to enable parallel processing on the source data. A memory controller may be configured to duplicate data written to a first buffer to one or more duplicate buffers that are allocated to one or more processing threads, respectively. In some implementations, the one or more duplicate buffers are dedicated buffers, and the addresses of the first buffer and the one or more duplicate buffers are stored in a register of memory controller.

35. 发明授权

EP2332037B1 REDUNDANT ARRAY OF INDEPENDENT DISKS-RELATED OPERATIONS 有权
公开(公告)号：EP2332037B1
公开(公告)日：2019-06-05
申请号：EP09816761.2
申请日：2009-09-22
申请人： Intel Corporation
发明人： CHEW, Yen Hsiang
IPC分类号： G06F21/80 , G06F11/10

36. 发明公开

EP3039505A1 WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF 审中-公开
标题翻译： TRAGBARE ELEKTRONISCHE VORRICHTUNGEN UND KOMPONENTENDAFÜR
公开(公告)号：EP3039505A1
公开(公告)日：2016-07-06
申请号：EP14889183.1
申请日：2014-11-12
申请人： Intel Corporation
发明人： MEYER, Thorsten , PLENKERS, Dirk , BARTH, Hans-Joachim , WAIDHAS, Bernd , CHEW, Yen Hsiang , OOI, Kooi Chi , LOO, Howe Yin
IPC分类号： G06F1/16
CPC分类号： G06F1/163 , B29C39/021 , B29C39/10 , B29C65/4825 , B29L2031/3481 , G02C5/143 , G02C11/10
摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.
摘要翻译：可穿戴电子设备，其组件以及相关系统和技术的实施例在此公开。例如，可穿戴电子设备可以包括具有第一表面和第二表面的可穿戴支撑结构; 位于所述第一表面的第一电极，其中，当所述可佩戴的电子装置在使用者身体的一部分佩戴时，所述第一电极被布置成在所述使用者身体的所述部分中接触所述使用者的皮肤; 位于所述第二表面的第二电极，其中，当所述可佩戴的电子装置被使用者佩戴在所述使用者身体的所述部分上时，所述第二电极被布置为在所述用户身体的所述部分中不接触所述使用者的皮肤; 以及电阻开关，其具有分别耦合到所述第一和第二电极的第一和第二输入端子。可以公开和/或要求保护其他实施例。

37. 发明公开

EP3011800A1 REMOTE USER INTERFACE FOR SELF-SERVICE COMPUTING DEVICE 审中-公开
标题翻译： FERNBENUTZERSCHNITTSTELLEFÜREINE SELBSTBEDIENUNGS-BERECHNUNGSVORRICHTUNG
公开(公告)号：EP3011800A1
公开(公告)日：2016-04-27
申请号：EP13887248.6
申请日：2013-06-17
申请人： Intel Corporation
发明人： CHEW, Yen Hsiang
IPC分类号： H04W92/18 , H04W88/02
CPC分类号： H04L67/025 , G06F3/0482 , G06F3/04842 , G06Q20/102 , G06Q20/18 , G06Q20/327 , G06Q30/0641 , G07F9/023 , H04L67/16 , H04M2250/04 , H04W4/80
摘要： Embodiments of computer-implemented methods, systems, apparatuses, and computer-readable media (transitory and non-transitory) are described herein for configuring a self-service computing device to provide, to a remote computing device in direct wireless communication with the self-service computing device, data for the remote computing device to render an instance of a user interface operable by a user of the remote computing device to select a product or service offered by the self-service computing device. Other embodiments may be described and/or claimed.
摘要翻译：本文描述了计算机实现的方法，系统，装置和计算机可读介质（暂时性和非暂时性）的实施例，用于配置自助服务计算设备以向远程计算设备提供与自身的直接无线通信，服务计算设备，用于远程计算设备呈现由远程计算设备的用户操作的用户界面的实例的数据，以选择由自助服务计算设备提供的产品或服务。可以描述和/或要求保护其他实施例。

