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31. 发明申请

US20060116054A1 Polishing body 失效
公开(公告)号：US20060116054A1
公开(公告)日：2006-06-01
申请号：US11288086
申请日：2005-11-29
申请人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
发明人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
IPC分类号： B24B7/30
CPC分类号： B24B37/245 , B24B37/24 , B24D3/28 , B24D11/001 , B24D18/0009 , C09K3/1454
摘要： An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH 8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.

32. 发明授权

US07001252B2 Abrasive material 失效
标题翻译：磨料
公开(公告)号：US07001252B2
公开(公告)日：2006-02-21
申请号：US10030141
申请日：2001-05-29
申请人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
发明人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
IPC分类号： B24B7/22
CPC分类号： B24B37/245 , B24B37/24 , B24D3/28 , B24D11/001 , B24D18/0009 , C09K3/1454
摘要： An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.
摘要翻译：本发明的目的是提供一种抛光体，其中抛光体中的磨料非常分散，在抛光过程中提供稳定的抛光性能，并且即使在大的情况下也能有效地减少划痕的发生含有磨料的数量。通过在高压釜中加载预定量的丁二烯，苯乙烯，甲基丙烯酸甲酯，衣康酸，丙烯酸，α-甲基苯乙炔二酮和叔十二烷基硫醇，制得本发明中构成抛光体的抛光部分，使混合物反应16小时在75℃下，得到其中分散共聚物的乳液，将该乳液调节至pH8.5，并加入平均一次粒径为0.3μm的二氧化铈粉末并搅拌，得到水分散体，通过涂布干燥该水性分散体薄膜穿过薄膜，模压所得干燥产品。上述抛光部分可以具有交联结构。本发明的研磨体可以在抛光垫等中有利地使用，用于研磨半导体晶片等的表面。

33. 发明申请

US20050260929A1 Chemical mechanical polishing pad and chemical mechanical polishing method 审中-公开
标题翻译：化学机械抛光垫和化学机械抛光方法
公开(公告)号：US20050260929A1
公开(公告)日：2005-11-24
申请号：US11132365
申请日：2005-05-19
申请人： Hiroshi Shiho , Hiroyuki Tano , Yukio Hosaka , Hideki Nishimura
发明人： Hiroshi Shiho , Hiroyuki Tano , Yukio Hosaka , Hideki Nishimura
IPC分类号： B24B37/04 , B24D13/14 , B24B1/00
CPC分类号： B24B37/26
摘要： A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having (i) a first group of grooves which intersect a single virtual straight line extending from the center toward the peripheral portion of the polishing surface and do not cross one another, or a single first spiral groove which expands gradually from the center portion toward the peripheral portion of the polishing surface, and (ii) a second group of grooves which extend from the center portion toward the peripheral portion of the polishing surface, intersect the first group of grooves or the first spiral groove and do not cross one another. Since this chemical mechanical polishing pad fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate, it is advantageously used in a chemical mechanical polishing method.
摘要翻译：一种化学机械抛光垫，其具有抛光表面，与抛光表面相对的非抛光表面和用于限定这些表面的侧表面，所述抛光表面具有（i）第一组沟槽，其与从所述中心朝向所述研磨面的周边部并且不会彼此交叉，或者从所述研磨面的中心部朝向所述周边部逐渐扩展的单个第一螺旋槽，以及（ii）延伸的所述第二组槽从中心部朝向研磨面的周边部分，与第一组槽或第一螺旋槽相交，并且不会彼此交叉。由于该化学机械抛光垫完全抑制在研磨表面上产生划痕并且具有优异的抛光速率，因此有利地用于化学机械抛光方法中。

