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31. 发明授权

US08181468B2 Apparatus and method for dispensing discrete amounts of viscous material 有权
标题翻译：用于分配离散量的粘性材料的装置和方法
公开(公告)号：US08181468B2
公开(公告)日：2012-05-22
申请号：US12817546
申请日：2010-06-17
申请人： Erik Fiske , Horatio Quinones , Philip P. Maiorca , Alec Babiarz , Robert Ciardella
发明人： Erik Fiske , Horatio Quinones , Philip P. Maiorca , Alec Babiarz , Robert Ciardella
IPC分类号： F25B21/02
CPC分类号： B05C5/001 , B05C5/0225 , B05C5/0237 , B05C11/1034 , H05K13/046
摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.
摘要翻译：将少量粘性物质分配到工件上的装置和方法。窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

32. 发明申请

US20110315232A1 AUTOMATED VACUUM ASSISTED VALVE PRIMING SYSTEM AND METHODS OF USE 有权
标题翻译：自动真空辅助阀预灌装系统及其使用方法
公开(公告)号：US20110315232A1
公开(公告)日：2011-12-29
申请号：US13063796
申请日：2009-09-18
申请人： Cutler Crowell , Erik Fiske , Horatio Quinones , Brian Sawatzky
发明人： Cutler Crowell , Erik Fiske , Horatio Quinones , Brian Sawatzky
IPC分类号： F15D1/00
CPC分类号： G05D16/20 , B05C5/0225 , B05C11/1005 , B05C11/1034 , Y10T137/0396 , Y10T137/85986
摘要： An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.
摘要翻译：一种自动化系统（10）和方法（11），用于利用来自流体材料源的流体（16）起动流体分配阀（14）的流体室（12），流体材料源包括真空源（46），阀启动站 32），真空开关（54）和控制器（62）。阀门启动台（32）具有一个罩（40），一个真空室（36）和一个位于靴子（40）中的真空通道（42）。真空通道（42）通过真空室（36）与真空源（46）连接。护罩（40）密封地接合流体分配阀（14）的阀喷嘴（28），使得真空室（36）将真空源（46）与流体室（12）连接。真空开关（54）经由真空室（36）与真空通道（42）联接，并且基于真空室（36）中的真空水平具有打开和关闭位置。基于真空开关（54）是打开还是关闭，控制器（62）与真空源（46）和真空开关（54）电连接并控制流体分配阀（14）的启动。

33. 发明授权

US06281573B1 Thermal enhancement approach using solder compositions in the liquid state 失效
标题翻译：使用焊料组合物处于液态的热增强方法
公开(公告)号：US06281573B1
公开(公告)日：2001-08-28
申请号：US09052296
申请日：1998-03-31
申请人： Eugene R. Atwood , Joseph A. Benenati , Giulio DiGiacomo , Horatio Quinones
发明人： Eugene R. Atwood , Joseph A. Benenati , Giulio DiGiacomo , Horatio Quinones
IPC分类号： H05K720
CPC分类号： H01L23/3675 , H01L23/3736 , H01L23/4275 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00013 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/15311 , H01L2924/16251 , H01L2924/00 , H01L2224/29099
摘要： Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate.
摘要翻译：引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。焊料组合物具有通过随着每个温度升高改变状态或相位而吸收和排除热能的性能，并且由与集成电路芯片的热循环相关的温度波动导致的下降。通过电子模块盖提供从IC芯片到热交换器到周围空气的高热传导（低热阻）的路径，该电子模块盖被构造为具有形成或附接为单个结构的热交换器的盖，并且由与基材相同的材料，或由具有相容的热膨胀系数的材料制成，以减轻热循环期间垂直位移的影响。盖 - 热交换器盖被构造成柔性，并且与IC芯片和基板接触。

34. 发明授权

US6016947A Non-destructive low melt test for off-composition solder 失效
标题翻译：非组分焊料的非破坏性低熔点试验
公开(公告)号：US6016947A
公开(公告)日：2000-01-25
申请号：US954988
申请日：1997-10-21
申请人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
发明人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
IPC分类号： H01L21/66 , H05K1/02 , H05K3/34 , H01L21/00
CPC分类号： H05K3/3457 , H01L22/12 , H05K1/0269 , H05K2203/0113 , H05K2203/0338 , H05K2203/163
摘要： A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
摘要翻译：用于识别例如陶瓷柱格栅阵列的组合焊料柱的非破坏性方法。该方法在卡组件之前在陶瓷模块级执行，以避免卡片组装后的昂贵损失或返工。衬底上的焊料柱的组装被加热到低于纯组合焊料的熔化温度并高于焊料柱附着到有机板的温度的温度。加热组件产生视觉上可检测到的组成外焊料的特性，其用于鉴定哪些焊料柱由脱组合的焊料组成。

35. 发明授权

US4962294A Method and apparatus for causing an open circuit in a conductive line 失效
标题翻译：在导线中导致开路的方法和装置
公开(公告)号：US4962294A
公开(公告)日：1990-10-09
申请号：US322955
申请日：1989-03-14
申请人： Keith F. Beckham , David C. Challener , Arunava Gupta , Joseph M. Harvilchuck , James M. Leas , James R. Lloyd , David C. Long , Horatio Quinones , Krishna Seshan , Morris Shatzkes
发明人： Keith F. Beckham , David C. Challener , Arunava Gupta , Joseph M. Harvilchuck , James M. Leas , James R. Lloyd , David C. Long , Horatio Quinones , Krishna Seshan , Morris Shatzkes
IPC分类号： B23K26/00 , H01L21/3205 , H01L21/82 , H01L23/52 , H01L23/525 , H05K3/22
CPC分类号： H01L23/5256 , H01L2924/0002
摘要： A method for causing an open circuit in an electrical conductor is provided, including the steps of: conducting a direct current through the conductor; and applying heat at a selected location on the conductor whereat it is desired to cause the open circuit of the conductor.

