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31. 发明申请

WO2007102998A3 STACKED GUARD STRUCTURES 审中-公开
标题翻译：堆叠式防护结构
公开(公告)号：WO2007102998A3
公开(公告)日：2008-04-10
申请号：PCT/US2007004668
申请日：2007-02-22
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R31/2889 , H05K1/0216 , H05K1/0298 , H05K2201/093 , H05K2201/09663 , H05K2201/09672
摘要： Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.
摘要翻译：公开了一种用于提供具有嵌入堆叠中的保护平面的堆叠的系统和方法。可以通过形成包括导电信号结构，电保护结构和布置在信号结构和保护结构之间的电绝缘结构的堆叠来制造电气设备。信号结构，绝缘结构和防护结构可以在堆叠中彼此对准。

32. 发明申请

WO2007002249A3 METHOD AND APPARATUS FOR ADJUSTING A MULTI-SUBSTRATE PROBE STRUCTURE 审中-公开
标题翻译：用于调节多基片探测器结构的方法和设备
公开(公告)号：WO2007002249A3
公开(公告)日：2007-11-22
申请号：PCT/US2006024238
申请日：2006-06-21
申请人： FORMFACTOR INC , HOBBS ERIC D , ELDRIDGE BENJAMIN N , MA LUNYU , MATHIEU GAETAN L , MURPHY STEVEN T , SHINDE MAKARAND S , SLOCUM ALEXANDER H
发明人： HOBBS ERIC D , ELDRIDGE BENJAMIN N , MA LUNYU , MATHIEU GAETAN L , MURPHY STEVEN T , SHINDE MAKARAND S , SLOCUM ALEXANDER H
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R1/073 , G01R31/31905 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49147 , Y10T29/49208 , Y10T29/49222
摘要： A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an "x," "y," and/or "z" direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.
摘要翻译：探针卡组件包括连接到安装组件的多个探针基底。每个探针基底包括一组探针，并且一起，每个探针基底上的探针组构成用于接触待测试装置的探针阵列。调节机构被配置为向每个探针基底施加力以相对于安装组件单独地移动每个基底。调整机构可以沿“x”，“y”和/或“z”方向平移每个探针基板，并且可以围绕任何一个或多个前述方向进一步旋转每个探针基板。调整机构可以进一步改变一个或多个探针基板的形状。因此探针可以相对于待测试设备上的触点对齐和/或平坦化。

33. 发明申请

WO2006047349A3 ELECTROFORM SPRING BUILT ON MANDREL TRANSFERABLE TO OTHER SURFACE 审中-公开
标题翻译：电动弹簧建在可转移到其他表面的人造丝上
公开(公告)号：WO2006047349A3
公开(公告)日：2007-02-22
申请号：PCT/US2005038063
申请日：2005-10-21
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , MATHIEU GAETAN L
IPC分类号： H01R43/16
CPC分类号： C25D1/10 , C23C18/1657 , C23C18/31 , C25D1/20 , G01R1/06711 , G01R1/06727 , G01R1/07342 , G01R3/00 , H05K3/32 , H05K3/321 , H05K3/326 , H05K3/341 , H05K3/4015 , H05K3/4092 , H05K3/42 , H05K2203/0726 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/53378
摘要： Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive, or solder either before or after releasing the spring contact from the mandrel.
摘要翻译：通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。

34. 发明申请

WO2006068939A3 REMOTE TEST FACILITY WITH WIRELESS INTERFACE TO LOCAL TEST FACILITIES 审中-公开
标题翻译：远程测试设施与无线接口到本地测试设备
公开(公告)号：WO2006068939A3
公开(公告)日：2006-12-28
申请号：PCT/US2005045611
申请日：2005-12-15
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R31/2884 , G01R31/3025 , G01R31/31907
摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
摘要翻译：中央测试设备将无线测试数据传输到本地测试设备，该设备使用测试数据测试电子设备。本地测试设施将由电子设备生成的无线响应数据发送回中央测试设施，中央测试设施分析响应数据以确定哪些电子设备通过了测试。中央测试设施可以将测试结果提供给其他实体，例如设计电子设备的设计设施或制造电子设备的制造设施。中央测试设施可以接受来自多个本地测试设施中的任何一个的测试资源的请求，调度对应于每个测试请求的测试时间，并且在预定的测试时间，将测试数据无线传输到相应的本地测试设施。