34. 发明授权

US06337371B2 Thermoplastic resin composition having excellent long-term heat-aging properties 有权
标题翻译：热塑性树脂组合物具有优异的长期热老化性能
公开(公告)号：US06337371B2
公开(公告)日：2002-01-08
申请号：US09775655
申请日：2001-02-05
申请人： Takashi Kurata , Yukio Hosaka
发明人： Takashi Kurata , Yukio Hosaka
IPC分类号： C08G6348
CPC分类号： C08L69/00 , C08L2666/02
摘要： The present invention relates to a thermoplastic resin composition with excellent long-term heat-aging properties, comprising: (I) 10 to 45% by weight of a rubber-modified thermoplastic resin obtained by graft polymerizing at least one monomer selected from the group consisting of aromatic vinyl compounds, vinyl cyanide compounds and other vinyl monomers copolymerizable therewith in the presence of a rubber-like polymer; (II) 5 to 30% by weight of a thermoplastic resin obtained by copolymerizing the monomers comprising an aromatic vinyl compound, a vinyl cyanide compound and optionally other vinyl monomer copolymerizable therewith; and (III) 50 to 70% by weight of a polycarbonate resin, the content of the vinyl cyanide compound in the whole produced composition being 3 to 12% by weight.
摘要翻译：本发明涉及具有优异的长期热老化性能的热塑性树脂组合物，其包含：（I）10至45重量％的橡胶改性热塑性树脂，其通过将至少一种选自以下的单体接枝聚合而获得：的芳族乙烯基化合物，乙烯基氰化合物和其它可与橡胶状聚合物共聚的乙烯基单体;（II）5-30重量％的热塑性树脂，其通过将包含芳族乙烯基化合物，乙烯基氰化物化合物和可与其共聚的任意其它乙烯基单体; 和（III）50〜70重量％的聚碳酸酯树脂，全部生成组合物中的乙烯基氰化合物的含量为3〜12重量％。

35. 发明授权

US5598091A Three-phase brushless self-excited synchronous generator with no rotor exciting windings 失效
标题翻译：无转子励磁绕组的三相无刷自励同步发电机
公开(公告)号：US5598091A
公开(公告)日：1997-01-28
申请号：US513526
申请日：1995-08-10
申请人： Satoru Satake , Yukio Hosaka , Yukio Onogi , Kenji Inoue
发明人： Satoru Satake , Yukio Hosaka , Yukio Onogi , Kenji Inoue
IPC分类号： H02P9/14 , H02K19/26 , H02K19/28 , H02P9/10
CPC分类号： H02K19/28
摘要： On a stator core, there are wound primary generating windings of four (4) poles with a distributed full-pitch winding structure and stator excitation windings with a concentrated full-pitch winding structure, having the number of poles odd-number times the number of poles of the primary generating windings, that is, twelve (12) poles. The primary windings appropriately produce spatial higher harmonic components of the armature reaction magnetic fields. The excitation windings are connected to the center taps of the primary windings through a control rectifier. On a rotor core, six field windings of four poles. The field windings are arranged at positions where they are magnetically coupled with both static magnetic fields produced by the stator excitation windings and odd-order spatial higher harmonic components of armature reaction magnetic fields produced by the currents in the primary generating windings. The field windings are short-circuited by the diodes, respectively. In the brushless self-excited synchronous generator, the number of slots in each of the rotor and stator can be determined irrespective of the order number of the spatial higher harmonic components of the armature reaction magnetic fields. The generator is simple and rigid in its structure.
摘要翻译：在定子铁芯上，有四（4）个磁极绕组的初级绕组绕组具有分布式全节距绕组结构，定子励磁绕组具有集中的全节距绕组结构，其极数为奇数次数主发电绕组的极点，即十二（12）极。初级绕组适当地产生电枢反应磁场的空间高次谐波分量。励磁绕组通过控制整流器连接到初级绕组的中心抽头。在转子芯上，四极的六个励磁绕组。励磁绕组被布置在它们与由定子励磁绕组产生的静态磁场和由初级发电绕组中的电流产生的电枢反作用磁场的奇数空间高次谐波分量磁耦合的位置处。励磁绕组分别由二极管短路。在无刷自激同步发电机中，不管电枢反应磁场的空间高次谐波分量的次数如何，都可以确定转子和定子的槽数。发电机的结构简单而刚性。

