专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JPS54151519A PARTIAL PLATING 失效
公开(公告)号：JPS54151519A
公开(公告)日：1979-11-28
申请号：JP5736978
申请日：1978-05-15
申请人： HITACHI CABLE
发明人： ONDA MAMORU , YAMAGISHI RIYOUZOU , SUGIYAMA MITSUHIKO
IPC分类号： B05B15/04 , C23C2/02 , C25D5/02
摘要： PURPOSE:To enhance partial plating dimensional accuracy, masking tape is slitted in a desired width prior to or after it is bonded to a strip to be plated, and the slitted tape is removed in the portion to be plated. CONSTITUTION:Copper strip 1 fed from roller 8 advances through degreaser 9, water washer 10, dryer 11, and comes between pressing roller 18 and bond press roller 6. At the same time, masking tape 3 is slitted in a given width and fed between the pressing roller 18 and bond press roller 6 so that slitted masking tape 3 is bonded to the copper strip 1. The masking tape portion corresponding to plating is wound by roller 15'. The masked copper strip 1 passes through pickling solution 12, water washer 10, plating bath 13, water washer 10, Ag plating bath 14, water washer 10, and dryer 11, and partial plated copper strip is wound by roller 17, while masking tape is wound by roller 15. The masking tape slitting may be performed after it is bonded to the copper plate.

32. 发明专利

JPS5411880A IRON ELECTROLYSIS SYSTEM 失效
公开(公告)号：JPS5411880A
公开(公告)日：1979-01-29
申请号：JP7734777
申请日：1977-06-29
申请人： HITACHI CABLE
发明人： YAMAGISHI RIYOUZOU , ONDA MAMORU , MAENO TOKUKI
IPC分类号： C23F11/18 , C23F11/00 , C25B15/08
摘要： PURPOSE:To provide the subject system wherein seawater is supplied to an electrolytic cell from the upper part thereof to carry out iron electrolysis while causing seawater to flow in the direction of gravity, whereby accumulation of collodial particles of iron hydroxide, iron rusts and the like in the electrolytic cell and pipeline is prevented to reduce the flow amount of seawater and to miniaturize the facilitates and to reduce the cost.

33. 发明专利

JPS52128843A METHOD OF FABRICATING NICKEL PLATED LEAD WIRE 失效
公开(公告)号：JPS52128843A
公开(公告)日：1977-10-28
申请号：JP4625076
申请日：1976-04-22
申请人： HITACHI CABLE
发明人： YAMAGISHI RIYOUZOU , SUGIYAMA MITSUHIKO , YOSHIOKA OSAMU
IPC分类号： C25D5/24 , C25D3/12 , C25D5/14 , C25D7/06

34. 发明专利

JPS5257086A ELECTROLYTIC APPARATUS OF BRINE 失效
公开(公告)号：JPS5257086A
公开(公告)日：1977-05-11
申请号：JP13273775
申请日：1975-11-05
申请人： HITACHI CABLE
发明人： ONDA MAMORU , YAMAGISHI RIYOUZOU , MAENO TOKUKI
IPC分类号： C25B9/00 , C25B1/34 , C25B9/06
摘要： PURPOSE:To maintain screening effect of leak electric current, utiizing the anode inactive phenomena of base metal, by exposing base material only at both anode side tip surface end of Ti electric plate, at the plural pole electrolytic apparatus of producing NaClO, electrolyzing sea water of NaCl solution.

35. 发明专利

JPS59219808A DISCOLOR RESISTANT SOLDERING WIRE 失效
公开(公告)号：JPS59219808A
公开(公告)日：1984-12-11
申请号：JP9428383
申请日：1983-05-27
申请人： HITACHI CABLE
发明人： YOSHIOKA OSAMU , YAMAGISHI RIYOUZOU , KOIZUMI TOYOHARU , NAGAYAMA SADAO , KOMATSU KATSUJI , WATANABE MASARU , KUROSU YOSHIMITSU
IPC分类号： H01B5/02 , B23K35/00 , B23K35/14

36. 发明专利

JPS5935497A Copper-lined laminated board 失效
公开(公告)号：JPS5935497A
公开(公告)日：1984-02-27
申请号：JP14649582
申请日：1982-08-24
申请人： Hitachi Cable
发明人： YAMAGISHI RIYOUZOU , KIYOMIYA SHINICHIROU , WATANABE SHIGETAKA
IPC分类号： H05K1/05 , B32B15/08 , H05K1/03

37. 发明专利

JPS57185968A CONTROLLING METHOD FOR PLATING THICKNESS IN ELECTROLESS PLATING 失效
公开(公告)号：JPS57185968A
公开(公告)日：1982-11-16
申请号：JP6991581
申请日：1981-05-09
申请人： HITACHI CABLE
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU , ISHIKAWA TETSUO
IPC分类号： C23C18/16 , C23C18/31 , C23C18/40
摘要： PURPOSE:To determine and control the plating thickness of a substrate to be plated in accordance with the electric resistance value of a fine wire for monitoring an insulator in the stage of electroless plating by immersing said fine wire together with the substrate into a plating soln. and measuring the electric resistance of the wire with time. CONSTITUTION:A monitor fixing jig 3 which is fixed with a monitoring wire 1 for measuring resistance value is immersed in a plating cell 8 contg. an electroless plating soln. 4 and is connected to a resistance measuring device 9 by means of lead wires 2a, 2b. The wire 1 is made of an acid resistant and alkali resistant electric insulating material of ethylene fluoride, PE or the like. At the same time, a substrate is immersed in the soln. 4 and is subjected to electroless plating. The change in the electric resistance value occuring in the formation of a plating layer on the surface of the wire 1 is measured with the device 9 and the thickness of the plating layer is determined from the measured value, whereby the thickness of the plating layer of the substrate surface is controlled. When the desired thickness is attained, the substrate is taken up from the plating soln.

