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31. 发明专利

JPH02238652A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02238652A
公开(公告)日：1990-09-20
申请号：JP5775289
申请日：1989-03-13
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , NISHIMURA ASAO , KITANO MAKOTO , KITABAYASHI CHIKAKO , KAWAI SUEO
IPC分类号： H01L23/34
摘要： PURPOSE:To obtain a good heat-dissipating characteristic to dissipate heat generated at a semiconductor element to the air without damaging a moistureproof property of a semiconductor device, to realize a high integration of the semiconductor element and to realize a high-density mounting operation of the semiconductor device by a method wherein a protruding part is formed at the semiconductor element and its tip face is exposed from a sealing resin. CONSTITUTION:A plurality of leads 3 are extracted to the outside from two directions of a resin-sealed type semiconductor device. A protruding part 9 is formed on a face 1a opposite to a face on which an electrode group 2 of a semiconductor element 1 has been formed; it is sealed with a resin in such a way that a tip face 9a of the protruding part 9 is exposed. Thereby, a creeping route of moisture from this part can be made long; the moisture creeping into the semiconductor device can be reduced; it is possible to prevent an electrode part from being corroded or the like; it is possible to dissipate heat generated at the semiconductor element to the air without damaging a moistureproof property of the semiconductor device; a high integration of the semiconductor element can be realized; a high-density mounting operation can be realized.

32. 发明专利

JPH02138761A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02138761A
公开(公告)日：1990-05-28
申请号：JP17391889
申请日：1989-07-07
申请人： HITACHI LTD
发明人： KITANO MAKOTO , OGURO TAKAHIRO , KAWAI SUEO , SHIMIZU KAZUO , YAMAZAKI KAZUO , NISHIMURA ASAO , MIURA HIDEO , YAGUCHI AKIHIRO
IPC分类号： H01L23/34 , H01L23/367 , H01L23/495
摘要： PURPOSE:To decrease a semiconductor device in thermal resistance by a method wherein a tab on which a semiconductor element is mounted is made to extend outside of a package, and a heat dissipating cap covering the upside of the package is connected to the extension of the tab. CONSTITUTION:A semiconductor element 1 is mounted on a tab 2. A heat dissipating lead 3 is led out from the lateral sides of the tab 2 respectively. The upside of the element 1 and leads 4 are electrically connected with each other through wires 6 respectively. A heat dissipating cap 6 is connected to both the leads 3 led out from the lead-out sides opposed to each other. The element 1 is sealed up with a resin sealing piece 5. By this constitution, heat released from the element 1 is dissipated upward above the package only through the intermediary of metal, so that the package can be improved in thermal resistance.

33. 发明专利

JPH0249460A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0249460A
公开(公告)日：1990-02-19
申请号：JP20062088
申请日：1988-08-11
申请人： HITACHI LTD
发明人： MIURA HIDEO , NISHIMURA ASAO , KITANO MAKOTO , YAGUCHI AKIHIRO , KAWAI SUEO
IPC分类号： H01L23/28 , H01L23/12 , H01L23/50
摘要： PURPOSE:To surely prevent moisture from penetrating into a semiconductor device so as to improve it moisture resistance by a method wherein a conductive material, which is exposed from a sealing resin to be connected to an electrode pad of a semiconductor chip, is selected from materials which are excellent in adhesion to the sealing resin. CONSTITUTION:A passivation film 3 is formed on a primary face of a semiconductor device in which all element of as semiconductor chip 2 is built, and pads 5 arc built on the film 3. The periphery the the chip 2 is coated with e sealing resin 1 in such a manner that only conductive films 4 are exposed. The conductive film 4 is formed of the same material as a conductive film which is formed through a well-known thick film printing method, and the material is strongly bonded to the resin 1. Therefore, the penetration of moisture at an electrode section, which occurs usually to a conventional one, can be prevented. By this setup, the device of this design can be improved in moisture resistance.

