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    • 31. 发明授权
    • Method of forming a thin semiconductor film
    • 形成薄半导体膜的方法
    • US4693759A
    • 1987-09-15
    • US801319
    • 1985-11-25
    • Takashi NoguchiHisao HayashiTakefumi Ohshima
    • Takashi NoguchiHisao HayashiTakefumi Ohshima
    • H01L21/20H01L21/265H01L29/786H01L21/263
    • H01L29/78675H01L21/2022H01L21/26506Y10S148/061
    • A method of forming a thin semiconductor film has the steps of: forming a thin semiconductor film on a predetermined substrate; implanting predetermined ions in the thin semiconductor film to convert the thin semiconductor film to a thin amorphous semiconductor film; decreasing a thickness of the thin amorphous semiconductor film to a predetermined thickness; and annealing the thin amorphous semiconductor film to cause solid-phase growth. According to this method, a large thin polycrystalline semiconductor film with a crystal grain size larger than the conventional crystal grain size and a good crystal grain orientation can be uniformly formed at a low temperature. It is, therefore, possible to use such a thin semiconductor film to fabricate a thin film semiconductor device with excellent electrical characteristics.
    • 形成薄的半导体膜的方法具有以下步骤:在预定的衬底上形成薄的半导体膜; 在薄半导体膜中注入预定的离子以将薄的半导体膜转换为薄的非晶半导体膜; 将薄的非晶半导体膜的厚度减小到预定的厚度; 并对薄的非晶半导体膜退火以引起固相生长。 根据该方法,可以在低温下均匀地形成结晶粒径大于常规晶粒尺寸和良好晶粒取向的大的多晶半导体薄膜。 因此,可以使用这种薄的半导体膜来制造具有优异的电特性的薄膜半导体器件。
    • 32. 发明授权
    • Gas operating system for loading shot shell in an automatic gun
    • 用于在自动喷枪中装载射击炮的气体操作系统
    • US4207798A
    • 1980-06-17
    • US850202
    • 1977-11-10
    • Hisao Hayashi
    • Hisao Hayashi
    • F41A5/18F41A21/48F41D5/10
    • F41A21/484F41A5/18
    • In an automatic gun, the gas pressure generated by the firing of a shot shell is transmitted to the breechblock in the receiver housing by the axial sliding movement of an action bar assembly mounted outside the gunbarrel or the cartridge magazing tube for releasing the breechblock. The action bar assembly includes action bars slidably mounted coaxially with each other and an adjusting spring for arresting the contraction of the span between the stem bodies. A cylinder is fixed to the gunbarrel for receiving the gas pressure from it. The forward end of the action bar assembly extends into the cylinder, while the rearward end passes through a guide hole in the receiver into contact with the front surface of the breechblock. The rearward end has a stopper for restricting the axial movement of the action bar assembly to a predetermined length. A supporting mechanism serves to arrest the rotation of the gunbarrel and the fore-arm by engaging a projection of a predetermined shape, provided at the forward end of the receiver, with cutout portions in the outer periphery of the gunbarrel and the fore-arm.
    • 在自动喷枪中,通过射击枪壳的射击产生的气体压力通过安装在枪管外部的动作杆组件或药筒喷射管的轴向滑动运动而传递到接收器壳体中的后膛块,用于释放枪闩。 动作杆组件包括彼此同轴地可滑动地安装的作用杆,以及调节弹簧,用于阻止杆体在杆体之间的收缩。 气缸固定在枪管上,用于接收气体压力。 动作杆组件的前端延伸到气缸中,而后端通过接收器中的引导孔与后膛块的前表面接触。 后端具有用于将动作杆组件的轴向运动限制到预定长度的止动器。 支撑机构用于通过将设置在接收器的前端处的预定形状的突起与枪管和前臂的外周中的切口部分接合来阻止枪管和前臂的旋转。
    • 39. 发明授权
    • Thin film semiconductor device and display device
    • 薄膜半导体器件和显示器件
    • US06410961B1
    • 2002-06-25
    • US09212383
    • 1998-12-16
    • Hisao Hayashi
    • Hisao Hayashi
    • H01L29786
    • H01L27/12H01L27/1203H01L29/41733H01L29/78645
    • A thin film semiconductor device comprising an insulating substrate, a plurality of thin film transistors integrated on the insulating substrate, each thin film transistor including a gate electrode, a gate insulating film, a semiconductor thin film and an interlayer insulating film which are laminated in this order from the lower side, and the semiconductor thin film being formed with a channel region confronting the gate electrode, and a source region and a drain region which are located at both sides of the channel region, and a conductor film which is formed on the surface of the interlayer insulating film so as to be overlapped with the channel region. A display device having a pair of insulating substrates, electrooptical material held in the gap between the insulating substrates, a counter electrode formed in one of the insulating substrates, and a plurality of pixel electrodes and a plurality of thin film transistors which are integrated on the other insulating substrate.
    • 一种薄膜半导体器件,包括绝缘衬底,集成在绝缘衬底上的多个薄膜晶体管,每个薄膜晶体管包括栅电极,栅极绝缘膜,半导体薄膜和层间绝缘膜,层压在该 并且半导体薄膜形成有面对栅电极的沟道区域和位于沟道区域两侧的源极区域和漏极区域以及形成在沟道区域上的导体膜 层间绝缘膜的表面与沟道区重叠。 一种显示装置,具有一对绝缘基板,保持在绝缘基板之间的间隙中的电光材料,形成在一个绝缘基板中的对置电极,以及多个像素电极和多个薄膜晶体管, 其他绝缘基板。
    • 40. 发明授权
    • Thin film semiconductor device having a buffer layer
    • 具有缓冲层的薄膜半导体器件
    • US06396079B1
    • 2002-05-28
    • US08730015
    • 1996-10-11
    • Hisao HayashiYasushi ShimogaichiKeiji Kato
    • Hisao HayashiYasushi ShimogaichiKeiji Kato
    • H01L2976
    • H01L29/78603H01L29/78606
    • A thin film semiconductor device having improved operating characteristics and reliability of a thin film transistor formed on a glass substrate. The thin film semiconductor device has a thin film transistor 3 formed on a glass substrate 1 containing alkali metal. The surface of the glass substrate 1 is covered by a buffer layer 2. The thin film transistor 3 formed on this buffer layer 2 has a polycrystalline semiconductor thin film 4 as an active layer. The buffer layer 2 includes at least a silicon nitride film and protects the thin film transistor 3 from contamination by alkali metals such as Na and has a thickness such that it can shield the thin film transistor 3 from an electric field created by localized alkali metal ions (Na+).
    • 一种薄膜半导体器件,其具有改进的在玻璃衬底上形成的薄膜晶体管的工作特性和可靠性。 薄膜半导体器件具有形成在含有碱金属的玻璃基板1上的薄膜晶体管3。 玻璃基板1的表面被缓冲层2覆盖。形成在该缓冲层2上的薄膜晶体管3具有作为活性层的多晶半导体薄膜4。 缓冲层2至少包括氮化硅膜,并且保护薄膜晶体管3免受诸如Na之类的碱金属的污染,并且具有这样的厚度,使得其可以将薄膜晶体管3屏蔽在由局部碱金属离子产生的电场 (Na +)。