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    • 32. 发明申请
    • Method of fabricating non-volatile flash memory device having at least two different channel concentrations
    • 制造具有至少两个不同通道浓度的非易失性闪速存储器件的方法
    • US20080108197A1
    • 2008-05-08
    • US12007097
    • 2008-01-07
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L21/334
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 33. 发明授权
    • Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    • 具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法
    • US07320920B2
    • 2008-01-22
    • US11097281
    • 2005-04-04
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L21/334
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 34. 发明申请
    • Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    • 具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法
    • US20060011965A1
    • 2006-01-19
    • US11097281
    • 2005-04-04
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L29/76
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 39. 发明授权
    • Non-adhesive sputtering structure including a sputtering target and backing plate
    • 包括溅射靶和背板的非粘性溅射结构
    • US09194035B2
    • 2015-11-24
    • US13537867
    • 2012-06-29
    • Kyung Il ParkKeun-Ik JeonSang-Su KimYoun-Yong Lee
    • Kyung Il ParkKeun-Ik JeonSang-Su KimYoun-Yong Lee
    • C23C14/24C23C14/34H01J37/32H01J37/34
    • C23C14/3407H01J37/32522H01J37/3435H01J37/3497Y10T29/49947
    • A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    • 非粘合溅射结构包括具有板形的溅射靶; 以及具有板形的背板。 背板面对溅射靶,并且溅射靶和背板的相对表面彼此接触。 背板包括具有纵向轴线的主体; 以及冷却构件,冷却材料通过所述冷却构件沿主体的纵向方向基本上平行于纵向轴线流动。 冷却材料将溅射靶产生的热从溅射传导到背板外部。 非粘合性溅射结构还包括多个不粘合的紧固构件,其保持背板和溅射靶的相对表面彼此接触。 非粘合的紧固构件延伸穿过背板的厚度并且对应于除了冷却构件之外的背板的区域。