38. 发明公开

EP2801023A1 SWAPPING POINTERS TO PROCESS DATA STORED IN BUFFERS BY A DATA SOURCE WITHOUT COPYING THE DATA TO SEPARATE STORAGE 审中-公开
标题翻译：共享在缓冲区存储的HAND ON过程数据通过数据源而无需将数据备份在单独的存储
公开(公告)号：EP2801023A1
公开(公告)日：2014-11-12
申请号：EP12864151.1
申请日：2012-12-27
申请人： Intel Corporation
发明人： CHEW, Yen Hsiang
IPC分类号： G06F9/06 , G06F13/14
CPC分类号： G06F12/0238 , G06F9/52 , G06F9/544
摘要： Apparatuses and methods of swapping pointers to process data stored in a plurality of buffers by a data source without copying the data to separate storage are provided. Data may be consecutively loaded into a plurality of buffers pointed to by a first pointer by consecutively swapping the first pointer to point to the plurality of buffers. The data loaded in the plurality of buffers can be consecutively processed by consecutively pointing a second pointer to the plurality of buffers by consecutively swapping the second pointer to point to the plurality of buffer.
摘要翻译：提供装置和交换指针来处理由数据源存储在缓冲器中的多个数据，而不将数据复制到单独的存储的方法。数据可以通过连续地交换第一指针指向缓冲器的多元性被连续装入缓冲器的多元性指向第一指针。在缓冲器的多元性加载的数据可以通过连续地交换所述第二指针指向缓冲器的多个连续指向第二指针缓冲器的多元性被连续地处理。

39. 发明公开

EP3218928A1 FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES 审中-公开
标题翻译：用于可穿戴设备的灵活的系统级封装解决方案
公开(公告)号：EP3218928A1
公开(公告)日：2017-09-20
申请号：EP14889185.6
申请日：2014-11-12
申请人： Intel Corporation
发明人： TANG, Jiamiao , ZHAO, Junfeng , SKINNER, Michael P. , SHE, Yong , SIR, Jiun Hann , CHEAH, Bok Eng , PERIAMAN, Shanggar , OOI, Kooi Chi , CHEW, Yen Hsiang
IPC分类号： H01L23/28
CPC分类号： G06F1/163 , A41B1/00 , A41D1/06 , A41D1/08 , A41F9/002 , A43B3/001 , A43B3/0015 , A43B7/141 , A44C5/0015 , A44C15/005 , F03G5/06 , G06F1/189 , H01L21/4853 , H01L21/565 , H01L23/3135 , H01L23/49838 , H01L23/4985 , H01L23/562 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/48091 , H01L2224/73257 , H01L2924/0002 , H01L2924/181 , H02J1/14 , H05K1/189 , H05K2201/05 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate (102). The flexible substrate (102) may have a plurality of dies (104 -112) coupled therewith. The IC package may include a first encapsulation material (116-120), having a first rigidity, disposed on the flexible substrate (102) to at least partially encapsulate each die of the plurality dies (104 -112). The IC package may further include a second encapsulation material (122), having a second rigidity, disposed on the flexible substrate (102). In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例针对集成电路（IC）封装。在实施例中，集成电路（IC）封装可以包括柔性衬底。柔性衬底可以具有与其耦合的多个管芯。 IC封装可以包括具有第一刚性的第一封装材料，该第一封装材料设置在柔性衬底上以至少部分地封装多个管芯中的每个管芯。 IC封装可以进一步包括设置在柔性基板上的具有第二刚性的第二封装材料。在实施例中，第二刚性和第一刚性彼此不同。其他实施例可以被描述和/或要求保护。

40. 发明公开

EP3022765A1 FLEXIBLE PACKAGING ARCHITECTURE 审中-公开
标题翻译：灵活的VERPACKUNGSARCHITEKTUR
公开(公告)号：EP3022765A1
公开(公告)日：2016-05-25
申请号：EP14882778.5
申请日：2014-09-26
申请人： Intel Corporation
发明人： CHEAH, Bok Eng , KONG, Jackson Chung Peng , PERIAMAN, Shanggar , SKINNER, Michael , CHEW, Yen Hsiang , MAR, Kheng Tat , ABD RAZAK, Ridza Effendi , OOI, Kooi Chi
IPC分类号： H01L23/12
CPC分类号： H01L23/5387 , H01L21/4846 , H01L23/5389 , H01L24/19 , H01L25/0652 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/18 , H01L2224/24137 , H01L2224/73259 , H01L2924/15311
摘要： A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
摘要翻译：描述了适用于弯曲包装形状的柔性包装结构。在一个示例中，封装具有第一裸片，第一裸片上的第一模具化合物层，第一模具化合物层之上的布线层，布线层上的电耦合到布线层的第二裸片，以及第二模具化合物在第二个模具上。

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