36. 发明授权

US5050808A Milling apparatus and system therefor 失效
标题翻译：铣床及其系统
公开(公告)号：US5050808A
公开(公告)日：1991-09-24
申请号：US452271
申请日：1989-12-18
申请人： Toshihiko Satake , Satoru Satake , Yukio Hosaka
发明人： Toshihiko Satake , Satoru Satake , Yukio Hosaka
IPC分类号： B02C4/32 , B02C9/04
CPC分类号： B02C4/32 , B02C9/04
摘要： In a milling apparatus for milling granular material into milled particles, a roll mill includes a pair of rolls which are rotatably arranged in facing relation to each other. At least one of the rolls is movable toward and away from the other. A gap adjusting unit is associated with the at least one roll for moving the same toward and away from the other roll to adjust a gap between the rolls thereby adjusting a milling degree of the milled particles. A measuring unit is arranged downstream of the roll mill and is connected to the gap adjusting unit thereof for measuring the milling degree of the milled particles. The gap adjusting unit is operative in response to an output signal from the measuring unit to move the at least one roll toward and away from the other roll, thereby automatically adjusting the milling degree of the milled particles. A milling system is provided which includes at least two roll mills described above.
摘要翻译：在用于将颗粒材料研磨成研磨颗粒的研磨设备中，辊磨机包括一对可相对于彼此可旋转地布置的辊。至少一个辊可以朝向和远离另一个移动。间隙调节单元与至少一个辊相关联，用于将其移动到另一个辊和离开另一个辊以调节辊之间的间隙，从而调节研磨颗粒的研磨度。测量单元布置在辊磨机的下游，并连接到其间隙调节单元，用于测量研磨颗粒的研磨度。间隙调节单元响应于来自测量单元的输出信号而操作，以使至少一个辊朝向和远离另一个辊移动，从而自动调节研磨颗粒的研磨度。提供了一种铣削系统，其包括至少两个如上所述的辊磨机。

37. 发明授权

US4483244A Rice whitening apparatus 失效
标题翻译：米美白仪
公开(公告)号：US4483244A
公开(公告)日：1984-11-20
申请号：US558628
申请日：1983-12-06
申请人： Yukio Hosaka
发明人： Yukio Hosaka
IPC分类号： B02B3/00 , B02C25/00
CPC分类号： B02B3/00
摘要： Disclosed is a rice whitening apparatus which is capable of indicating a degree of milling. The rice whitening apparatus comprises a first sensor means (1), a second sensor means (1'), a calculating means (20a) and an indicating means (23). The first sensor means (1) includes a first reflected light receiving sensor (6) for measuring a degree of reflected light from the brown rice, while the second sensor means (1') includes a second reflected light receiving sensor (6') for measuring a degree of reflected light from the milled rice. The first sensor means (1) may include a first transmitted light receiving sensor (5) for measuring a degree of transmitted light from the brown rice, while the second sensor means (1') a second transmitted light receiving sensor (5') for measuring a degree of transmitted light from the milled rice. The calculating means (20a) calculates the degree of milling of the rice based on the degree of reflected light or both the degree of reflected and transmitted light from the first and second sensor means (1, 1'). The indicating means (23) indicates the degree of milling calculated by the calculating means (20a).
摘要翻译：公开了能够显示研磨程度的米粉增白装置。米白化装置包括第一传感器装置（1），第二传感器装置（1'），计算装置（20a）和指示装置（23）。第一传感器装置（1）包括用于测量来自糙米的反射光程度的第一反射光接收传感器（6），而第二传感器装置（1'）包括第二反射光接收传感器（6'），用于测量来自碾米的反射光的程度。第一传感器装置（1）可以包括用于测量来自糙米的透射光的第一透射光接收传感器（5），而第二传感器装置（1'）具有第二透射光接收传感器（5'），用于测量来自碾米的透射光的程度。计算装置（20a）基于反射光的程度或来自第一和第二传感器装置（1,1'）的反射光和透射光的程度来计算米的铣削程度。指示装置（23）表示由计算装置（20a）计算的铣削程度。

38. 发明授权

US09193200B2 Imprinter including an elastic member for elastically supporting the roller shaft 有权
标题翻译：打印机包括用于弹性地支撑辊轴的弹性构件
公开(公告)号：US09193200B2
公开(公告)日：2015-11-24
申请号：US12801075
申请日：2010-05-20
申请人： Yukio Hosaka
发明人： Yukio Hosaka
IPC分类号： B31F1/07 , B41L19/00
CPC分类号： B41L19/00
摘要： An imprinter includes a printing base for mounting a card and a print paper to be imprinted on a predetermined area thereof, a carriage that is movable above the printing base, a roller includes a hard material and is provided as is housed within the carriage for transcribing the information represented as embossed on a card, a roller shaft for fixedly supporting the roller, bearings for rotatably supporting the roller shaft at a position of a predetermined height from the card mounting surface of the printing base, and an elastic mechanism provided between the bearings and the roller shaft, the elastic mechanism being radially deformed during an imprinting operation to cause the roller to radially move relative to the bearings so that the embossed information of the card may be transcribed onto the print paper.
摘要翻译：打印机包括用于安装卡片的打印基座和要打印在其预定区域上的打印纸，可在打印基座上方移动的托架，滚子包括硬质材料，并且被设置为容纳在托架内用于转录表示为压花在卡上的信息，用于固定支撑辊的辊轴，用于将辊轴可旋转地支撑在距离印刷基座的卡安装表面的预定高度的位置处的轴承，以及设置在轴承之间的弹性机构和辊轴，弹性机构在压印操作期间径向变形，以使辊相对于轴承径向移动，使得卡的压花信息可以转录到打印纸上。

