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31. 发明申请

US20110156734A1 TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 有权
标题翻译：用于测试电子设备的测试系统和方法
公开(公告)号：US20110156734A1
公开(公告)日：2011-06-30
申请号：US12979159
申请日：2010-12-27
申请人： Tommie E. Berry , Keith J. Breinlinger , Eric D. Hobbs , Marc Loranger , Alexander H. Slocum , Adrian S. Wilson
发明人： Tommie E. Berry , Keith J. Breinlinger , Eric D. Hobbs , Marc Loranger , Alexander H. Slocum , Adrian S. Wilson
IPC分类号： G01R31/00
CPC分类号： G01R31/2891
摘要： Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.
摘要翻译：被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。机械联轴器将DUT的端子自动对准接触器的探头。探头因此与DUT的端子接触并进行电气连接。然后测试DUT。对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

32. 发明授权

US07960989B2 Mechanical decoupling of a probe card assembly to improve thermal response 有权
标题翻译：探针卡组件的机械去耦以改善热响应
公开(公告)号：US07960989B2
公开(公告)日：2011-06-14
申请号：US12478117
申请日：2009-06-04
申请人： Keith J. Breinlinger , Eric D. Hobbs
发明人： Keith J. Breinlinger , Eric D. Hobbs
IPC分类号： G01R31/20 , G01R31/02
CPC分类号： G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译：加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

33. 发明授权

US07956635B2 Stiffener assembly for use with testing devices 有权
标题翻译：用于测试装置的加强装置
公开(公告)号：US07956635B2
公开(公告)日：2011-06-07
申请号：US12345740
申请日：2008-12-30
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/20 , G01R31/02
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

34. 发明授权

US07851794B2 Rotating contact element and methods of fabrication 失效
标题翻译：旋转接触元件和制造方法
公开(公告)号：US07851794B2
公开(公告)日：2010-12-14
申请号：US11617394
申请日：2006-12-28
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： H01L21/00
CPC分类号： G01R1/06716 , G01R1/06733 , Y10T29/49128
摘要： Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
摘要翻译：本文提供旋转接触元件和制造方法。在一个实施例中，旋转接触元件包括尖端，其具有被配置为接触待测试装置和相对的第二侧的第一侧; 以及多个变形构件，其从所述尖端的第二侧延伸并围绕其中心轴线布置，其中当所述多个变形构件压缩时，所述尖端基本上围绕所述中心轴线旋转。

35. 发明申请

US20100134127A1 MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE 有权
标题翻译：探索卡组件机械装置改善热响应
公开(公告)号：US20100134127A1
公开(公告)日：2010-06-03
申请号：US12478117
申请日：2009-06-04
申请人： Keith J. Breinlinger , Eric D. Hobbs
发明人： Keith J. Breinlinger , Eric D. Hobbs
IPC分类号： G01R31/02
CPC分类号： G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译：加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

36. 发明授权

US07688063B2 Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies 有权
标题翻译：用于调节机电组件的热诱导运动的装置和方法
公开(公告)号：US07688063B2
公开(公告)日：2010-03-30
申请号：US12165325
申请日：2008-06-30
申请人： Andrew W. McFarland , Kevin Youl Yasumura , Eric D. Hobbs , Keith J. Breinlinger
发明人： Andrew W. McFarland , Kevin Youl Yasumura , Eric D. Hobbs , Keith J. Breinlinger
IPC分类号： G01R31/02
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译：一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

37. 发明申请

US20090108861A1 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 有权
标题翻译：强化装置与测试装置一起使用
公开(公告)号：US20090108861A1
公开(公告)日：2009-04-30
申请号：US12345740
申请日：2008-12-30
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

38. 发明授权

US07471078B2 Stiffener assembly for use with testing devices 失效
标题翻译：用于测试装置的加强装置
公开(公告)号：US07471078B2
公开(公告)日：2008-12-30
申请号：US11617929
申请日：2006-12-29
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/28 , G01R31/02
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

39. 发明申请

US20080186040A1 APPARATUS FOR TESTING DEVICES 有权
标题翻译：用于测试设备的设备
公开(公告)号：US20080186040A1
公开(公告)日：2008-08-07
申请号：US11864690
申请日：2007-09-28
申请人： Eric D. Hobbs , Andrew W. McFarland
发明人： Eric D. Hobbs , Andrew W. McFarland
IPC分类号： G01R31/26 , G01R1/02
CPC分类号： G01R31/2863 , G01R31/2889 , G01R31/31905
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
摘要翻译：本文提供了测试半导体器件的方法和装置。在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

40. 发明申请

US20080088010A1 ELECTRONIC DEVICE WITH INTEGRATED MICROMECHANICAL CONTACTS AND COOLING SYSTEM 失效
标题翻译：具有集成微机械接触和冷却系统的电子设备
公开(公告)号：US20080088010A1
公开(公告)日：2008-04-17
申请号：US11548668
申请日：2006-10-11
申请人： Eric D. Hobbs , Gaetan Mathieu
发明人： Eric D. Hobbs , Gaetan Mathieu
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , B81B7/0006 , B81B7/0093 , H01L23/473 , H01L2924/0002 , H01L2924/14 , H01L2924/19041 , H01L2924/00
摘要： An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.
摘要翻译：电子设备可以包括其上可以形成微机械系统的半导体管芯。微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。微机械系统还可以包括设置在半导体管芯上的冷却结构。

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