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    • 32. 发明授权
    • Microphone structure
    • 麦克风结构
    • US09258652B2
    • 2016-02-09
    • US14245558
    • 2014-04-04
    • Chuan-Wei Wang
    • Chuan-Wei Wang
    • H04R19/00H04R19/04H04R31/00
    • H04R19/005H04R19/04H04R31/00
    • A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a opening to expose a part of the conduction layer as a vibration block arranged over the opening chamber. At least two first patterned electrodes are arranged on the insulation layer and arranged over the vibration block. At least two second patterned electrodes are arranged over the opening chamber, arranged on the vibration block and separated from the first patterned electrodes by at least two first gaps. When the vibration block vibrates, the vibration block moves the second patterned electrodes whereby the second patterned electrodes and the first patterned electrodes perform differential sensing.
    • 公开了麦克风结构。 麦克风结构包括穿透至少一个开口腔并具有绝缘表面的基底。 导电层布置在绝缘表面上并且布置在开口室之上。 绝缘层布置在导电层上,并具有用于将导电层的一部分暴露为布置在开口室上方的振动块的开口。 至少两个第一图案化电极布置在绝缘层上并且布置在振动块上。 至少两个第二图案化电极布置在开口室上方,布置在振动块上,并与第一图案化电极分开至少两个第一间隙。 当振动块振动时,振动块移动第二图案化电极,由此第二图案化电极和第一图案化电极执行差分感测。
    • 33. 发明申请
    • MEMS Sensing Device and Method for the Same
    • MEMS感应装置及其方法
    • US20130334623A1
    • 2013-12-19
    • US13948128
    • 2013-07-22
    • Chuan-Wei WangMing-Han Tsai
    • Chuan-Wei WangMing-Han Tsai
    • B81B3/00
    • B81B3/0021B81C1/00333B81C2203/0118B81C2203/0735G01L9/0073
    • The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.
    • 本发明公开了一种MEMS感测装置,其包括衬底,MEMS器件区域,膜,粘合剂层,盖,至少一个开口和多个引线。 衬底具有与第一表面相对的第一表面和第二表面。 MEMS器件区域在第一表面上,并且包括腔室。 膜被覆盖在MEMS器件区域上,以密封腔室作为密封空间。 盖安装在MEMS器件区域上,并通过粘合剂层粘合。 开口在盖子或粘合剂层上,允许装置外的空气的压力对膜施加压力。 引线电连接到MEMS器件区域,并延伸到第二表面。
    • 37. 发明申请
    • MEMS sensing device and method for making same
    • MEMS感测装置及其制造方法
    • US20120248555A1
    • 2012-10-04
    • US13134262
    • 2011-06-03
    • Chuan-Wei WangMing-Han Tsai
    • Chuan-Wei WangMing-Han Tsai
    • H01L29/84H01L21/02
    • B81B3/0021B81C1/00333B81C2203/0118B81C2203/0735G01L9/0073
    • The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.
    • 本发明公开了一种MEMS感测装置,其包括衬底,MEMS器件区域,膜,粘合剂层,盖,至少一个开口和多个引线。 衬底具有与第一表面相对的第一表面和第二表面。 MEMS器件区域在第一表面上,并且包括腔室。 膜被覆盖在MEMS器件区域上,以密封腔室作为密封空间。 盖安装在MEMS器件区域上,并通过粘合剂层粘合。 开口在盖子或粘合剂层上,允许装置外的空气的压力对膜施加压力。 引线电连接到MEMS器件区域,并延伸到第二表面。
    • 39. 发明授权
    • MEMS sensing device and method for the same
    • MEMS感测装置及其方法相同
    • US08772885B2
    • 2014-07-08
    • US13948128
    • 2013-07-22
    • Chuan-Wei WangMing-Han Tsai
    • Chuan-Wei WangMing-Han Tsai
    • H01L29/84
    • B81B3/0021B81C1/00333B81C2203/0118B81C2203/0735G01L9/0073
    • The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.
    • 本发明公开了一种MEMS感测装置,其包括衬底,MEMS器件区域,膜,粘合剂层,盖,至少一个开口和多个引线。 衬底具有与第一表面相对的第一表面和第二表面。 MEMS器件区域在第一表面上,并且包括腔室。 膜被覆盖在MEMS器件区域上,以密封腔室作为密封空间。 盖安装在MEMS器件区域上,并通过粘合剂层粘合。 开口在盖子或粘合剂层上,允许装置外的空气的压力对膜施加压力。 引线电连接到MEMS器件区域,并延伸到第二表面。