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    • 31. 发明授权
    • Mask for polycrystallization and method of manufacturing thin film transistor using polycrystallization mask
    • 多结晶掩模和使用多结晶掩模制造薄膜晶体管的方法
    • US07011911B2
    • 2006-03-14
    • US10663081
    • 2003-09-16
    • Hyun-Jae KimSook-Young KangMyung-Koo Kang
    • Hyun-Jae KimSook-Young KangMyung-Koo Kang
    • G03F9/00
    • H01L29/66757H01L29/78675
    • In a method of manufacturing a thin film transistor according to the present invention, an amorphous silicon thin film is firstly formed on an insulating substrate and a planarization layer is formed thereon. Thereafter, the amorphous silicon thin film is crystallized by a solidification process using a laser-irradiation to form a polysilicon thin film. Next, the polysilicon thin film and the planarization layer are patterned to form a semiconductor layer, and a gate insulating layer covering the semiconductor layer is formed. Then, a gate electrode is formed on the gate insulating layer opposite the semiconductor layer. Next, impurities are implanted into the semiconductor layer to form a source region and a drain region opposite each other with respect to the gate electrode, and a source electrode and a drain electrode electrically connected to the source region and the drain region, respectively, are formed.
    • 在本发明的薄膜晶体管的制造方法中,首先在绝缘基板上形成非晶硅薄膜,在其上形成平坦化层。 此后,通过使用激光照射的固化工艺使非晶硅薄膜结晶,形成多晶硅薄膜。 接下来,对多晶硅薄膜和平坦化层进行构图以形成半导体层,并且形成覆盖半导体层的栅极绝缘层。 然后,在与半导体层相对的栅极绝缘层上形成栅电极。 接下来,将杂质注入到半导体层中以形成相对于栅极彼此相对的源极区域和漏极区域,并且分别与源极区域和漏极区域电连接的源极电极和漏极电极是 形成。
    • 33. 发明申请
    • Mask for crystallizing polysilicon and a method for forming thin film transistor using the mask
    • 用于结晶多晶硅的掩模和使用掩模形成薄膜晶体管的方法
    • US20050079693A1
    • 2005-04-14
    • US10495673
    • 2002-01-24
    • Myung-Koo KangHyun-Jae KimSook-Young Kang
    • Myung-Koo KangHyun-Jae KimSook-Young Kang
    • G02F1/1368H01L21/20H01L21/336H01L29/786
    • H01L21/02675H01L21/02532H01L21/0268H01L21/2026H01L29/66757H01L29/78675Y10S260/35
    • A mask for forming polysilicon has a first slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width, a second slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width, a third slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width, and a fourth slit region where a plurality of horizontal slit patterns are arranged in the vertical direction while bearing the same width. The slit patterns arranged at the first to fourth slit regions are sequentially enlarged in width in the horizontal direction in multiple proportion to the width d of the slit pattern at the first slit region. The centers of the slit patterns arranged at the first to fourth slit regions in the horizontal direction are placed at the same line. The slit patterns arranged at the respective slit regions in the vertical direction are spaced from each other with a distance of 8*d. Alternatively, the first to fourth slit regions may be arranged in reverse order, or in the vertical direction.
