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    • 5. 发明授权
    • High-speed scanning probe microscope
    • 高速扫描探针显微镜
    • US08327461B2
    • 2012-12-04
    • US13146355
    • 2010-01-15
    • Harish BhaskaranMichel DespontAbu Sebastian
    • Harish BhaskaranMichel DespontAbu Sebastian
    • G01Q60/14G01N13/16G01N13/10
    • G01Q60/16
    • The invention is directed to a probe for scanning probe microscopy. The probe 20 comprises a tunnel-current conducting part 30 and a tunnel-current insulating part 40. The said parts are configured such that the insulating part determines a minimal distance between the conducting part 30 and the sample surface. The invention may further concern a scanning probe microscope having such a probe, and a corresponding scanning probe microscopy method. Since the distance to the sample surface 100 is actually determined by the insulating part 40, controlling the vertical position of the probe 20 relative to the sample surface is easily and rapidly achieved. The configuration of the parts allows for a fast scan of the sample surface, whereby high-speed imaging can be achieved. Further, embodiments allow for topographical variations to be accurately captured through tunneling effect.
    • 本发明涉及用于扫描探针显微镜的探针。 探针20包括隧道电流传导部分30和隧道电流绝缘部分40.所述部分被构造成使得绝缘部分确定导电部分30和样品表面之间的最小距离。 本发明还可以涉及具有这种探针的扫描探针显微镜和相应的扫描探针显微镜方法。 由于到达样品表面100的距离实际上由绝缘部件40确定,因此容易且快速地实现了探针20相对于样品表面的垂直位置的控制。 部件的构造允许对样品表面进行快速扫描,由此可以实现高速成像。 此外,实施例允许通过隧道效应准确地捕获地形变化。
    • 8. 发明授权
    • Data storage device
    • 数据存储设备
    • US07848213B2
    • 2010-12-07
    • US12185530
    • 2008-08-04
    • Peter BaechtoldJohannes G. BednorzGerd K. BinnigGiovanni CherubiniEvangelos S. EleftheriouMichel Despont
    • Peter BaechtoldJohannes G. BednorzGerd K. BinnigGiovanni CherubiniEvangelos S. EleftheriouMichel Despont
    • G11B9/00
    • G11B11/007B82Y10/00G11B9/1472
    • A storage device including a storage medium for storing data in the form of topographic or magnetic marks. At least one probe is mounted on a common frame, the common frame and the storage medium designed for moving relative to each other for creating or detecting said marks. Each probe includes a tip facing the storage medium, a read sensing element, a write element and a capacitive platform, that forms a first electrode and is designed for a voltage potential applied to it independent from a control signal for said read sensing element and for said voltage potential applied to said capacitive platform being independent from a control signal for said write heating element. It further comprises a second electrode arranged in a fixed position relative to the storage medium forming a first capacitor together wherein said first electrode and a medium between the first and second electrode.
    • 一种存储装置,包括用于以地形或磁标记的形式存储数据的存储介质。 至少一个探针安装在公共框架上,公共框架和存储介质被设计用于相对于彼此移动以创建或检测所述标记。 每个探针包括面向存储介质的尖端,读取感测元件,写入元件和电容平台,其形成第一电极,并被设计用于独立于用于所述读取感测元件的控制信号的施加于其的电压电位,并且为 施加到所述电容平台的所述电压电位独立于用于所述写入加热元件的控制信号。 它还包括布置在相对于存储介质固定位置的第二电极,形成第一电容器,其中所述第一电极和第一和第二电极之间的介质。
    • 10. 发明授权
    • Method of forming a three-dimensional stacked optical device
    • 形成三维堆叠光学器件的方法
    • US07480426B1
    • 2009-01-20
    • US12054754
    • 2008-03-25
    • Laurent DellmannMichel DespontBert J. Offrein
    • Laurent DellmannMichel DespontBert J. Offrein
    • G02B6/12
    • H01L25/167H01L23/481H01L2924/0002H01L2924/00
    • A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.
    • 一种形成三维层叠光学器件的方法包括:将至少一个光学器件安装到透明衬底上,通过所述至少一个光学器件制造多个通孔,以及用导电材料部件填充多个通孔,所述导电材料部件形成 在所述至少一个光学装置上的多个背面触点。 该方法还需要将电子芯片安装到至少一个光学器件上的多个背面触点中,在电子芯片中制造多个通孔,用另一个导电材料构件填充电子芯片中的多个通孔中的每一个, 以及在形成在电子芯片中的多个通孔中的每一个上沉积背面接触。 每个背面接触件电连接到位于形成在电子芯片中的多个通孔中的相应一个通孔中的另一个导电材料构件的相应的一个。