专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JPH11347785A SOLDER FOR DIE-BONDING SEMI-CONDUCTOR, ITS TAPE AND SEMI-CONDUCTOR DEVICE 失效
公开(公告)号：JPH11347785A
公开(公告)日：1999-12-21
申请号：JP15558398
申请日：1998-06-04
申请人： HITACHI LTD
发明人： ITO KAZUTOSHI , OHASHI TAKEYA , HATORI KAZUO
IPC分类号： B23K35/26 , B23K35/40 , H01L21/52 , H01L23/28 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a solder by which the thickness of the solder to die-bond a semi-conductor element to a heat radiation substrate is made to be a specified value by providing the solder containing Sn, Ag, Cu and P of the specified weight ratio and the balance Pb of the specified weight ratio. SOLUTION: A solder has the composition consisting of, by weight, 2.5-10% Sn, 0.5-5% Ag, 0.1-1% Cu, 0.005-0.5% P, and the balance >=80%Pb. A Ni-Sn or Cu-Sn intermetallic compound is preferably dispersed in the solder. An aluminum wire lead 7 is bonded to a semi-conductor 4' while the semi-conductor element 4 is welded to a lead frame 1 high in heat conductivity with a solder 2, and mold-packaged with an epoxy resin 5. The lead frame 1 forming a heated substrate is formed of a Cu alloy with Ni-plating thereon. The Cu-Sn or Ni-Sn intermetallic compound particles are interposed between the lead frame 1 and the semi-conductor element 4 to absorb the heat fatigue by blending at least one of Cu and Ni to the solder 2.

32. 发明专利

JPH088278A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH088278A
公开(公告)日：1996-01-12
申请号：JP16064394
申请日：1994-06-20
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： TAKAHASHI YASUSHI , HIGUCHI AKIRA , NAKAJO TAKUYA , DANNO TADATOSHI , TOGAWA MITSUO , HATORI KAZUO , ARAI KATSUO , TAKAHASHI KAZUYA
IPC分类号： H01L21/60 , H01L21/301 , H01L21/56 , H01L23/12
摘要： PURPOSE:To connect a lead to each pellet precisely without any deviation in position and eliminate a pellet bonding work by conducting a lead connecting work and a resin sealing work for a pellet-coupled body. CONSTITUTION:A pellet-coupled body 13 is cut out from a wafer on which a plurality of pellets 14 are formed lengthwise and breadthwise and then leads 26 of a carrier tape 23 are connected to the pellets 14 respectively by an inner bonding method of TAB. Nextly, lead connections 17 on the pellet-linked body 13 are resin-sealed. After that, electric characteristics are tested for each pellet and then the pellets are divided into individual ones and then are separated from the carrier tape 23. By this method, connection work of the lead 26 to each pellet can be conducted precisely without any deviation in position. In addition, since a lead connection work and a resin sealing work are done for the pellet-linked body 13, the manufacturing efficiency is remarkably increased compared with the case wherein these works are done pellet by pellet.

33. 发明专利

JPH05152497A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05152497A
公开(公告)日：1993-06-18
申请号：JP31041291
申请日：1991-11-26
申请人： HITACHI LTD
发明人： TAKAHASHI TOSHIHARU , ARAI KATSUO , HATORI KAZUO , YAMAZAKI KAZUO , ENOMOTO USUKE , OBA TAKASHI
IPC分类号： H01L23/50 , H01L27/00 , H01L31/12
摘要： PURPOSE:To increase a circuit operation speed (A), reduce the size (B), enhance package density (C), prevent deformation and damage of leads (D) and eliminate failure caused during packaging time (E) of a semiconductor device. CONSTITUTION:In a semiconductor device 1, an input/output conversion circuit is installed between an electric circuit 22 loaded on a semiconductor pellet 2 and a signal transmission path in a sealing member where the I/O conversion circuit is designed to convert an electric signal into an optical signal or convert the optical signal into the electric signal, thereby constituting an input/output signal conversion circuit 21. This input/output signal conversion circuit 21 is adapted to be coupled with one end while the other side extends into a sealing member 3 and, what is more, it constitutes an optical signal transmission path 31 exposed to the surface of the sealing member 3.