39. 发明授权

US08388799B2 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method 有权
标题翻译：用于形成化学机械抛光垫抛光层，化学机械抛光垫和化学机械抛光方法的组合物
公开(公告)号：US08388799B2
公开(公告)日：2013-03-05
申请号：US12357706
申请日：2009-01-22
申请人： Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
发明人： Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
IPC分类号： H01L21/304 , C08G18/42 , C08G18/48 , C08G18/62
CPC分类号： C08G18/3206 , B24B37/042 , B24B37/24 , C08G18/44 , C08G18/4854 , C08G18/6674 , C08G18/675 , C08G18/69 , C08K5/14 , C08L75/16 , C08L75/14 , C08L2666/26
摘要： A composition for forming a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object, and less scratches of the polished object. The composition includes (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them.
摘要翻译：一种用于形成化学机械抛光垫的组合物，其具有抛光特性如抛光速度高，抛光物体的平坦度优异，并且抛光对象的划痕较少。该组合物包括（A）侧链上具有碳 - 碳双键的聚氨酯和（B）交联剂。聚氨酯（A）优选为通过以满足以下条件（1）和（2）的比例混合至少组分（a11）至（a13）和组分（a2）而得到的热塑性聚氨酯（A'）并使其反应。

40. 发明授权

US07329174B2 Method of manufacturing chemical mechanical polishing pad 有权
标题翻译：化学机械抛光垫的制造方法
公开(公告)号：US07329174B2
公开(公告)日：2008-02-12
申请号：US11521547
申请日：2006-09-15
申请人： Yukio Hosaka , Hiroyuki Tano , Hideki Nishimura , Hiroshi Shiho
发明人： Yukio Hosaka , Hiroyuki Tano , Hideki Nishimura , Hiroshi Shiho
IPC分类号： B24D11/00
CPC分类号： B24D13/147 , B24B19/028 , B24D18/0009
摘要： The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate.The method comprising either one of a group of steps (A) and a group of steps (B), the group of steps (A) including (A1) the step of preparing a composition for forming a chemical mechanical polishing pad; (A2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form; (A3) the step of mounting the pad-like form on the round table of a cutting machine having at least a milling unit equipped with a milling cutter, a drive unit capable of angle indexing and positioning and a round table journaled by the drive unit; (A4) the step of forming the second group of grooves with the milling cutter; and (A5) the step of forming the first group of grooves, and the group of steps (B) including (B1) the step of preparing a composition for forming a chemical mechanical polishing pad; (B2) the step of molding the composition for forming a chemical mechanical polishing pad into a pad-like form having the second group of grooves by using a metal mold having projections corresponding to the shapes of the second group of grooves; and (B3) the step of forming the first group of grooves.
摘要翻译：本发明涉及一种提供化学机械抛光垫的化学机械抛光垫的制造方法，该化学机械抛光垫完全抑制在抛光表面上产生划痕并具有优异的抛光速率。该方法包括一组步骤（A）和一组步骤（B）中的任一个，步骤（A）组包括（A1）制备用于形成化学机械抛光垫的组合物的步骤; （A2）将用于形成化学机械抛光垫的组合物成型为垫状的步骤; （A3）将垫状形状安装在具有至少铣削单元的切割机的圆台上的步骤，所述铣削单元配备有铣刀，能够进行角度分度和定位的驱动单元以及由驱动单元 ; （A4）利用铣刀形成第二组槽的步骤; 和（A5）形成第一组槽的步骤，以及包括（B1）制备用于形成化学机械抛光垫的组合物的步骤的步骤（B）的组; （B2）通过使用具有对应于第二组槽的形状的突起的金属模具将用于形成化学机械抛光垫的组合物模塑成具有第二组槽的垫状形状的步骤; 和（B3）形成第一组槽的步骤。

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