38. 发明专利

JPS5757886A Heat resistant silver coated conductor 失效
标题翻译：耐热镀银导体
公开(公告)号：JPS5757886A
公开(公告)日：1982-04-07
申请号：JP13272780
申请日：1980-09-24
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU
IPC分类号： C25D5/10
摘要： PURPOSE: To obtain an inexpensive Ag coated conductor enhancing the adhesion of the Ag coated layer after head deterioration in an oxidizing atmosphere and enabling the reduction of the layer in thickness by forming a Co layer having a prescribed thickness as an under coat metallic layer on a Cu or Cu alloy substrate and coating the Co layer with Ag.
CONSTITUTION: On a Cu or Cu alloy substrate an under coat metallic layer of Co having 0.2W4, especially about 1μm thickness is formed, and the layer is coated with an Ag layer to obtain the desired heat resistant Ag coated conductor. The Ag coated layer may be converted into an Ag alloy layer by adding ≥1 kind of metallic element having an effect of controlling the oxygen permeability of ag, e.g., Sb, Se, Sn, Zn, Ni or Cu. The Ag coated conductor is suitable for use as a lead frame matetrial for electronic parts, especially a semiconductor circuit element.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：为了获得廉价的Ag涂层导体，增强氧化气氛中的头部退化后的Ag涂层的粘附性，并且能够通过在具有规定厚度的Co层作为下涂层金属层上形成厚度来降低厚度层 Cu或Cu合金基体，并用Ag涂覆Co层。构成：在Cu或Cu合金基材上，形成具有0.2-4，特别是约1μm厚度的Co的底涂层金属层，并且该层涂覆有Ag层以获得所需的耐热Ag涂层导体。通过添加具有控制Ag的氧气渗透性的作用的SbCl，Se，Sn，Zn，Ni或Cu，可以添加> = 1种具有氧气渗透性的金属元素，从而将Ag涂层转变为Ag合金层。 Ag涂层导体适用于电子部件，特别是半导体电路元件的引线框架材料。

39. 发明专利

JPS5635791A PARTIAL PLATING METHOD 失效
公开(公告)号：JPS5635791A
公开(公告)日：1981-04-08
申请号：JP11011379
申请日：1979-08-29
申请人： HITACHI CABLE
发明人： ONDA MAMORU , YAMAGISHI RIYOUZOU
IPC分类号： C09J7/02 , C09J7/00 , C25D5/02
摘要： PURPOSE:To improve partial plating method, by heating either a masking tape, formed by laminating a resin which easily softens and welds by heat and a resin which is relatively heat resistant, or a material to be plated before the laminated tape is sticked on the material to be plated. CONSTITUTION:In partial plating of a material to be plated with a masking tape sticked on the material, a tape made by laminating a resin, which is easily softens and welds by heat, e.g., polyethylene, nylon etc., and a resin, which is relatively heat resistant, e.g., polyester, polyvinyl chloride, is used. Just before said laminated tape is sticked on the material to be plated, at least either the laminated tape or the material to be plated is heated, then the tape is sticked on the material. Hereby adherence of bonding agent at the end surface of metallic rod, or failure in bonding due to the inclusion of air bubbles is prevented.

40. 发明专利

JPS5538918A INSIDE SURFACE PLATING METHOD OF ZIRCALLOY PIPE 失效
公开(公告)号：JPS5538918A
公开(公告)日：1980-03-18
申请号：JP10937178
申请日：1978-09-06
申请人： HITACHI CABLE
发明人： YOSHIOKA OSAMU , ISHIKAWA TETSUO , YAMAGISHI RIYOUZOU
IPC分类号： C25D5/38 , C25D5/34 , C25D7/04
摘要： PURPOSE:To eveny activate the inside surface of the pipe and enable plating to be evenly performed by using NH4HF2, N2SiF6 and NH4F as pickling solution and connecting the pipes of the same quality as the abovementioned pipe to both ends of the pipe then performing pickling activation treatment in pretreating of the inside surface plating of the zicalloy pipe. CONSTITUTION:In pretreatment of the inside surface plating of a zircalloy pipe 1 for atomic fuel covering the metal pipes 2, 2 composed of the zircalloy pipes of the same kind as that of the pipe 1 are connected respectively to both ends of the pipe 1 and the outside surfaces thereof are covered with plastic pipes 6, 3. Next, the pickling solution is circulated in the pipes 2 and 1 through the plastic pipe 3 by a circulating pump 4 from a vessel 5 which contains one or more kinds of NH4HF2, H2SiF6, NH4F, HF or HBF4 as the pickling solution, whereby the inside surface of the zicalloy pipe 1 is activated. This method enables the entire inside surface of the plated zircalloy pipe to be subjected to pickling activation treatment owing to the presence of the metal pipes 2, 2.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式