34. 发明专利

JPH03242948A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH03242948A
公开(公告)日：1991-10-29
申请号：JP4068090
申请日：1990-02-21
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： TAKAHASHI TOSHIHARU , NAGAMINE TORU , TANBA TSUTOMU , MUTO AKIRA , SHINTANI TOSHIYUKI , HOSHI AKIRO , YAMADA TOMIO , HATORI KAZUO
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To promote fabrication of finer chip without using wire bonding technique by joining each communicating wiring of a film to each electrode pad of a semiconductor pellet and the inner part of each lead, respectively, so that they are communicated electrically. CONSTITUTION:An IC 10 having a resin sealing small outline package is provided with a semiconductor pellet 21 wherein an electronic circuit is built, a plurality of leads 7 to lead out the electronic circuit outside electrically and a package 8 to resin-seal an inner part 7a of each lead 7 and a semiconductor pellet 21. A film 18 wherein a plurality of communicating wirings 15 are formed is provided to the inside of the package 8. Each communicating wiring 15 of the film 18 is joined to each electrode pad 23 of the semiconductor pellet 21 and the inner part 7a of each lead 7, respectively, to communicate them electrically. Thereby, it is possible to omit use of wire bonding technique and to make fine a communicating wiring.

35. 发明专利

JPH0282541A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0282541A
公开(公告)日：1990-03-23
申请号：JP23421888
申请日：1988-09-19
申请人： HITACHI LTD
发明人： HATORI KAZUO , ARAKI ISAO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To enable bonding of wire material with good bondability to an inner section of a lead consisting of copper material even at a low temperature which can avoid fusion of a solder coating by using an aluminum material as a material to form a wire. CONSTITUTION:A silicon semiconductor pellet 12, a plurality of leads 9 arranged around the pellet, a wire 13 whose both ends are bonded to each bonding and 12a of the pellet and an inner section 9a of each lead 9 for bridging, and a package 14 for resin sealing are provided. A group of leads 9 are formed by using a copper material and a wire 13 is formed by using an aluminum material. One end of the wire is bonded to an electrode of the pellet through ball bonding. The other end is bonded to a base material surface which consists of copper material in an inner section of each lead.

36. 发明专利

JPS63293929A WIRE BONDING EQUIPMENT 失效
公开(公告)号：JPS63293929A
公开(公告)日：1988-11-30
申请号：JP12824587
申请日：1987-05-27
申请人： HITACHI LTD
发明人： NAKAJIMA MAKOTO , CHUMA TOSHIO , OHASHI YOSHIO , HATORI KAZUO , ARAKI ISAO , KOIZUMI MASAHIRO , ONUKI HITOSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To obtain excellent bondability and safety of working, by supplying a mixed gas containing less than 4% hydrogen, around an object to be processed. CONSTITUTION:During a process of bonding, a reducing gas 22 to protect a lead frame from oxidizing is always gushed out from a spurting vent 24 arranged on the upper surface of a feeder 6. As the reducing gas atmosphere is closed by a cover 27 arranged on the feeder 6, the reducing gas 22 effectively surrounds a lead frame 3 and a pellet 2, and the oxidation of the lead frame 3 and the like are surely prevented. The gas 22 to protect a lead frame from oxidizing is so controlled that the content of hydrogen is less than 4%, and therefore, hydrogen in the gas 22 is prevented from burning. Consequently, the bondability is stably maintained. Further, the content of hydrogen contained in a ball forming gas may be less than 3%.

37. 发明专利

JPS63199436A ELECTRONIC DEVICE 失效
公开(公告)号：JPS63199436A
公开(公告)日：1988-08-17
申请号：JP3145487
申请日：1987-02-16
申请人： HITACHI LTD
发明人： TSURUMARU KAZUHIRO , ARAKI ISAO , HATORI KAZUO
IPC分类号： H01L21/60
摘要： PURPOSE:To improve bondability and the reliability of a bonding connecting section even when a copper wire is used by forming the surface of at least a bonding pad in an electrical wiring for a pellet by employing the same material as the copper group bonding wire. CONSTITUTION:The surface of at least a bonding pad 16 in an electrical wiring 10 for a pellet 8 is shaped by a copper group material, and a wire 17 consisting of the copper group material is bonded onto the surface of the bonding pad 16. The electrical wiring 10 with a lower layer wiring 11 and an upper layer wiring 13 is formed to the upper layer section of the pellet 8, into which an integrated circuit 9 is assembled, through an under-cloth wiring method through an inter-layer insulating film 13, and the wiring 10 is shaped through an evaporation method, etc. by employing the copper group material wholly. One ends of the bonding wires 17 composed of the copper group material are each bonded onto the bonding pad 16 made up of the copper group material in the pellet 8, and the other ends of the wires 17 are each bonded onto a section 5a to be bonded for an inner lead 5.