35. 发明申请

WO2006002046A3 MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING 审中-公开
标题翻译：用于IC探测的机械可重构垂直测试界面
公开(公告)号：WO2006002046A3
公开(公告)日：2006-05-18
申请号：PCT/US2005020949
申请日：2005-06-15
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , VASQUEZ BARBARA , SHINDE MAKARAND S , MATHIEU GAETAN L , SPORCK NICHOLAS A
发明人： ELDRIDGE BENJAMIN N , VASQUEZ BARBARA , SHINDE MAKARAND S , MATHIEU GAETAN L , SPORCK NICHOLAS A
IPC分类号： H01R11/18 , G01R1/04 , G01R1/073 , G01R31/28
CPC分类号： G01R31/2889 , G01R1/0416 , G01R1/07307
摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.
摘要翻译：晶片测试组件包括多个探针头基板，其布置为像瓷砖一样的连接器和支撑在相对侧的探针。在一个实施例中，柔性电缆连接器直接将探头磁贴上的连接器连接到测试头，而在另一实施例中，柔性电缆将探头磁头连接到提供水平布线到测试头连接器的PCB。在一个实施例中，调平销提供了简化的支撑结构，该支撑结构连接到附接到瓷砖的保持元件以提供施加推拉调平力。测试头连接器接口框架可重新布置测试头和探针卡之间的连接器，以提供全晶片接触或部分晶片接触。测试头连接器通过可滑动的轨道进行重新布置，或者可插拔和不可插拔，从而可在一系列位置上移动。

36. 发明申请

WO02064496A3 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE 审中-公开
标题翻译：在基板上形成微电子弹簧结构的方法
公开(公告)号：WO02064496A3
公开(公告)日：2003-08-14
申请号：PCT/US0203938
申请日：2002-02-06
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , WENZEL STUART W
发明人： ELDRIDGE BENJAMIN N , WENZEL STUART W
IPC分类号： B81C1/00 , B81B3/00 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01H11/04 , H01L21/768 , H01L23/48 , H01L23/482 , H01R13/24 , H05K3/40 , H05K7/10
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
摘要翻译：在衬底上形成牺牲材料层。然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。如果需要，则牺牲层被固化或硬化。弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。在替代方法的初始步骤中，在衬底上提供一层材料。然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。流体被固化或硬化以稳定弯液面的轮廓形状。然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

37. 发明申请

WO9900844A3 SOCKETS FOR SEMICONDUCTOR DEVICES WITH SPRING CONTACT ELEMENTS 审中-公开
标题翻译：具有弹簧触点元件的半导体器件插座
公开(公告)号：WO9900844A3
公开(公告)日：1999-04-29
申请号：PCT/US9813692
申请日：1998-06-30
申请人： FORMFACTOR INC , DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
发明人： DOZIER THOMAS H II , ELDRIDGE BENJAMIN N , GRUBE GARY W , KHANDROS IGOR Y , MATHIEU GAETAN L , PEDERSEN DAVID V , STADT MICHAEL A
IPC分类号： G01R1/04 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/538 , H05K3/30 , H05K3/32
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
摘要翻译：通过迫使电子元件，因此弹簧接触元件的端部竖直地抵靠互连基板的端子，或者通过水平地推动互连基板的端子来形成从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接抵靠弹簧接触元件的端部。公开了各种终端配置。