34. 发明专利

JPH01237476A INSPECTING METHOD FOR ELECTRONIC COMPONENT, TESTING METHOD THEREFOR AND APPARATUS THEREFOR 失效
公开(公告)号：JPH01237476A
公开(公告)日：1989-09-21
申请号：JP6339088
申请日：1988-03-18
申请人： HITACHI LTD
发明人： NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , YAGUCHI AKIHIRO , KAWAI SUEO
IPC分类号： G01R31/28 , G01R31/30
摘要： PURPOSE:To enable the non-destructive and highly-sensitive detection of impairment of an electronic component caused by water vapor expansion when it is heated, by measuring deformation of the electronic component in the heating process. CONSTITUTION:A probe 13 made of silica glass, which is supported by a guide 12, is erected vertically on the top of an electronic component 10 set on a supporting mount 11. When the electronic component 10 is heated by an infrared heater 14 and deformed thereby, the probe 13 is moved vertically and the displacement of a metal piece 15 fitted to the opposite end part thereof can be measured by a displacement detector 16 of a non-contact type. When a crack occurs inside the electronic component, the deformation increases sharply, and when the crack extends and a route of diffusion of water vapor reaches the outside of the electronic component, the deformation decreases sharply. The sharp increase and decrease of the deformation do not take place in the case that the water vapor is diffused gradually through minute gaps. By checking up the variation behavior thereof, accordingly, the impairment caused in the electronic component can be detected and discrimination of an impairment mode can be implemented.

35. 发明专利

JPH01204459A LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01204459A
公开(公告)日：1989-08-17
申请号：JP2751588
申请日：1988-02-10
申请人： HITACHI LTD
发明人： KAWAI SUEO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , YAGUCHI AKIHIRO , YASUHARA TOSHIHIRO , MURAKAMI HAJIME
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To improve moisture resistance by providing a recess at a part of a short side of a tab, leading out a tab hanging lead from the recess, and providing a step at the lead so that the surface of the lead of the part to be superposed on a semiconductor element is lower than the surface of the tab. CONSTITUTION:A recess 7 is formed on the short side of a tab 2, and a tab hanging lead 3 is extended from the recess 7. Further, a step C is so formed on the surface of the lead 3 that the surface of the lead 3 of the part 11 in which the lead 3 is superposed on a semiconductor element 1 is lower than the that of the tab 2. Sealing resin 6 can be sufficiently filled in a gap between the surface of the lead and the element 1 by providing the step C. Accordingly, since a moisture invasion passage is provided from the root of the lead 3 to the outer end of its package, the invasion passage can be increased in length as compared with a conventional structure. Thus, its moisture resistance is improved.

36. 发明专利

JPS63232361A LEAD FRAME AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63232361A
公开(公告)日：1988-09-28
申请号：JP6381687
申请日：1987-03-20
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , KAWAI SUEO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent the generation of resin crack by heat in case of mounting a semiconductor device on a printed substrate by forming the section of a tab at a tab reverse element placing surface in a shape in which the thickness of the tab is gradually increased from both ends of short axis direction toward the center. CONSTITUTION:A tapered surface 14 is so formed at a reverse element placing surface 2a of a tab 2 that the sectional shape of the tab 2 is gradually increased in thickness from both ends 2e of the tab 2 in a short axis direction toward the center. Since the angle of the end 2e of the tab 2 of this sectional shape in the short axis direction becomes 90 deg. or larger, a stress concentration rate can be reduced. Accordingly, since the thickness of resin is increased to provide a stress reducing effect and it can prevent a local stress concentration, it can prevent the resin from cracking from both ends 2e of the tab 2 in the short axis direction.