    • 用于形成多晶硅的掩模具有第一狭缝区域,其中垂直方向上布置多个水平狭缝图案,同时承载相同的宽度,在垂直方向上布置多个水平狭缝图案的第二狭缝区域,同时承载相同的宽度 宽度,在垂直方向上布置多个水平狭缝图案同时具有相同宽度的第三狭缝区域,以及沿垂直方向布置多个水平狭缝图案的第四狭缝区域,同时承载相同的宽度。 布置在第一至第四狭缝区域的狭缝图案在第一狭缝区域上与狭缝图案的宽度d成一定比例地沿水平方向的宽度依次增大。 沿水平方向布置在第一至第四狭缝区域处的狭缝图案的中心位于相同的线上。 在垂直方向的各个狭缝区域上排列的狭缝图案彼此间隔8 * d。 或者,第一至第四狭缝区域可以以相反的顺序或在垂直方向上布置。
    • 34. 发明授权
    • Method for manufacturing a thin film transistor using poly silicon
    • 使用多晶硅制造薄膜晶体管的方法
    • US07229860B2
    • 2007-06-12
    • US10499090
    • 2002-01-29
    • Jean-Ho SongJoon-Hoo ChoiBeom-Rak ChoiMyung-Koo KangSook-Young Kang
    • Jean-Ho SongJoon-Hoo ChoiBeom-Rak ChoiMyung-Koo KangSook-Young Kang
    • H01L21/00
    • H01L29/66757H01L29/78675
    • A manufacturing method of a thin film transistor. An amorphous silicon thin film is formed on an insulating substrate, and is crystallized by a lateral solidification process with illumination of laser beams into the amorphous silicon thin film to form a polysilicon thin film. Next, protrusion portions protruding from the surface of the polysilicon thin film are removed by plasma dry-etching using a gas mixture including Cl2, SF6 and Ar at the ratio of 3:1:2 to smooth the surface of the polysilicon thin film, and the semiconductor layer is formed by patterning the polysilicon thin film. A gate insulating film covering the semiconductor layer is formed and a gate electrode is formed on the gate insulating film opposite the semiconductor layer. A source region and a drain region opposite each other with respect to the gate electrode are formed by implanting impurities into the semiconductor layer and a source electrode and drain electrode are formed to be electrically connected to the source region and drain region.
    • 薄膜晶体管的制造方法。 在绝缘基板上形成非晶硅薄膜,并通过横向固化工艺使激光束照射到非晶硅薄膜中而形成多晶硅薄膜而结晶。 接下来,通过使用包含Cl 2,SF 6和Ar的气体混合物的等离子体干蚀刻来除去从多晶硅薄膜的表面突出的突出部分, 3:1:2以平滑多晶硅薄膜的表面,并且通过图案化多晶硅薄膜形成半导体层。 形成覆盖半导体层的栅极绝缘膜,并且在与半导体层相对的栅极绝缘膜上形成栅电极。 通过将杂质注入到半导体层中而形成源极区和相对于栅极彼此相对的漏极区,源电极和漏电极形成为与源区和漏区电连接。
    • 36. 发明申请
    • Method for manufacturing a thin film transistor using poly silicon
    • 使用多晶硅制造薄膜晶体管的方法
    • US20050130357A1
    • 2005-06-16
    • US10499090
    • 2002-01-29
    • Jean-Ho SongJoon-Hoo ChoiBeom-Rak ChoiMyung-Koo KangSook-Young Kang
    • Jean-Ho SongJoon-Hoo ChoiBeom-Rak ChoiMyung-Koo KangSook-Young Kang
    • G02F1/1368H01L21/20H01L21/208H01L21/3065H01L21/336H01L29/786
    • H01L29/66757H01L29/78675
    • A manufacturing method of a thin film transistor. An amorphous silicon thin film is formed on an insulating substrate, and is crystallized by a lateral solidification process with illumination of laser beams into the amorphous silicon thin film to form a polysilicon thin film. Next, protrusion portions protruding from the surface of the polysilicon thin film are removed by plasma dry-etching using a gas mixture including Cl2, SF6 and Ar at the ratio of 3:1:2 to smooth the surface of the polysilicon thin film, and the semiconductor layer is formed by patterning the polysilicon thin film. A gate insulating film covering the semiconductor layer is formed and a gate electrode is formed on the gate insulating film opposite the semiconductor layer. A source region and a drain region opposite each other with respect to the gate electrode are formed by implanting impurities into I the semiconductor layer and a source electrode and drain electrode are forined to be electrically connected to the source region and drain region.
    • 薄膜晶体管的制造方法。 在绝缘基板上形成非晶硅薄膜,并通过横向固化工艺使激光束照射到非晶硅薄膜中而形成多晶硅薄膜而结晶。 接下来,通过使用包含Cl 2,SF 6和Ar的气体混合物的等离子体干蚀刻来除去从多晶硅薄膜的表面突出的突出部分, 3:1:2以平滑多晶硅薄膜的表面,并且通过图案化多晶硅薄膜形成半导体层。 形成覆盖半导体层的栅极绝缘膜,并且在与半导体层相对的栅极绝缘膜上形成栅电极。 通过将杂质注入到半导体层中而形成源极区域和相对于栅极电极相对的漏极区域,源极和漏极电极被电连接到源极区域和漏极区域。