专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US07482826B2 Probe for scanning over a substrate and a data storage device 失效
标题翻译：用于扫描基板和数据存储设备的探头
公开(公告)号：US07482826B2
公开(公告)日：2009-01-27
申请号：US11332137
申请日：2006-01-13
申请人： Thomas Albrecht , Michel Despont , Urs T. Duerig , Mark Lantz , Hugo E. Rothuizen , Dorothea W. Wiesmann Rothuizen
发明人： Thomas Albrecht , Michel Despont , Urs T. Duerig , Mark Lantz , Hugo E. Rothuizen , Dorothea W. Wiesmann Rothuizen
IPC分类号： G01R31/02
CPC分类号： G01Q70/14 , G01Q80/00 , G11B9/1409 , G11B11/007
摘要： A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure.
摘要翻译：数据存储装置包括用于以标记形式存储数据的存储介质和用于扫描存储介质的至少一个探针。存储介质可以包含在基板中。探头包括悬臂，其包括用作电触点的端子，所述端子在机械地固定到探头保持结构的探头的操作期间，探头保持结构可以是数据存储装置的公共框架。探头还包括支撑结构，端子通过铰链机械地直接联接或耦合到该支撑结构，并且远离端子延伸。提供具有纳米级顶点的尖端。梁结构包括加热电阻器，并且在端部附接到支撑结构。与支撑结构邻接梁结构的区域相比，梁结构至少在平行于尖端的轴线的方向上变薄。

32. 发明申请

US20080013437A1 Probe for scanning over a substrate and a data storage device 失效
标题翻译：用于扫描基板和数据存储设备的探头
公开(公告)号：US20080013437A1
公开(公告)日：2008-01-17
申请号：US11332137
申请日：2006-01-13
申请人： Thomas Albrecht , Michel Despont , Urs Duerig , Mark Lantz , Hugo Rothuizen , Dorothea Wiesmann Rothuizen
发明人： Thomas Albrecht , Michel Despont , Urs Duerig , Mark Lantz , Hugo Rothuizen , Dorothea Wiesmann Rothuizen
IPC分类号： G11B3/00
CPC分类号： G01Q70/14 , G01Q80/00 , G11B9/1409 , G11B11/007
摘要： A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure.
摘要翻译：数据存储装置包括用于以标记形式存储数据的存储介质和用于扫描存储介质的至少一个探针。存储介质可以包含在基板中。探头包括悬臂，其包括用作电触点的端子，所述端子在机械地固定到探头保持结构的探头的操作期间，探头保持结构可以是数据存储装置的公共框架。探头还包括支撑结构，端子通过铰链机械地直接联接或耦合到该支撑结构，并且远离端子延伸。提供具有纳米级顶点的尖端。梁结构包括加热电阻器，并且在端部附接到支撑结构。与支撑结构邻接梁结构的区域相比，梁结构至少在平行于尖端的轴线的方向上变薄。

33. 发明申请

US20080011814A1 Method and System for Self-Aligning Parts in Mems 审中-公开
标题翻译：内存中自动对齐零件的方法和系统
公开(公告)号：US20080011814A1
公开(公告)日：2008-01-17
申请号：US10596349
申请日：2004-11-08
申请人： Stefano Oggioni , Thomas Albrecht , Michel Despont , Mark Lantz , Michele Castriotta
发明人： Stefano Oggioni , Thomas Albrecht , Michel Despont , Mark Lantz , Michele Castriotta
IPC分类号： B23K31/02 , B81B7/00
CPC分类号： B81C3/002 , H05K3/3436 , H05K2201/094 , H05K2201/09418 , H05K2201/2036 , H05K2203/048 , Y02P70/613
摘要： A method and system for efficiently self-aligning parts of a MEMS during manufacturing, as well as controlling distance between these parts, are disclosed. According to the invention each MEMS part comprises at least one pad that is aligned so as to form a pair of pads. In a preferred embodiment, each part comprises three pads. The pad shape of two pairs of pads is rectangular, one pair being rotated of an angle approximately equal to 90° from the other, and the pad shape of the third pair is annular. Therefore, one of the pair of pads allows alignment according to a first direction, a second pair of pads allows alignment according to a second direction, and the third pair of pads allows rotational alignment.
摘要翻译：公开了一种用于在制造期间有效地对准MEMS部件的方法和系统，以及控制这些部件之间的距离。根据本发明，每个MEMS部件包括至少一个对准以形成一对焊盘的焊盘。在优选实施例中，每个部分包括三个焊盘。两对焊盘的焊盘形状是矩形的，一对由另一对旋转大约等于90°的角度，第三对的焊盘形状是环形的。因此，一对衬垫之一允许根据第一方向进行对准，第二对衬垫允许根据第二方向对准，并且第三对衬垫允许旋转对准。