37. 发明专利

JP2003194690A IMPACT TEST METHOD, IMPACT TESTING DEVICE AND RELIABILITY EVALUATION METHOD OF SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003194690A
公开(公告)日：2003-07-09
申请号：JP2001395631
申请日：2001-12-27
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , YAMADA MUNEHIRO , FUKUSHIMA SHINJI
IPC分类号： G01N3/303 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To evaluate highly accurately the reliability of a test object by suppressing generation of disturbance of a substrate strain waveform caused by re-collision of a dropping object with a printed wiring board or contact between the dropping object and the printed wiring board, in an impact test for evaluating the reliability of a solder connection part of a semiconductor device mounted with solder onto the printed wiring board, by allowing the dropping object to collide with the printed wiring board. SOLUTION: A structure for preventing re-collision of a dropping probe colliding with the test object is provided. A long cylindrical probe is used as the dropping object, and a mechanism for grasping the probe after collision with the printed wiring board is provided. COPYRIGHT: (C)2003,JPO

38. 发明专利

JP2003133653A WIRING BOARD AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE USING THE SAME 审中-公开
公开(公告)号：JP2003133653A
公开(公告)日：2003-05-09
申请号：JP2001327555
申请日：2001-10-25
申请人： HITACHI LTD
发明人： KAZAMA ATSUSHI , YAGUCHI AKIHIRO
IPC分类号： H05K1/02 , H01L23/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which hardly causes defective bonding of connection terminals of a semiconductor device when the board is subject to bending deformation when it falls and is shocked, and also to realize a mounting structure including the semiconductor device mounted on the wiring board without increasing the size. SOLUTION: In the wiring board 3 to be mounted with a semiconductor device 1 via external terminals, an apparent elastic modulus of a minimum convex hull region 3a including a connection region between all the external terminals connected to one semiconductor device 1 and the wiring board 3 which is a segment cut out from the wiring board 3 is larger than that of the entire wiring board 3. Due to this structure of the wiring board, when the wiring board 3 is subject to bending deformation when it falls and is shocked, bending deformation of the convex hull region 3a is locally made small, resulting in the reduction in stress applied to the external terminals 2 and preventing disconnection between the external terminals 2 and the wiring board 3 or the semiconductor device 1.

39. 发明专利

JP2002318181A DROP IMPACT TEST METHOD AND DROP IMPACT TEST DEVICE 失效
公开(公告)号：JP2002318181A
公开(公告)日：2002-10-31
申请号：JP2001122002
申请日：2001-04-20
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , KAZAMA ATSUSHI , KITANO MAKOTO , KAWABATA TOSHIAKI , IZUMISAWA HIROKI
IPC分类号： G01N3/303
摘要： PROBLEM TO BE SOLVED: To provide a drop impact test method and a drop impact test device to solve a problem that dispersion is caused in breaking occurring height and breaking occurring longevity caused by lack of stability of an attitude at the time of dropping in a drop impact test of a printed wiring board mounted in a portable telephone and a semiconductor device. SOLUTION: The drop impact test is carried out under the method to simultaneously drop a test sample and an attitude control member existing above the test sample and dropping with the test sample. Consequently, it is possible to keep the attitude of the test sample stable until immediately before colliding against a floor surface as the test sample drops simultaneously with the attitude control member, and consequently, it is possible to reduce dispersion of a test result.

40. 发明专利

JP2002083923A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR MODULE PACKAGING THE SAME 失效
公开(公告)号：JP2002083923A
公开(公告)日：2002-03-22
申请号：JP2000269748
申请日：2000-09-06
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , MIURA HIDEO , KAZAMA ATSUSHI
IPC分类号： H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a small and thin semiconductor integrated circuit device made of laminated semiconductor integrated circuit chip improving reliability of a solder joint and a semiconductor module packaging the same. SOLUTION: A plurality of the semiconductor integrated circuit chips are stacked upward in descending order of the chip size, balls or bumps are arranged on the top of the main surface of the most upper semiconductor integrated circuit chip, and the semiconductor integrated circuit chip is resin sealed in the size regulated by the chip size of the lowest semiconductor integrated circuit chip with its balls and bumps exposed.

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