36. 发明授权

US08578729B2 Apparatus and method for dispensing discrete amounts of viscous material 有权
标题翻译：用于分配离散量的粘性材料的装置和方法
公开(公告)号：US08578729B2
公开(公告)日：2013-11-12
申请号：US13454579
申请日：2012-04-24
申请人： Erik Fiske , Horatio Quinones , Phillip P. Maiorca , Alec Babiarz , Robert Ciardella
发明人： Erik Fiske , Horatio Quinones , Phillip P. Maiorca , Alec Babiarz , Robert Ciardella
IPC分类号： F25B13/00
CPC分类号： B05C5/001 , B05C5/0225 , B05C5/0237 , B05C11/1034 , H05K13/046
摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.
摘要翻译：将少量粘性物质分配到工件上的装置和方法。窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

37. 发明授权

US08074467B2 Apparatus and method for dispensing discrete amounts of viscous material 有权
标题翻译：用于分配离散量的粘性材料的装置和方法
公开(公告)号：US08074467B2
公开(公告)日：2011-12-13
申请号：US13009927
申请日：2011-01-20
申请人： Erik Fiske , Horatio Quinones , Phillip P. Maiorca , Alec Babiarz , Robert Ciardella
发明人： Erik Fiske , Horatio Quinones , Phillip P. Maiorca , Alec Babiarz , Robert Ciardella
IPC分类号： F25D3/00
CPC分类号： B05C5/001 , B05C5/0225 , B05C5/0237 , B05C11/1034 , H05K13/046
摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.
摘要翻译：将少量粘性物质分配到工件上的装置和方法。窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

38. 发明申请

US20100252576A1 Apparatus and Method for Dispensing Discrete Amounts of Viscous Material 有权
标题翻译：用于分配离散量的粘性材料的装置和方法
公开(公告)号：US20100252576A1
公开(公告)日：2010-10-07
申请号：US12817546
申请日：2010-06-17
申请人： Erik Fiske , Horatio Quinones , Phil Maiorca , Alec Babiarz , Robert Ciardella
发明人： Erik Fiske , Horatio Quinones , Phil Maiorca , Alec Babiarz , Robert Ciardella
IPC分类号： B67D7/72 , B67D7/80 , B65D47/18
CPC分类号： B05C5/001 , B05C5/0225 , B05C5/0237 , B05C11/1034 , H05K13/046
摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.
摘要翻译：将少量粘性物质分配到工件上的装置和方法。窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

39. 发明授权

US07762088B2 Apparatus and method for dispensing discrete amounts of viscous material 有权
标题翻译：用于分配离散量的粘性材料的装置和方法
公开(公告)号：US07762088B2
公开(公告)日：2010-07-27
申请号：US11328378
申请日：2006-01-09
申请人： Erik Fiske , Horatio Quinones , Phil Maiorca , Alec Babiarz , Robert Ciardella
发明人： Erik Fiske , Horatio Quinones , Phil Maiorca , Alec Babiarz , Robert Ciardella
IPC分类号： F25B21/00 , F25D3/00
CPC分类号： B05C5/001 , B05C5/0225 , B05C5/0237 , B05C11/1034 , H05K13/046
摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.
摘要翻译：将少量粘性物质分配到工件上的装置和方法。窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

40. 发明授权

US5805430A Zero force heat sink 失效
公开(公告)号：US5805430A
公开(公告)日：1998-09-08
申请号：US687103
申请日：1996-07-22
申请人： Eugene R. Atwood , Joseph A. Benenati , James J. Dankelman , Horatio Quinones , Karl J. Puttlitz , Eric J. Kastberg
发明人： Eugene R. Atwood , Joseph A. Benenati , James J. Dankelman , Horatio Quinones , Karl J. Puttlitz , Eric J. Kastberg
IPC分类号： H01L23/40 , H02B1/01 , H02B7/20
CPC分类号： H01L23/4006 , H01L2224/16225 , H01L2924/09701
摘要： A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or other suitable carrier on which the substrate is positioned. The heat sink extends through an aperture in the frame and is in heat transfer relationship with a surface of the substrate; however, it is mechanically decoupled from the substrate. The invention has particular application in thermally connecting large heat sinks to substrates that are surface mounted on the support using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. In order to provide intimate contact between the substrate and the heat sink, the heat sink must be depressed coaxially through the aperture of the frame against a surface of the substrate and then secured by, for example, gluing while in contact with the surface. However, this downward force imparted by the heat sink is quickly reduced via relaxation of the lead/tin or other metallic elements of the surface mount. A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matches the thermal expansion of the substrate. Thus the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

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