34. 发明申请

US20070125961A1 MICROMECHANICAL SYSTEM 审中-公开
标题翻译：微生物系统
公开(公告)号：US20070125961A1
公开(公告)日：2007-06-07
申请号：US11560830
申请日：2006-11-16
申请人： Michel Despont
发明人： Michel Despont
IPC分类号： G21G5/00
CPC分类号： G01Q70/16 , G01Q70/02
摘要： A micromechanical system including a micromechanical structure and a shadow mask device. The micromechanical structure and the shadow mask device are produced from a single wafer. The micromechanical structure includes a covering surface to be acted upon in a covering area. The covering surface is produced in the course of covering surface processing steps. The shadow mask device is provided for shading part of the micromechanical structure from a deposition or treatment beam. It has at least one geometry, which affects a shading area in respect to the covering surface and which is produced in the course of geometry processing steps. The covering surface and geometry processing steps are applied from one side of the wafer.
摘要翻译：一种包括微机械结构和荫罩装置的微机械系统。微机械结构和荫罩装置由单个晶片制成。微机械结构包括要覆盖在覆盖区域中的覆盖表面。在覆盖表面处理步骤的过程中产生覆盖表面。阴影掩模装置用于从沉积或处理光束遮蔽微机械结构的一部分。它具有至少一个几何形状，其影响相对于覆盖表面的遮蔽区域并且在几何处理步骤的过程中产生。覆盖表面和几何形状处理步骤从晶片的一侧施加。

35. 发明授权

US06388252B1 Self-detecting type of SPM probe and SPM device 有权
标题翻译：自检型SPM探头和SPM装置
公开(公告)号：US06388252B1
公开(公告)日：2002-05-14
申请号：US09197584
申请日：1998-11-19
申请人： Hiroshi Takahashi , Yoshiharu Shirakawabe , Nobuhiro Shimizu , Michel Despont
发明人： Hiroshi Takahashi , Yoshiharu Shirakawabe , Nobuhiro Shimizu , Michel Despont
IPC分类号： G01N2300
CPC分类号： G01Q60/38 , G01Q20/04 , G01Q70/06 , Y10S977/873
摘要： A self-detecting type of SPM probe can eliminate influences of a leak current between piezo-resistors each other, between another piezo-resistors opposite to each other, or between the piezo-resistor and the other one, or of a carrier generated by irradiation of light thereto over the piezo-resistors by forming impurity diffusion layers each consisting of a conductive type (n− well regions) reverse to a conductive type of a semiconductor substrate (p-type silicon substrate) on each interface between each of the piezo-resistors and the semiconductor substrate respectively to insulate the elements from one another.
摘要翻译： SPM探头的自检型可以消除压电电阻之间，彼此相对的另一个压电电阻之间或压敏电阻与另一压电电阻之间的泄漏电流的影响，或消除由辐射产生的载体通过在每个压电元件之间的每个界面上形成杂质扩散层，每个杂质扩散层由与导电类型的半导体衬底（p型硅衬底）的导电类型相反的导电类型（n-阱区）构成，电阻器和半导体衬底，以使元件彼此绝缘。

36. 发明授权

US06218086B1 Method of forming ultrasmall structures and apparatus therefor 有权
标题翻译：形成超小型结构的方法及其设备
公开(公告)号：US06218086B1
公开(公告)日：2001-04-17
申请号：US09147865
申请日：1999-03-17
申请人： Gerd K. Binnig , Michel Despont , Walter Haeberle , Peter Vettiger
发明人： Gerd K. Binnig , Michel Despont , Walter Haeberle , Peter Vettiger
IPC分类号： G03F700
CPC分类号： G03F7/0002 , G01Q70/10 , G01Q80/00 , G11B9/14 , G11B11/007 , Y10S977/856 , Y10S977/878
摘要： The present invention discloses a method of forming ultrasmall (nano) structures in a thin film provided on a substrate by means of a tip which is movable relative to the surface of the thin film. According to principles of the invention, the penetration depth of the tip is limited, thereby avoiding wear of the tip. Furthermore, an apparatus for carrying out the method is disclosed.
摘要翻译：本发明公开了一种通过能够相对于薄膜表面移动的尖端在基片上形成超薄（nano）结构的方法。根据本发明的原理，尖端的穿透深度受到限制，从而避免了尖端的磨损。此外，公开了一种用于执行该方法的装置。

37. 发明授权

US06211540B1 Semiconductor strain sensor and scanning probe microscope using the semiconductor strain sensor 有权
标题翻译：半导体应变传感器和扫描探针显微镜使用半导体应变传感器
公开(公告)号：US06211540B1
公开(公告)日：2001-04-03
申请号：US09173035
申请日：1998-10-15
申请人： Hiroshi Takahashi , Nobuhiro Shimizu , Yoshiharu Shirakawabe , Susumu Ichihara , Michel Despont
发明人： Hiroshi Takahashi , Nobuhiro Shimizu , Yoshiharu Shirakawabe , Susumu Ichihara , Michel Despont
IPC分类号： H01L2982
CPC分类号： G01Q20/04 , G01Q70/16 , Y10S977/873
摘要： A semiconductor strain sensor comprises a semiconductor cantilever probe having a free end and a surface portion for undergoing deformation due to a displacement of the free end. A Schottky junction is disposed on the surface portion of the semiconductor cantilever probe and is positioned to undergo a change in electrical characteristic in response to the deformation of the surface portion. The amount of displacement of the free end of the cantilever probe is detected on the basis of a change in the electrical characteristic of the Schottky junction.
摘要翻译：半导体应变传感器包括具有自由端的半导体悬臂探针和由于自由端位移而发生变形的表面部分。肖特基结设置在半导体悬臂探针的表面部分上并且被定位成响应于表面部分的变形而经历电特性的变化。基于肖特基结的电特性的变化来检测悬臂探头的自由端的位移量。

