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    • 31. 发明授权
    • Apparatus for thinning a semiconductor film on an insulating film
    • 用于使绝缘膜上的半导体膜变薄的装置
    • US5556503A
    • 1996-09-17
    • US534442
    • 1995-09-27
    • Atsushi Ogura
    • Atsushi Ogura
    • H01L21/306H01L21/02H01L21/20H01L21/304H01L21/3063H01L21/762H01L27/12H01L21/00
    • H01L21/2007H01L21/3063H01L21/76251Y10S438/977
    • In an SOI substrate having a base substrate, an insulating film and a semiconductor active layer, a potential difference is given between the base substrate and an etching solution or among the base substrate, the semiconductor active layer and the etching solution to form a uniform depletion layer on the active layer side from the interface between the insulating film and the active layer. The semiconductor active layer is uniformly thinned down by etching using a solution or by the combination of chemical or electro-chemical surface and etching with the resultant reaction product. In this case, the individual electrodes are provided with seal members to prevent the base substrate electrode and the active layer electrode from contacting the etching solution or the reaction solution due to the etching using the etching solution or the chemical reaction using the reaction solution. According to this invention, therefore, the active layer in, for example, a bonded SOI substrate can be thinned down uniformly at a low cost.
    • 在具有基底衬底,绝缘膜和半导体有源层的SOI衬底中,在基底衬底和蚀刻溶液之间或基底衬底,半导体有源层和蚀刻溶液之间提供电位差以形成均匀的耗尽 在绝缘膜和有源层之间的界面上的有源层侧上的层。 通过使用溶液的蚀刻或通过化学或电化学表面和蚀刻与所得反应产物的组合的蚀刻将半导体活性层均匀地减薄。 在这种情况下,各个电极设置有密封构件,以防止基底电极和有源层电极由于使用蚀刻溶液的蚀刻或使用反应溶液的化学反应而与蚀刻溶液或反应溶液接触。 因此,根据本发明,可以以低成本均匀地减薄例如键合SOI衬底中的有源层。