38. 发明申请

WO2006026733A3 A METHOD OF DESIGNING A PROBE CARD APPARATUS WITH DESIRED COMPLIANCE CHARACTERISTICS 审中-公开
标题翻译：一种设计具有期望符合特性的探针卡设备的方法
公开(公告)号：WO2006026733A3
公开(公告)日：2006-10-26
申请号：PCT/US2005031242
申请日：2005-08-31
申请人： FORMACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/07364 , G01R1/07378 , G01R3/00 , Y10T29/49117
摘要： A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.
摘要翻译：探针卡装置被配置为具有期望的整体柔量。确定探针卡装置的探针的顺从性，并且将额外的预定量顺从性设计到探针卡装置中，使得探针的附加顺应性和顺应性的总和总体上符合探针卡装置。

39. 发明专利

JP2007201471A Method of testing semiconductor product die, and assembly including test die for its test 审中-公开
标题翻译：测试半导体产品的方法和包括测试测试的组件
公开(公告)号：JP2007201471A
公开(公告)日：2007-08-09
申请号：JP2007013166
申请日：2007-01-23
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , PEDERSEN DAVID V , WHITTEN RALPH G
IPC分类号： G01R1/06 , H01L21/66 , G01R1/073 , G01R31/28 , G01R31/3183 , H01L21/822 , H01L23/544 , H01L27/04
CPC分类号： H01L22/34 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a design and a test method that break a linear relationship between a fault detection range or testability and costs of testing or producing a design. SOLUTION: A test assembly 2000 is designed for testing product circuitry of a product die 2011. In one embodiment, the test assembly comprises a test die 2010 and an interconnection substrate 2008 for electrically connecting the test die to a host controller 2002. The test die can be designed according to a design methodology for a test die and a product die that includes a step of concurrently designing test circuitry and product circuitry in a unified design. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供破坏故障检测范围或可测试性与测试或生产设计成本之间的线性关系的设计和测试方法。解决方案：测试组件2000被设计用于测试产品模具2011的产品电路。在一个实施例中，测试组件包括测试模具2010和用于将测试模具电连接到主机控制器2002的互连衬底2008。测试模具可以根据用于测试模具和产品模具的设计方法进行设计，其包括在统一设计中同时设计测试电路和产品电路的步骤。版权所有（C）2007，JPO＆INPIT

40. 发明专利

JP2007132950A Probe card assembly and kit, and method using them 有权
标题翻译：探针卡组件和套件，以及使用它们的方法
公开(公告)号：JP2007132950A
公开(公告)日：2007-05-31
申请号：JP2007000149
申请日：2007-01-04
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R1/073 , B23K1/00 , B23K20/00 , B23K31/02 , C23C18/16 , C25D5/08 , C25D5/16 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/06 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L21/607 , H01L21/66 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R9/00 , H01R12/71 , H01R13/05 , H01R13/24 , H01R29/00 , H01R33/74 , H01R33/76 , H01R107/00 , H05H1/18 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： PROBLEM TO BE SOLVED: To provide a technique for applying a probe to a semiconductor element capable of an orientation of an edge of a probe element, without altering a position of a probe card. SOLUTION: The probe card assembly comprises an upper surface, a lower surface, and the probe card (electronic component) having a plurality of terminals on the upper surface: the upper surface, the lower surface and an intervention body (electronic component) which has the first plural contact structures with a restoring property extending from the terminals at the lower surface and the second plural contact structures with the restoring property extending from the terminals at the upper surface: the upper surface, the lower surface, an interval converter which has the plural contact pads (terminal) mounted at the lower surface and the third contact structures (probe element) with the restoring property extending from the terminals at the upper surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将探针施加到能够探测元件的边缘的取向的半导体元件的技术，而不改变探针卡的位置。解决方案：探针卡组件包括上表面，下表面和在上表面上具有多个端子的探针卡（电子部件）：上表面，下表面和干涉体（电子部件），其具有第一多个接触结构，具有从下表面的端子延伸的恢复特性和具有从上表面的端子延伸的恢复特性的第二多个接触结构：上表面，下表面，间隔转换器其具有安装在下表面的多个接触垫（端子）和具有从上表面的端子延伸的恢复特性的第三接触结构（探针元件）。版权所有（C）2007，JPO＆INPIT

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