38. 发明专利

JPS62276840A BONDING APPARATUS 失效
公开(公告)号：JPS62276840A
公开(公告)日：1987-12-01
申请号：JP11922786
申请日：1986-05-26
申请人： HITACHI LTD
发明人： NAKAJIMA MAKOTO , CHUMA TOSHIO , OHASHI YOSHIO , HATORI KAZUO
IPC分类号： H01L21/60
摘要： PURPOSE:To avoid oxidization of an object to be bonded by a method wherein the object to be bonded is covered by a fixed cover and gas is supplied to the inside of the fixed cover. CONSTITUTION:If a group of lead frames 3 which are arranged in one row along the before-and-behind direction is aligned in the hollow part of a lead frame pressing member 20, a multi-lead frame 3A is stopped intermittently. Then, if the lead frame pressing member 20 is descended to press the outer circumferential parts of the respective groups of the lead frames 3, as reductive gas is being spouted out from a group of spouting outlets 23, the lead frames 3 are exposed in a reductive gas atmosphere. At that time, as the reductive gas atmosphere is covered by a fixed cover 18 and a movable cover 24, the atmosphere can be formed efficiently. It is to be noted that, although the small window 27 of the movable cover 24 is aligned directly above the lead frame 3 to be bonded first and opened, as the opening area is small, the leakage of the gas through the small window can be minimized.

39. 发明专利

JPS62188330A BONDING DEVICE 失效
公开(公告)号：JPS62188330A
公开(公告)日：1987-08-17
申请号：JP2882186
申请日：1986-02-14
申请人： HITACHI LTD
发明人： NAKAJIMA MAKOTO , CHUMA TOSHIO , HATORI KAZUO
IPC分类号： H01L21/60
摘要： PURPOSE:To ensure the fixation of a lead frame and thereby to enable the appropriate bonding thereof, by constructing a lower-side pressing member so that it comes into contact with an outer peripheral edge portion in a tab of a lead frame in such a manner that it presses said portion to absorb or correct the deformation of the tab. CONSTITUTION:A lead frame 1 wherein a pellet 6 is bonded on a tab 2 is supplied onto a lower-side pressing member 12 fitted to a heat block 11. An upper- side pressing member 17 presses down the outer peripheral edge portion of the tab 2 and the lower stage portion of a tab-suspending lead 3, and therefore such deformation as warp of the lead frame 1 is prevented. Moreover, it holds the tab 2 directly in cooperation with the lower-side pressing member 12, and therefore the lead frame 1 can be fixed without fail. As the result, it is prevented that the lead frame 1 moves freely in the course of bonding, that heating by the heat block 11 becomes non-uniform and that the energy of ultrasonic vibrations is propagated inappropriately, and therefore the bonding is performed very appropriately.

40. 发明专利

JPS5919364A Manufacture of semiconductor device and lead frame using in manufacture thereof 失效
标题翻译：半导体器件制造及其制造中使用的引线框架
公开(公告)号：JPS5919364A
公开(公告)日：1984-01-31
申请号：JP12754682
申请日：1982-07-23
申请人： Hitachi Ltd
发明人： ENOMOTO USUKE , HATORI KAZUO
IPC分类号： H01L23/48 , H01L23/28 , H01L23/495
CPC分类号： H01L23/49582 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/83439 , H01L2224/85439 , H01L2924/01078 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To reduce the number of steps of and the cost of a semiconductor device by forming a solder layer which has a lower layer of lead and an upper layer of tin on the surface of the lead part which is projected from a resin package of a lead frame before mounting an element. CONSTITUTION:A silver plating film 6 is covered on an element mount 4 of a lead frame having a lead 1, a frame piece 2, a dam piece 3, and a wire connecting part 5, and a solder forming layer which has a lower layer 7 of lead and an upper layer 8 of tin is formed on the lead part from the piece 3 to the piece 2. Then, an element 10 is secured to the mount 4, and the electrode of the element 10 and the end of the lead 1 at both sides are connected by wirings 11. Subsequently, a resin package is covered on the part disposed with the mount 4, the connecting part 5, the element 10 and the wirings 11, and the pieces 3, 2 are cut and removed.
摘要翻译：目的：通过在引线部分的表面上形成具有较低的引线层和锡的上层的焊料层来减少半导体器件的步骤和成本的数量，该焊料层从树脂封装引导框架安装元件之前。构成：将银镀膜6覆盖在具有引线1，框架件2，阻挡件3和电线连接部件5的引线框架的元件安装件4和具有下层的焊料形成层 7的引线和锡的上层8形成在引线部分上，从片3到片2.然后，元件10固定到安装件4上，元件10的电极和引线的末端两个侧面的连接件1通过布线11连接。随后，在安装有安装件4，连接部件5，元件10和布线11的部件上覆盖树脂封装件，并且切割和拆下片断部件2,3。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式