38. 发明授权

US09029719B2 Integrated electro-mechanical actuator 有权
标题翻译：集成机电执行器
公开(公告)号：US09029719B2
公开(公告)日：2015-05-12
申请号：US13638275
申请日：2011-03-29
申请人： Michel Despont
发明人： Michel Despont
IPC分类号： H01H13/702 , H01H49/00 , H01H59/00
CPC分类号： H01H49/00 , H01H59/00 , H01H59/0009
摘要： The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.
摘要翻译：本发明提供了一种集成的机电致动器和用于制造这种集成的机电致动器的制造方法。集成的机电致动器包括致动器电极之间的静电致动器间隙和接触电极之间的电接触间隙。在致动器电极和接触电极之间设置有倾斜角度的倾斜。该电接触间隙的厚度等于在制造过程中被蚀刻掉的牺牲层的厚度。

39. 发明申请

US20130082345A1 Hybrid FPA for Thz imaging with an antenna array, coupled to CMOS-MEMS thermal sensors, implementing per-pixel ES actuation and enabling tuning, correlated double sampling and AM modulation 有权
标题翻译：混合FPA用于具有天线阵列的Thz成像，耦合到CMOS-MEMS热传感器，实现每像素ES致动和实现调谐，相关双采样和AM调制
公开(公告)号：US20130082345A1
公开(公告)日：2013-04-04
申请号：US13251255
申请日：2011-10-02
申请人： Dan Corcos , Michel Despont , Danny Elad , Lukas Kull , Thomas Morf , Benny Sheinman
发明人： Dan Corcos , Michel Despont , Danny Elad , Lukas Kull , Thomas Morf , Benny Sheinman
IPC分类号： H01L27/144
CPC分类号： G01N21/3581 , B81B3/0081 , G01J3/42 , G01J5/0837 , G01J2005/0077 , H01L31/09
摘要： A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor that couples energy from the antenna to the thermal sensor. The capacitor plates used for capacitive coupling of the received signal realize an electro-static actuator whereby the application of a DC bias varies the coupling capacitor gap. The DC bias causes the actuator to pull the suspended platform close to the antenna to reduce the capacitive gap, increasing the coupling capacitance, to touch the antenna array thus quickly discharging the heat induced in the sensor platform or to perform advanced readout operations, such as amplitude modulation and correlated double sampling.
摘要翻译：一种太赫兹辐射检测器，包括通过隔离热空气间隙与悬浮平台分离的垂直天线，用于将太赫兹辐射能量集中到位于热传感器元件的较小悬置MEMS平台上。太赫兹光子能量通过将能量从天线耦合到热传感器的耦合电容器的板之间的隔热气隙转换成电能。用于接收信号的电容耦合的电容器板实现静电致动器，由此施加直流偏压改变耦合电容器间隙。 DC偏置使致动器将悬挂平台拉近靠近天线，以减小电容间隙，增加耦合电容，以便触摸天线阵列，从而快速放出传感器平台中感应的热或执行高级读出操作，例如幅度调制和相关双重采样。

40. 发明申请

US20130082181A1 NANO-TIP SPACERS FOR PRECISE GAP CONTROL AND THERMAL ISOLATION IN MEMS STRUCTURES 有权
标题翻译：用于精密差分控制和MEMS结构中的热隔离的纳米尖头间隔
公开(公告)号：US20130082181A1
公开(公告)日：2013-04-04
申请号：US13525397
申请日：2012-06-18
申请人： Dan Corcos , Michel Despont , Danny Elad , Bernd Gotsmann , Lukas Kull , Thomas E. Morf
发明人： Dan Corcos , Michel Despont , Danny Elad , Bernd Gotsmann , Lukas Kull , Thomas E. Morf
IPC分类号： G01J5/34
CPC分类号： G01J5/34 , B81B3/0081 , G01J5/0235 , G01J5/024 , G01J5/0837 , G01J5/22
摘要： A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor separated by a plurality of nano-tip spacers that determine the gap distance. The capacitor couples energy from the antenna to the thermal sensor.
摘要翻译：一种太赫兹辐射检测器，包括通过隔离热空气间隙与悬浮平台分离的垂直天线，用于将太赫兹辐射能量集中到位于热传感器元件的较小悬置MEMS平台上。太赫兹光子能量通过由多个确定间隙距离的多个纳米尖端间隔物隔开的耦合电容器的板之间的隔热气隙转换成电能。电容器将能量从天线耦合到热传感器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式